Hui-Chi
Hui-Chi Huang, Tungluo Shiang TW
Patent application number | Description | Published |
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20110215011 | RETAINING STRUCTURE, DISK RETAINING STRUCTURE AND DISK STORAGE STRUCTURE WITH DOUBLE-FACE CARRIER FUNCTION - A retaining structure with double-face carrier function includes a carrier unit, an elastic unit and a retaining unit. The carrier unit has a carrier body and a through hole passing through the carrier body. The elastic unit has a plurality of elastic arms extended from an inner surface of the through hole. The retaining unit has a plurality of retaining elements passing through the through hole. Each retaining element has a retaining portion connected to at least two of the elastic arms and extended above and under the through hole, a pressing portion extended inwards from one end of the retaining portion and at least one protrusion portion disposed on an outer surface of the retaining portion and adjacent to the pressing portion. The pressing portions above the through hole are arranged alternately and the pressing portions under the through hole are arranged alternately. | 09-08-2011 |
Hui-Chi Huang, Taipei TW
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20120231555 | ADAPTIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING - The present disclosure provides a semiconductor manufacturing method. The method includes defining a plurality of time regions of pad life for a polishing pad in a chemical mechanical polishing (CMP) system; assigning a ladder coefficient to the polishing pad according to the plurality of time regions of pad life; defining a plurality of endpoint windows to the plurality of time regions, respectively, according to pad life effect; applying a CMP process to a wafer positioned on the polishing pad; determining a time region of a polishing signal of the wafer based on the ladder coefficient; associating one of the endpoint windows to the polishing signal according to the time region; and ending the CMP process at an endpoint determined by the endpoint window. | 09-13-2012 |
20130146224 | ADAPATIVE ENDPOINT METHOD FOR PAD LIFE EFFECT ON CHEMICAL MECHANICAL POLISHING - The present disclosure provides a chemical mechanical polishing (CMP) system. The CMP system includes a pad designed for wafer polishing, a motor driver coupled with the pad and designed to drive the pad during the wafer polishing, and a controller coupled with the motor driver and designed to control the motor driver. The CMP system further includes an in-situ rate monitor designed to collect polishing data from a wafer on the pad, determine CMP endpoint based on a life stage of the pad, and provide the CMP endpoint to the controller. | 06-13-2013 |
20130200461 | Semiconductor Device and Method of Forming the Same - A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a semiconductor substrate including a first device disposed in a first device region, the first device including a first gate structure, first gate spacers formed on the sidewalls of the first gate structure, and first source and drain features and a second device disposed in a second device region, the second device including a second gate structure, second gate spacers formed on the sidewalls of the second gate structure, and second source and drain features. The semiconductor device further includes a contact etch stop layer (CESL) disposed on the first and second gate spacers and interconnect structures disposed on the first and second source and drain features. The interconnect structures are in electrical contact with the first and second source and drain features and in contact with the CESL. | 08-08-2013 |
Hui-Chi Huang, Hsinchu County TW
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20150140691 | SYSTEMS AND METHODS FOR CHEMICAL MECHANICAL PLANARIZATION WITH FLUORESCENCE DETECTION - Systems and methods are provided for performing chemical-mechanical planarization on an article. An example system for performing chemical-mechanical planarization on an article includes a polishing head configured to perform a chemical-mechanical planarization (CMP) on an article, a polishing pad configured to support the article, a light source configured to emit an incident light, a polishing fluid including a plurality of emitter particles capable of emitting a fluorescent light in response to the incident light, a fluorescence light detector configured to detect the fluorescent light, and at least one processor configured to control the polishing head based on the detected fluorescent light. | 05-21-2015 |
Hui-Chi Ku, Kaohsiung City TW
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20150098873 | TEST CASSETTE - A test cassette applicable to an optical reading device capable of reading identification codes includes a test sheet with a supporting layer and a reactive reagent layer; a case for retaining the test sheet; and an identification code situated on a surface of the case for recording a test item and a test standard value of the test cassette. | 04-09-2015 |
20150099306 | TEST CASSETTE READING DEVICE AND READING METHOD THEREOF - A reading device for reading and analyzing a test cassette having an identification code includes a reading unit, used for reading the identification code marked by the test cassette and carrying out interpretation on a plurality of test lines of the test cassette; an operating unit, used for operating the reading device; a processing unit, used for interpreting a test result with the identification code and the test lines; and a display unit, used for displaying the test result of the test cassette. | 04-09-2015 |