Huai-Te
Huai-Te Chen, Taoyuan County TW
Patent application number | Description | Published |
---|---|---|
20100285636 | MANUFACTURING METHOD OF A PACKAGING STRUCTURE OF ELECTRONIC COMPONENTS - A manufacturing method of a packaging structure of electronic components includes the steps of: providing a substrate including a plurality of electronic components; covering the electronic components disposed on the substrate with a molding body; forming a plurality of pre-cut grooves on the molding body so as to define a plurality of molding units on the molding body; forming an electromagnet barrier layer covering the molding units on the molding units and the pre-cut grooves; and cutting along at least one of the pre-cut grooves deeply down to break the substrate so as to form separately a plurality of packaging structures of the electronic components. | 11-11-2010 |
Huai-Te Huang, Hsinchu City TW
Patent application number | Description | Published |
---|---|---|
20150200120 | SYSTEMS AND METHOD FOR TRANSFERRING A SEMICONDUCTOR SUBSTRATE - In accordance with some embodiments, systems and methods for processing a semiconductor substrate are provided. The method includes loading a semiconductor substrate from a chamber to a transfer module, detecting a center and a notch of the semiconductor substrate by the transfer module, and transferring the semiconductor substrate from the transfer module to a process chamber. | 07-16-2015 |
Huai-Te Wang, Bade City TW
Patent application number | Description | Published |
---|---|---|
20140266298 | TERMINATION CIRCUITS CAPABLE OF RECEIVING DATA SIGNALS IN DIFFERENT FORMATS FOR PERFORMING IMPEDANCE MATCHING - A termination circuit is provided. The termination circuit includes a first receiving terminal, a second receiving terminal, a first resistive device, a second resistive device, a third resistive device, a fourth resistive device and a first switch. The first receiving terminal receives a first data signal. The second receiving terminal receives a second data signal. The first resistive device is coupled between a supply voltage and the first receiving terminal. The second resistive device is coupled between the supply voltage and the second receiving terminal. The third resistive device is coupled between the first receiving terminal and a first node. The fourth resistive device is coupled between the second receiving terminal and the first node. The first switch is coupled between the supply voltage and the first node. | 09-18-2014 |