Hsin, TW
Cheng-Lun Hsin, Jhongli City TW
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20150357548 | METHOD FOR FORMING A THERMOELECTRIC FILM HAVING A MICRO GROOVE - A method for forming a thermoelectric film having a micro groove includes the following steps: A) forming a plurality of parallel sacrificing wires by electrospinning, a diameter of each sacrificing wire being 100-500 nm; B) coating a thermoelectric film having a thickness of 80-200 nm on a part of a surface of each sacrificing wire; and C) removing the sacrificing wires from the thermoelectric films and thus obtaining the thermoelectric films each having the micro groove, a radio side of each thermoelectric film being open to the surroundings. The thermoelectric films finally prepared can have higher size uniformity without the disadvantage of catalyst residual. Further, the thermoelectric films each have a size smaller than the mean free path of phonons in one dimension, and thus the thermoelectric properties of the thermoelectric films can be improved. | 12-10-2015 |
Chen-Wei Hsin, Changhua City TW
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20090208876 | Long-length fiber Bragg creating sequential UV writing by probing phase mask - A new fiber position monitoring method for sequential FBG UV-writing processes with a reference phase mask as the phase reference is proposed. Also, the new method by probing a reference phase mask can overcome the optical alignment difficulties in using reference fiber as well as provide more signal power for achieving better monitoring accuracy. Moreover, the present invention provides a method for sequentially joining a plurality of grating sections into a fiber grating longer than a phase mask. | 08-20-2009 |
Chia-Fen Hsin, New Taipei City TW
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20110227118 | Light Emitting Diode Package Structure and Manufacturing Method Thereof - A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound. | 09-22-2011 |
20130249387 | LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKING - A light-emitting diode (LED) element including an LED chip having a light emitting surface and at least one pad. A phosphor layer is formed on the light emitting surface and exposes the at least one pad. The phosphor layer includes a plurality of phosphor particles and a matrix. At least some of the phosphor particles have a first portion embedded in the matrix and a second portion protruding from an outer surface of the matrix. A method of forming a gel layer on an LED element includes using capillary action to draw the glue material into a space adjacent the upper surface of the chip. | 09-26-2013 |
Chia-Fen Hsin, Taipei TW
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20100225230 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a light emitting diode package structure is disclosed. First, a carrier and an LED chip are provided, wherein the LED chip is disposed on the carrier. Next, a first molding compound is provided on the LED chip, wherein the first molding compound is mixed up with a fluorescent material. Then, a first baking process to make the first molding compound in semi-cured state is performed. After that, a second molding compound is provided on the first molding compound. | 09-09-2010 |
Chia-Hung Hsin, Hsinchu City TW
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20120284497 | BOOTING METHOD OF MAIN CHIP - A booting method of a main chip includes the following steps. The main chip searches a current block of a NAND Flash for reading a boot table from a current page of the current block and verifying a boot header of the boot table. When the boot header passes the verification, the main chip checks whether ID of the boot table and ID of the NAND Flash are the same. When the IDs of the boot table and the NAND Flash are the same, the main chip reads a next page of the current block and checks whether data stored in the current page and in the next page is the same. When the data stored in the current page and in the next page is the same, the main chip reads configuration information of the boot table to initialize the NAND Flash and boots. | 11-08-2012 |
Chien-Jung Hsin, Hsinchu TW
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20080222595 | METHOD OF ENGINEERING CHANGE TO SEMICONDUCTOR CIRCUIT EXECUTABLE IN COMPUTER SYSTEM - A method of engineering change to a semiconductor circuit includes: performing a first synthesis with optimization of a first HDL code to generate a first circuit; performing a first physical design of the first circuit to generate a post layout circuit; modifying the first HDL code to generate a second HDL code, and performing a second synthesis with optimization of the first and second HDL codes while forcibly preserving elements to generate a second circuit and a third circuit, respectively; performing an ECO cone-pair extraction operation of the second and third circuit to generate at least one ECO cone-pair; and obtaining an ECO logic and an element to be replaced according to the ECO cone-pair and the post layout circuit, and then replacing the element to be replaced in the post layout circuit with the ECO logic gate circuit, thereby modifying the post layout circuit into a post layout ECO circuit. | 09-11-2008 |
Chien-Wei Hsin, Kaohsiung City TW
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20130203370 | WIRELESS COMMUNICATION RECEIVER AND METHOD THEREOF - A wireless communication receiver includes a circuit, an analog-to-digital converter (ADC) and a processing circuit. The circuit receives a wireless signal and outputs an analog signal according to a gain index. The ADC converts the analog signal to a digital signal. The processing circuit adjusts the gain index according to a clipping number of the ADC. | 08-08-2013 |
20130308731 | WIRELESS LAN COMMUNICATION DEVICE, RELEVANT SIGNAL PROCESSING CIRCUIT, AND METHOD THEREOF - A wireless LAN communication device includes an amplifying circuit, an interference detection circuit, a false alarm counting circuit, and a control circuit. The amplifying circuit is configured to operably provide a gain to wireless signals. The interference detection circuit is configured to operably detect adjacent channel interference signals to generate a detection result. The false alarm counting circuit is configured to operably calculate a number of false alarms incurred by the adjacent channel interference signals. The control circuit is configured to operably configure the gain of the amplifying circuit according to the detection result and the number of false alarms. | 11-21-2013 |
20130316660 | WIRELESS APPARATUS AND INTERFERENCE DETERMINATION METHOD THEREOF - A wireless apparatus and an interference determination method thereof are provided. The wireless apparatus determines that the wireless apparatus operates in a first bandwidth mode, and counts a first clear channel assessment (CCA) number associated with a primary channel, a second CCA number associated with a secondary channel, an entire CCA number associated with either the primary channel or the secondary channel, and the false alarm number according to at least one received radio frequency (RF) signal. Afterwards, the wireless apparatus determines that the second CCA number exceeds the summation of the first CCA number and bias number to determine that it is in an interference state, and determines that the interference state belongs to either the first interference type or second interference type according to the radio of the entire CCA number to the FA number. | 11-28-2013 |
20140169195 | Wireless transmission rate adjustment method - The present invention discloses a wireless transmission rate adjustment method for adjusting the wireless transmission rate of a wireless transmission device. The method comprises: having the wireless transmission device enter a try state from a normal state; under the try state, transmitting a plurality of test packets according to a first modulation and coding scheme (MCS) and determining whether the transmission is successful in accordance with a predetermined condition; if the transmission is successful with the first MCS, returning to the normal state and transmitting data with the first MCS; if the transmission is unsuccessful with the first MCS, staying in the try state and transmitting a plurality of test packets according to a second MCS, and then determining whether the transmission is successful in accordance with the predetermined condition; if the transmission is successful with the second MCS, returning to the normal state and transmitting data with the second MCS; and if the transmission is failed with the second MCS, returning to the normal state and transmitting data at an original transmission rate or with the first MCS. | 06-19-2014 |
20150180562 | BEAMFORMER AND WIRELESS COMMUNICATION METHOD THEREOF FOR IMPROVING COMMUNICATION QUALITY - A wireless communication method applied to a beamformer includes: receiving a plurality of reference information corresponding to a plurality of stations, respectively; calculating an evaluation value for each of the stations according to at least one reference information of the plurality of reference information; and comparing a plurality of evaluation values respectively corresponding to the plurality of stations, to select specific stations from the plurality of stations for performing beamforming. | 06-25-2015 |
20150189520 | ANTENNA DIVERSITY AND BEAMFORMING COEXISTENCE METHOD AND MACHINE READABLE MEDIA - An antenna diversity and beamforming coexistence method applied to a wireless communication device which supports both a transmitter/receiver (TX/RX) antenna diversity mechanism and a beamformer/beamformee mechanism includes the following steps: determining whether a plurality of wireless link partners linked to the wireless communication device respectively support the beamformer/beamformee mechanism and generating a determination result accordingly; and determining whether to enable/disable the TX/RX antenna diversity mechanism of the wireless communication device and to enable/disable the beamformer/beamformee mechanism of the wireless communication device according to the determination result; wherein when the beamformee mechanism is determined to be disabled, controlling the wireless communication device to transmit a default value in response to a received beamforming protocol packet. | 07-02-2015 |
Ching-Ya Hsin, New Taipei City TW
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20120065942 | METHOD OF AN ALL-SPEED PROPELER - A design method of an all-speed propeller includes five steps; a first step (A) of creating a basic shape of an all-speed propeller, a second step (B) of optimization of circulation distribution, a third step (C) of adjusting the shape of the all-speed propeller, a fourth step (D) of analysis of thrust and torsion and fifth step (E) of finishing the design of the all-speed propeller. With parameters of a design request repeatedly processed by a lifting line program, a lifting surface program and a boundary element program in the steps mentioned previously, the all-speed propeller can lower cavitation effect caused by different speeds on the capacity of the propeller, so as to enable efficiency kept rather high without sharply lowering while navigating in diverse speeds. | 03-15-2012 |
20130149167 | MARINE PROPELLER APPLICABLE TO ALL SPEED RANGES - An all speed range propeller includes a propeller hub and plural propeller blades having their shafts symmetrically connected with the propeller hub. Each propeller blade is divided into a first region and a second region from the propeller hub to an outer end. The first region and the second region are different in wing structure, and the wing cross-sectional area of the second region is smaller than that of the first region. Thus, in speed ranges that common ships navigate most frequently, the all speed range propeller of this invention can lower the influence of cavitation produced because of different speed ranges, able to maintain high efficiency in use and prevent the efficiency of the propeller from lowered exceedingly. | 06-13-2013 |
Ching-Yeh Hsin, Tamshui TW
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20110059663 | ADVANCED FOIL DESIGN METHOD AND STRUCTURE FOR MULTI SPEEDS - Advanced foil design method and structure for multi speeds mainly adds a constraint according to a needed pressure distribution of the advanced foil after building an advanced foil environment. Thence, a step of optimization could be applied for analyzing the advanced foil by flow characteristics to achieve a shaped profile, so that a weight calculation weighted calculation would be further operated base on a proportion of the advanced coil applied to multi speeds. Accordingly, a preferable profile of the advanced foil and the environment parameter combination can be obtained to enhance a higher operative efficiency with the preferred benefit of the Supercavitating propeller while applied to a higher speed and with the profit of a stable competence while applied to a lower speed. | 03-10-2011 |
Chiung-Wen Hsin, Hsinchu TW
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20120083138 | Electronic Device - An electronic device is provided. The electronic device includes a substrate and a joint. The substrate includes a first surface and a second surface, wherein a substrate signal contact, two ground contacts and two positioning openings are formed on the substrate, and the positioning openings are respectively formed on the ground contact and pass through the substrate. The joint includes a connection port, a joint signal contact and two ground structure, wherein the connection port is electrically connected to the joint signal contact, the joint signal contact is connected to the substrate signal contact, and the joint signal contact is located between the two ground structures, and the ground structures are respectively inserted into the positioning openings to be electrically connected to the ground contacts. | 04-05-2012 |
20140023125 | Signal Transceiver and Adaptive Impedance Switch Circuit - A signal transceiver includes a connector for receiving a signal, a band-pass filter coupled to the connector for filtering the signal, a front-end module for demodulating the signal and an adaptive impedance switch circuit coupled between the band-pass filter and the front-end module for switching an impedance value between the band-pass filter and the front-end module. | 01-23-2014 |
20140314131 | Signal Transceiver with Enhanced Return Loss in Power-off State - A signal transceiver with enhanced return loss in a power-off state includes a connector, a band-pass filter, a front-end module and an impedance transformation circuit. The impedance transformation circuit is coupled between the band-pass filter and the front-end module for transforming an input impedance of the signal transceiver, and includes an input terminal coupled to the band-pass filter for receiving a signal; an output terminal coupled to the front-end module for outputting the signal to the front-end module; an impedance transforming unit; and a power source input circuit coupled to the impedance transforming unit for providing a power source; wherein the impedance transforming unit is coupled between the power source input circuit and the input terminal, for transforming the input impedance of the signal transceiver. | 10-23-2014 |
Chu-Han Hsin, Keelung City TW
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20100300369 | Covering structure for exterior of aquarium - The present invention provides a covering structure for exterior of aquarium, which includes a peripheral covering layer configured with a plurality of slide grooves that provide effectiveness of tracks and enable a tight fit to the corners of an aquarium. The covering structure thus provides a sliding means to interplay with the aquarium, moreover, extending the peripheral covering layer provides additional holding space, and increasing the plurality of slide grooves enables further segmentation, thereby augmenting the holding capacity of the covering layer and enabling variability in outward appearance to transform the aquarium into a craftwork similar to a building. Furthermore, the covering structure is joined to the corners of the aquarium using the slide grooves and a mounting method, which saves on time and provides a quick method to change the outward appearance of the aquarium, presenting a design of economic benefit and improving appreciative value of the aquarium. | 12-02-2010 |
Chung-Hsien Hsin, Hsin-Chu Hsien TW
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20110156187 | IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH - An image sensor packaging structure with a predetermined focal length is provided. The image sensor packaging structure includes a substrate, a chip, an optical assembly, and an encapsulation compound. The chip has a sensitization area and is coupled to the substrate. Conductive contacts on the substrate are electrically connected with conductive contacts around the sensitization area. The optical assembly has the predetermined focal length and is disposed above the chip so as to form an air cavity between the optical assembly and the sensitization area of the chip. The encapsulation compound is formed on the substrate to surround the chip and the optical assembly. With the above stated structure, not only can the focus adjusting procedure be dispensed with, but also the image sensor packaging structure can be manufactured by a molding or dispensing process. | 06-30-2011 |
20110156188 | IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT - An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured. | 06-30-2011 |
20110279815 | MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MODULE WITH FIXED FOCAL LENGTH - This present invention discloses a manufacturing method and structure for a wafer level image sensor module with fixed focal length. The method includes the following steps. First, a silicon wafer comprising several image sensor chips having a photosensitive area and a lens module array wafer comprising several wafer level lens modules with fixed focal length are provided. Next, the image sensor chips and the wafer level lens modules are sorted in grades according to the different quality grades. According to the sorting results, each of the wafer level lens modules is assigned to be situated above the image sensor chip that has the same grade. At the same time, each of the wafer level lens modules is directed to face the photosensitive area of each image sensor chip. Finally, in the packaging process, the wafer level lens module is surrounded by an encapsulation material. | 11-17-2011 |
20110291215 | WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD FOR THE SAME - The present invention discloses a wafer level image sensor packaging structure and a manufacturing method for the same. The manufacturing method includes the following steps: providing a silicon wafer with image sensor chips, providing a plurality of transparent lids, allotting one said transparent lid on top of the corresponding image sensor chip, and carrying out a packaging process. The manufacturing method of the invention has the advantage of having a simpler process, lower cost, and higher production yield rate. The encapsulation compound arranges on the first surface of the image sensor chip and covers the circumference of the transparent lid to avoid the side light leakage as traditional chip scale package (CSP). Thus, the sensing performance of the wafer level image sensor packaging structure can be enhanced. | 12-01-2011 |
20120068288 | MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH AND THE STRUCTURE USING THE SAME - A manufacturing method of a molded image sensor packaging structure with a predetermined focal length and the structure using the same are disclosed. The manufacturing method includes: providing a substrate; providing a sensor chip disposed on the substrate; providing a lens module set over the sensing area of the chip to form a semi-finished component; providing a mold that has an upper mold member with a buffer layer; disposing the semi-finished component into the mold to form a mold cavity therebetween; injecting a molding compound into the mold cavity; and after transfer molding the molding compound, opening the mold and performing a post mold cure process to cure the molding compound. The buffer layer can fill the air gap between the upper surface of the lens module and the upper mold member, thereby preventing the upper surface of the lens module from being polluted by the molding compound. | 03-22-2012 |
Chung-Hsien Hsin, Chu-Pei City TW
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20110024610 | IMAGE SENSOR PACKAGE STRUCTURE - The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced. | 02-03-2011 |
20110024861 | MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND IMAGE SENSOR PACKAGE STRUCTURE THEREOF - A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure. | 02-03-2011 |
Chung-Hsien Hsin, Hsinchu City TW
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20090045476 | IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME - An image sensor package is provided including a substrate; a sensor chip; a plurality of bond wires for connecting the sensor chip to the substrate at predetermined locations; a sensor housing on the substrate for substantially encompassing the sensor chip, the sensor housing having a through-hole cavity defining an optical glass (IR filter) seat, the sensor housing defining an upper surface and an edge surface thereof; an optical glass (IR filter) on the optical glass (IR filter) seat; an encapsulation material for substantially encapsulating the upper surface and edge surface of the sensor housing, a corresponding surface of the substrate adjacent the edge surface of the sensor housing, and the side edge of the optical glass (IR filter); wherein the sensor housing is provided with a gas-exit allowing possible high temperature gas to exit; the encapsulation material forms an upper surface which is substantially aligned with a top surface of the optical glass (IR filter); the encapsulation material forms an upper surface which is lower than a top surface of the optical glass (IR filter); the sensor housing defines a profile shape, the profile shape has at least a step-wise configuration for facilitating and accommodating flowing of the encapsulation material; the sensor housing has a bottom surface adhered to the substrate by an adhesive; and a slot is provided on the bottom surface of the sensor housing for accommodating the adhesive. | 02-19-2009 |
20090283809 | Image sensor structure and integrated lens module thereof - An image sensor structure and an integrated lens module thereof are provided. In the image sensor structure with the integrated lens module, the image sensor structure comprises a chip and a lens module. The chip has light-sensing elements, first conducting pads, and a conducting channel. The light-sensing elements are electrically connected to the first conducting pads and the first conducting pads are electrically connected to one end of the conducting channel passing through the chip. The lens module comprises a holder and at least one lens. The holder has a through hole and the lens is embedded in the through hole and integrated with the holder. By using the integrated lens and holder, a manufacturing process of the image sensor structure is simplified and a manufacturing cost of the image sensor structure is reduced. | 11-19-2009 |
Chung-Hsien Hsin, Chu-Pei TW
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20110024862 | IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY - The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized. | 02-03-2011 |
20110241146 | MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MODULE WITH PACKAGE STRUCTURE - The present invention discloses a manufacturing method and structure of a wafer level image sensor module with package structure. The structure of the wafer level image sensor module with package structure includes a semi-finished product, a plurality of solder balls, and an encapsulant. The semi-finished product includes an image sensing chip and a wafer level lens assembly. The encapsulant is disposed on lateral sides of the image sensing chip and the wafer level lens assembly. Also, the manufacturing method includes the steps of: providing a silicon wafer, dicing the silicon wafer, providing a lens assembly wafer, fabricating a plurality of semi-finished products, performing a packaging process, mounting the solder balls, and cutting the encapsulant. Accordingly, the encapsulant encapsulates each of the semi-finished products by being disposed on the lateral sides thereof. | 10-06-2011 |
20110241147 | WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME - The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process. | 10-06-2011 |
20120220065 | METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING OF IMAGE SENSOR - The present invention discloses a method for reducing the tilt of a transparent window during manufacturing of an image sensor. The method includes the following steps: providing a semimanufacture of the image sensor; carrying out a preheating process; carrying out an adhesive spreading process; carrying out a transparent window closing process; and carrying out a packaging process. By carrying out the preheating process, the environmental conditions can be stabilized during the adhesive spreading process and the transparent window closing process such that the transparent window can be kept highly flat after combining By the implementation of the present invention, the chance of tilt and crack of the transparent window during manufacturing of the image sensor can be reduced, thereby achieving the goal for a better yield rate. | 08-30-2012 |
20130149805 | METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAGE SENSOR - A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate. | 06-13-2013 |
Chun-Hsing Hsin, Changhua County TW
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20150159321 | SUEDE-LIKE SYNTHETIC LEATHER AND METHOD OF MAKING THE SAME - A suede-like synthetic leather includes a substrate and a suede-like layer formed on the substrate from a polymeric foam which has a surface provided with piles projecting therefrom. The suede-like synthetic leather is formed by a process which includes the steps of forming the polymeric foam on the substrate, and forming the piles on the surface of the polymeric foam by rubbing, tumbling, or abrading the surface of the polymeric foam. | 06-11-2015 |
Ding-Yu Hsin, Taipei County TW
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20110125942 | SIGNAL SWING TRIMMING APPARATUS AND METHOD THEREOF - A signal swing trimming apparatus calibrates a swing level of an output signal generated from a transmitting device to a receiving device including: a comparing device coupled to the output signal for comparing the swing level of the output signal with a target swing level and generating a comparison output signal, and an adjusting device coupled to the comparing device and the transmitting device for controlling the transmitting device to adjust the swing level of the output signal according to the comparison output signal, wherein the signal swing trimming apparatus is configured to calibrate the swing level of the output signal during a hand-shake process between the transmitting device and the receiving device. | 05-26-2011 |
Don-Chen Hsin, Hsinchu City TW
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20090015296 | DIGITAL FREQUENCY SYNTHESIZER AND METHOD THEREOF - A digital frequency synthesizer and a method thereof are provided. In the digital frequency synthesizer, a plurality of multiphase signals (MPSs) is generated by a phase delay locked loop array, and a transition reference values is generated by a programmable transition value generator. An operation result obtained according to an input signal and an accumulated value is compared with the transition reference values to generate a phase selection control signal. A phase signal is selected among the MPSs according to the phase selection control signal. After that, a sampling control is performed to the selected phase signal to generate a synthetic signal. The digital frequency synthesizer and the method thereof are flexible and are easy to produce tiny analytic phase, thus, not only fine tuning phases is added but also the resolution of the synthetic signal is improved. | 01-15-2009 |
20090021499 | DISPLAY DRIVING APPARATUS AND METHOD THEREOF - A display driving apparatus and a method thereof are provided. The apparatus includes a memory unit, a compression and decompression unit, a data selection unit, and a display accelerating unit. The memory unit is coupled to the compression and decompression unit and stores only a compressed frame to save memory space in the apparatus. The data selection unit determines whether an error is caused to a frame through data compression and decompression. When the error is greater than a predetermined value, the display accelerating unit turns off an overdriving process upon the pixels to avoid image distortion. The data selection unit also determines whether the frames are static or dynamic in order to determine whether to turn on the overdriving process. | 01-22-2009 |
Huang Chih Hsin, Kaohsiung City TW
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20080282474 | Structure improvement of the pillow - The present invention relates to an “structure improvement of the pillow”, which comprises a central main pillow and two lateral sub-pillows, wherein, said central main pillow is trapezoid in dimension with height of pillow top and central length such that the height of pillow top approximately equals the distance between the outer hind skull surface to the outer surface of the normal arched cervical vertebra when people lies on one's back while the height of central length approximately equals the distance between the outer side surface of two ears of human head with slight clearance for tolerance; said lateral sub-pillow is trapezoid in dimension with height of pillow top and the height of pillow top approximately equals the distance between the outer side skull surface to the outer side surface of the shoulder when people lies on one's side; The characterized is that a pair of symmetrical skew-angled arrangement for said central main pillow and each of said two lateral sub-pillows is formed in disposal so that the user head can be exactly placed on and closely supported by one of the two lateral sub-pillows completely when the user lies on one's side sleeping posture; Besides, a sunken dent space is created on the central top of the lateral sub-pillow so that the user ear will be not pressed without uncomfortable feeling. | 11-20-2008 |
I-Chien Hsin, Banciao City TW
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20080264124 | Lock core assembly with multiple burglarproof effects - A lock core assembly has a lock shell, a lock core mounted rotatably in the lock shell, multiple pin assemblies and an arrestor. Multiple mounting chambers are formed between the lock core and the lock shell. The pin assemblies are mounted respectively in the mounting chambers and each have an upper pin situated at an interface between the lock core and the lock shell to prevent a rotation of the lock core and a lower pin with an annular groove. The lock shell has a retaining cavity formed inside. The lock core has a mounting recess communicating with the mounting chambers and aligning with the retaining cavity. The arrestor is mounted slidably in the mounting recess. Without inserting a right key into the lock core, the arrestor is held in the retaining cavity to prevent the lock core from rotating to provide an improved burglarproof effect. | 10-30-2008 |
20080264125 | Lock assembly with an improved burglarproof lock core - A lock assembly with an improved burglarproof lock core has a casing, a lock core and multiple outer chambers. The casing is mounted in a lock device and has a core hole and multiple outer chambers. The lock core is mounted in the core hole and has multiple inner chambers and a keyhole. The inner chambers correspond to the outer chambers in the casing. Each locking pin assembly is mounted slidably in the corresponding outer and inner chambers and has an inner and outer locking. The inner locking pins are flush with the inner chamber when the lock device is unlocked, and at least one inner locking pin is magnetic. The outer locking pin corresponding to the magnetic locking pin is held to ensure that the lock assembly won't be unlocked when someone attempts to tap the locking pin assemblies to pick the lock device. | 10-30-2008 |
20080302150 | LOCK CORE ASSEMBLY - A lock core assembly has a lock shell, a lock core, multiple pin assemblies and at least one anti-knock pin assembly. Each pin assembly is mounted in a mounting chamber formed radially in the lock shell and through the lock core. Each anti-knock pin assembly has an upper pin and a major spring abutting each other and is mounted in a corresponding characteristic chamber assembly with a core chamber and at least one limiting recess communicating with each other. When a burglar turns the lock core by using a lock pick to vibrate or knock the lock core, the major spring presses the upper pin to engage in the limiting recess to limit the lock core and provide a reliable and reusable burglarproof lock that need not be replaced after an attempted malicious opening. | 12-11-2008 |
20090178451 | Lock core assembly - A lock core assembly has a lock shell, a lock core and a pin segment. The lock shell has a core mount, multiple upper pin chambers, a lid and at least one retaining flange. The lock core is mounted rotatably in the core mount and has a keyhole and multiple lower pin chambers. The lower pin chambers are formed radially through an outer surface of the lock core, communicate with the keyhole, align longitudinally, correspond to and communicate with the upper pin chambers. The pin segment is mounted between the lock shell and the lock core and has multiple abutting pin assemblies and at least one suspended pin assembly. When knocked, a suspended upper pin of the at least one suspended pin assembly prevents the pin aligning and the lock core from rotating, the lock core assembly provides a preferred burglarproofing effect. | 07-16-2009 |
I-Chien Hsin, Taipei Hsien TW
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20110041576 | LOCK CORE ASSEMBLY - A lock core assembly has a lock shell, a lock core and a pin segment. The lock shell has multiple upper pin chambers and a lid. The lock core is mounted rotatably in the lock shell and has multiple lower pin chambers. The lower pin chambers are formed radially through an outer surface of the lock core and respectively align and communicate with the upper pin chambers. The pin segment is mounted between the lock shell and the lock core and has multiple pin assemblies including at least one suspended pin assembly. Each suspended pin assembly has a suspending spring and a suspending block. The suspending spring is connected to a lower pin. The suspending block is mounted on and supported by the suspending spring and abuts with a returning spring. | 02-24-2011 |
Kun-Ying Hsin, Hsin-Chu TW
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20150192727 | DISPLAY APPARATUS - A display apparatus includes a display panel, a light guide plate, at least one light source and at least one reflective body. The light guide plate is disposed below the display panel. The light guide plate has a light-incident surface, a light-emitting surface, a rear surface, a plurality of concave microstructures and a plurality of reflective bodies. The rear surface is located farther away from the display panel than the light-emitting surface is. The light-incident surface is connected to the light-emitting surface and the rear surface. The concave microstructures are located on the rear surface. The reflective bodies are respectively located in the concave microstructures. The light source is disposed opposite to the light-incident surface. | 07-09-2015 |
20150262542 | PIXEL CIRCUIT OF LIQUID CRYSTAL DISPLAY AND CONTROL METHOD THEREOF - A pixel circuit of a liquid crystal display (LCD) has a first switch, a second switch, a third switch, a storage capacitor and a liquid crystal capacitor. The first switch controls electrical connection between a data line and the storage capacitor according to a voltage level of a first gate line. The second switch controls electrical connection between the storage capacitor and the liquid crystal capacitor according to a voltage level of a second gate line. The third switch controls electrical connection between a bias line and the liquid crystal capacitor according to the voltage level of the first gate line. Within each frame period of the LCD, the second switch is turned off while the first switch and the third switch are turned on, and the first switch and the third switch are turned off while the second switch is turned on. | 09-17-2015 |
Kuo-Ting Hsin, Hsinchu County TW
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20100272139 | DRIVING CIRCUIT FOR DRIVING LASER DIODE AND METHOD FOR CONTROLLING LASER POWERS OF LASER DIODE - The invention provides a driving circuit for driving a laser diode of a pickup head. In one embodiment, the driving circuit comprises an automatic power control (APC) module, a clamp value determination unit, and a clamp circuit. The automatic power control module generates at least one power control signal. The clamp value determination unit dynamically determines at least one clamp value corresponding to the power control signal when the pickup head accesses an optical storage medium. The clamp circuit clamps the power control signal according to the clamp value to obtain a clamped power control signal. A driving signal for driving the laser diode can then be generated according to at least the clamped power control signal. | 10-28-2010 |
Kuo-Ting Hsin, Hsin-Chu Hsien TW
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20080253240 | METHOD AND SYSTEM FOR CALIBRATING RECORDING TRACK OFFSET OF OPTICAL STORAGE DEVICE - A method for calibrating a recording track offset of an optical storage device accessing an optical storage medium of a land and groove recording/reproduction type includes: setting at least one control parameter of a track offset control loop of the optical storage device to drive the track offset control loop to enter an first state; and recording data onto the optical storage medium with the track offset control loop being enabled to derive the latest value of the recording track offset, where the track offset control loop is utilized for controlling the recording track offset. The method further includes setting the control parameter to drive the track offset control loop to enter a second state, where a loop response of the track offset control loop in the first state is different from that in the second state. | 10-16-2008 |
20080253248 | SYSTEM AND METHOD FOR CALIBRATING RECORDING TRACK OFFSET OF OPTICAL STORAGE DEVICE - A system and method for calibrating a recording track offset of an optical storage device accessing an optical storage medium of land/groove type. The system includes: a tracking servo loop arranged to control tracking operations of an optical head of the optical storage device; a track offset control loop arranged to control the recording track offset for the tracking servo loop; a controller arranged to enable a latest value of the recording track offset to be a readout value for utilization in a recording process performed later; and a comparator arranged to compare a recording length with a threshold value and generate a flag to represent whether the recording length is a long recording length, wherein the latest value is derived from the track offset control loop. | 10-16-2008 |
20090141598 | Apparatus for Adjusting Focus Offset and Method Thereof - The present invention provides an apparatus of an optical disc drive for adjusting a focus error signal. The apparatus includes a focus offset determining unit and an adjusting module. The focus offset determining unit is utilized for determining a target focus offset corresponding to a target condition, and the adjusting module is coupled to the focus offset determining unit and utilized for receiving the focus error signal and adjusting the focus error signal with the target focus offset to generate an adjusted focus error signal. | 06-04-2009 |
Kuo-Ting Hsin, Zhubei City TW
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20110158065 | Optical Disk Drive and Method for Performing Layer Jumps - The invention provides a method for performing a layer jump of a disk. First, a tracking error generation method is determined according to a layer type of a target layer when the layer jump is performed. A tracking error signal is then generated according to the tracking error generation method. | 06-30-2011 |
20110158070 | Optical Disk Drive and Method for Determining Type of a Blu-Ray Disk - The invention provides a method for determining the layer type of a blu-ray disk. First, a laser beam is focused on a target layer of the blu-ray disk. Reflection of the laser beam from the target layer is the detected to obtain a reflection signal. The reflection signal is then processed to generate a first tracking error signal and a second tracking error signal. Magnitudes of the first tracking error signal and the second tracking error signal are then measured. The magnitude of the second tracking error signal is then subtracted from the magnitude of the first tracking error signal to obtain a difference value. Finally, the layer type of the target layer is determined by comparing the difference value with the first predetermined threshold. | 06-30-2011 |
Leng-Nien Hsin, Zhubei City TW
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20130169177 | Active Bleeder Circuit Triggering TRIAC in All Phase and Light Emitting Device Power Supply Circuit and TRIAC Control Method Using the Active Bleeder Circuit - The present invention discloses an active bleeder circuit capable of triggering a tri-electrode AC switch (TRIAC) circuit in all phase. The active bleeder circuit receives a rectified signal having an OFF phase and an ON phase. The active bleeder includes: a detection circuit for generating a detection signal according to the rectified signal and accumulating the detection signal in the OFF phase of the rectified signal; and a current sinker circuit coupled to the detection circuit, for generates a latching current to trigger the TRIAC circuit by operating a switch when the detection signal exceeds a predetermined level. The present invention also discloses a light emitting device power supply circuit and a TRIAC control method using the active bleeder circuit. | 07-04-2013 |
Ling-Wei Hsin, Taipei City TW
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20130059882 | 8-Phenylisoquinolines And Pharmaceutical Composition Used In Treatment For Sepsis - A compound is provided. The compound includes a formula of: | 03-07-2013 |
Lung-Pin Hsin, Dasi Town TW
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20140240839 | OPTICAL SUBSTRATES HAVING LIGHT COLLIMATING AND DIFFUSION STRUCTURES - An optical substrate having a structured prismatic surface and an opposing structured lenticular surface. The structured lenticular surface includes shallow-curved lens structures. Adjacent shallow-curved lens structure may be continuous or contiguous, or separated by a constant or variable spacing. The lens structure may have a longitudinal structure with a uniform or varying cross section. The lenticular lenses may have a laterally meandering structure. Sections of adjacent straight or meandering lenticular lenses may intersect or partially or completely overlap each other. The lenticular lenses may be in the form of discontinuous lenticular segments. The lenticular segments may have regular, symmetrical shapes, or irregular, asymmetrical shapes, which may be intersecting or overlapping, and may be textured. The lens structure may be provided with isolated ripples, in the form of a single knot, or a series of knots. | 08-28-2014 |
20140367873 | Optical substrates having light collimating and diffusion structures - This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure. | 12-18-2014 |
Lung-Pin Hsin, Taoyuan County TW
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20140355250 | MULTI-FUNCTION COMPOSITE OPTICAL FILM - A composite optical film has the functions of brightness enhancement, self-diffusion and defect blocking. The film comprises: a structured substrate including a structured light incidence surface and a light emitting surface opposite the structured light incidence surface, wherein the structured light incidence surface includes longitudinal prism structures or longitudinal lens structures transversely arranged in rows; a support base plate adjacent to the light emitting surface of the structured substrate, the support base plate having a light incidence surface on one side and a light emitting surface on another side opposite the light incidence surface, wherein at least one of the light incidence surface and the light emitting surface has a plurality of buried particles, and at least one portions of the buried particles are protruded on the light emitting surface of the support base plate. | 12-04-2014 |
Lung-Pin Hsin, Taoyuan TW
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20140133133 | LUMINANCE ENHANCEMENT FILM, BACKLIGHT MODULE AND LIQUID CRYSTAL DISPLAY DEVICE - The present invention provides a luminance enhancement film which is superior in dimensional stability, thermal stability, and anti-deformation ability. Thus, it can meet the current requirement for thinning LCD apparatuses. | 05-15-2014 |
Lung-Pin Hsin, Tai Chung City TW
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20090323013 | MODULIZED DISPLAY COMPONENT AND MANUFACTURING METHOD THEREOF - A modulized display component and a manufacturing method for the same are disclosed in this invention. The display component of this invention is designed according to a modulization concept so that it can be attached to any driving circuit layer. Further, various manufacturing techniques can be used to form the alignment layers and protective layers in order to fabricate a trans-reflective, reflective, or transmissive color displaying component. | 12-31-2009 |
Ming-Tsung Hsin, Taipei City TW
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20120307077 | ALIGNMENT APPARATUS - An alignment apparatus for adjusting an image sensor is provided. The alignment apparatus includes a first stage, a second stage, a positioning aligned unit, and an adjustment unit. The second stage is floatingly disposed on the first stage. The image sensor is adapted to be disposed on the second stage. The positioning aligned unit connected between the first stage and the second stage constrains the second stage on a datum surface above the first stage. The positioning aligned unit coupled to the second stage drives the second stage to rotate along the datum surface. | 12-06-2012 |
20140009674 | ADJUSTMENT DEVICE AND METHOD THEREOF - The present invention discloses an adjustment device and method thereof which are applied for adjusting a photosensitive element. The adjustment device comprises a first platform, a second platform, a third platform and a cover. The first platform comprises a curved surface body and a positioning elastic element. The second platform, having a recess corresponding to each curved surface body and having a loading support portion, is arranged on a side of the first platform. The third platform is arranged on the other side of the first platform, and when the third platform, moves in an axial direction, the first and second platform moves together with the third platform. The cover compresses the photosensitive element against the second platform. When the inclination of photosensitive element is adjusted by the adjustment device, each curve surface body and each recess keep in contact due to the expansion of each positioning elastic element. | 01-09-2014 |
Pi-Yu Hsin, Hsinchu County TW
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20140191167 | Conductive Composition - The present invention discloses a conductive paste for solar cell, including the following composition: (a) a silver powder; (b) a filler which can be coated with a conductor; (c) a glass frit; and further (d) a dispersing agent, an organic vehicle, and at least one additive. The filler, especially conductor coated, is used to replace part of silver powder as an ingredient of the conductive paste and thus reduces manufacturing cost without conductivity diminishing. This conductive paste can be utilized to form the front-side electrode of the substrate for solar cell. | 07-10-2014 |
Shao Chi Hsin, New Taipei City TW
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20130280292 | High molecular weight polymeric composition and a new usage of the high-molecular weight polymeric composition - Approach is provided for a high molecular weight polymeric composition and a new usage of the high-molecular weight polymeric composition. The new usage of the high-molecular weight polymeric composition directly adsorbs body fluid, or indirectly adsorbs toxin or stimulating substance existed in the intaked solution or liquid and removes the body fluid or the toxin or stimulating substance out of body. Therefore, the high-molecular weight polymeric composition is helpful to reduce the food digestibility or to prevent the toxin or stimulating substance from adsorbing in the gastrointestinal tract, even to bring the toxin or stimulating substance out of the body. Accordingly, the high-molecular weight polymeric composition is able to be applied to control weight by lowering the food digestibility or avoid damage by decreasing the toxin or stimulating substance released into the body. The high molecular weight polymeric composition has well biocompatibility to be widely applied in human. | 10-24-2013 |
Ting-Kuo Hsin, Taipei City TW
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20140015405 | LIGHT EMITTING DIODE MODULE - The light emitting diode module is disclosed. The light emitting diode module includes a ceramic substrate, a circuit layer, at least an illuminant element and a driving circuit element. The ceramic substrate has a recess formed on and upper surface thereof. The circuit layer is placed on the upper surface of the ceramic substrate. The driving circuit element is disposed on the upper surface of the ceramic substrate and electrically connected to the circuit layer. | 01-16-2014 |
20140016316 | ILLUMINANT DEVICE - An illuminant device includes a housing and an illuminant unit. One side of the housing has a platform-part, the illuminant unit is disposed on the platform-part. The illuminant unit includes a carrying body and a plurality of light emitting diode (LED) dies. The carrying body is made of ceramic material and has three lateral surfaces adjoined with each other. Each lateral surface disposed with a plurality of circuit layouts, the LED dies are placed on the lateral surfaces and electrically connected to the circuit layouts. | 01-16-2014 |
20140016324 | ILLUMINANT DEVICE - An illuminant device includes a housing, an circuit layer, at least a light emitting diode (LED) die, a driving circuit element, a plurality of electrical elements and an conductive connector. The housing has a supporting part and a platform-part connected to a side of the supporting part. The circuit layer is placed on the platform-part. The LED die is placed on the platform-part and electrically connected to the circuit layer. The driving circuit element is placed on the platform-part and electrically connected to the circuit layer. The electrically elements are placed on the platform-part and electrically connected to the circuit layer. The conductive connector is connected to another side of the supporting part. | 01-16-2014 |
20140070702 | LED LAMP - A LED lamp includes housing, a circuit layer, at least one LED die, a light-transmitting adhesive, a lamp shade, a light-transmitting liquid and the conductive connector. One end of the housing has a protrusion. The circuit layer is placed on the protrusion. The LED die is placed on the protrusion and electrically connected to the circuit layer. The light-transmitting adhesive covers the circuit layer and the light emitting die. The lamp shade including a plurality of ventilating holes is connected to the housing, and an accommodating space is cooperatively defined by the lamp shade and the housing. The light-transmitting liquid is filled within the accommodating space, and the LED die is sunk therein. | 03-13-2014 |
Tung-Cheng Hsin, Hsinchu City TW
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20110012689 | Impedance Adjustment Circuit for Adjusting Terminal Resistance and Related Method - An impedance adjustment circuit for adjusting a terminal resistance includes a resistance evaluation unit and a terminal resistor unit. The resistance evaluation unit is utilized for evaluating a ratio of an off-chip resistor and a basic resistor to generate a control signal by a successive approximation method. The terminal resistor unit is coupled to the resistance evaluation unit, and is utilized for deciding a number of shunt basic resistors to provide a matched terminal resistance according to the control signal. | 01-20-2011 |
20110050681 | LOW VOLTAGE DIFFERENTIAL SIGNAL OUTPUT STAGE - A low voltage differential signal (LVDS) output stage including a display signal digital circuit, a data parallel-to-serial (P2S) circuit and a transmitting circuit is provided. The display signal digital circuit generates a display signal and a display clock signal synchronous to each other according to a first frequency multiplication clock signal. The data P2S circuit samples the display signal according to a second frequency multiplication clock signal, so as to generate a serial data signal and a serial clock signal. The first frequency multiplication clock signal and the second frequency multiplication clock signal have a relationship of frequency multiplication. The data P2S circuit includes an adjustment structure for adjusting the serial clock signal according to the display clock signal and the second frequency multiplication clock signal, and controlling a transmitting time of the serial data signal transmitted according to a clock of the second frequency multiplication clock signal. | 03-03-2011 |
20120262202 | Output Buffer - An output buffer includes a level conversion module for generating a first logic signal having a first level range and a second logic signal having a second level range, a pre-driving module composed of low-voltage transistors for generating a first control signal and a second control signal according to the first logic signal and the second logic signal, and an output module for generating an output signal having a third level range according to the first control signal and the second control signal. Each of the first and second level ranges is smaller than the third level range. | 10-18-2012 |
20130257496 | Frequency Synthesizer - The present invention discloses a frequency synthesizer. The frequency synthesizer includes a delay unit, for receiving a reference signal and delaying the reference signal according to a delay parameter, so as to generate a delay reference signal; a phase-locked loop, for generating an output signal according to the delay reference signal and a feedback frequency dividing signal; a control unit, for generating the delay parameter and a frequency dividing parameter according to a target magnification factor; and a frequency divider, for dividing the frequency of the output signal according to the frequency dividing parameter. | 10-03-2013 |
Wan-Min Hsin, New Taipei City TW
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20130151995 | DISPLAY SYSTEM CAPABLE OF INTERNET ACCESSING, METHOD FOR INTERNET ACCESSING AND DISPLAYING OF WEBPAGE AND METHOD FOR CONTROLLING DISPLAY OF WEBPAGE - A display system includes a receiver and a display. The receiver is used for receiving a control signal from a remote controller. The display is used for displaying a list of webpage options with numbers associating with the, and displaying a webpage associated with a webpage option after receiving the control signal indicating a number corresponding to the webpage option. The number is entered through pressing a numerical keypad of the remote controller. | 06-13-2013 |
Wei-Chen Hsin, Hsinchu County TW
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20120194349 | MONITOR APPARATUS AND METHOD FOR DETECTING MOVEMENT BEHAVIOR OF OBJECT IN CYLINDER - An object is set to move back and forth between a first position and a second position in a cylinder. A measurement point between the first position and the second position is preset. A counted period indicating a duration that the object moves from the first position to the first measurement point is obtained. Then a movement behavior parameter is obtained according to the counted period. Whether the movement behavior parameter of the object matches a specified condition is determined. If matching occurs, a warning message is generated. | 08-02-2012 |
Wei-Lun Hsin, Taoyuan County TW
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20150103575 | SOLAR PHOTOVOLTAIC POWER CONVERSION SYSTEM AND METHOD OF OPERATING THE SAME - A solar photovoltaic power conversion system is provided to convert a DC input voltage into an AC output voltage, which mainly includes an input capacitor bank, a first switching circuit, a second switching circuit, a first filtering circuit, a second filtering circuit, and a control circuit. The first switching circuit has a first power switch and a second power switch. The second switching circuit has a third power switch and a fourth power switch. The control circuit produces a first control signal, a second control signal, a third control signal, and a fourth control signal to respectively control the first power switch, the second power switch, the third power switch, and the fourth power switch so as to reduce leakage current of the DC input voltage caused by parasitic capacitance voltage. | 04-16-2015 |
20150214859 | POWER CONVERSION SYSTEM AND METHOD OF OPERATING THE SAME - A power conversion system mainly includes an input capacitor bank, a first conversion circuit, a second conversion circuit, and a control circuit. The input capacitor bank has a first capacitor and a second capacitor. The first capacitor and the second capacitor are connected to a neutral point and receive a DC input voltage. The first conversion circuit is connected in parallel to the input capacitor bank, and has a first branch, a second branch, and a first auxiliary branch. The second conversion circuit is connected in parallel to the input capacitor bank, and has a third branch, a fourth branch, and a second auxiliary branch. The control circuit produces a plurality of control signals to correspondingly control the first conversion circuit and the second conversion circuit so as to reduce leakage current caused by parasitic capacitance voltage. | 07-30-2015 |
Yi-Chih Hsin, Kao Hsiung City TW
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20100049898 | MEMORY MANAGEMENT SYSTEM AND METHOD THEREOF - The invention discloses a memory management system and a memory management method are disclosed. The memory management system includes a first memory, at least one secondary memory, and a memory management device. The first memory includes a normal access memory bank and at least one switching access memory bank. The secondary memory includes at least one secondary access memory bank corresponding to the switching access memory bank. The memory management device reads/writes the normal access memory bank or the secondary access memory bank. | 02-25-2010 |
Yi-Chin Hsin, Kao Hsiung City TW
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20120233412 | MEMORY MANAGEMENT SYSTEM AND METHOD THEREOF - The invention discloses a memory management system and a memory management method are disclosed. The memory management system includes a first memory, at least one secondary memory, and a memory management device. The first memory includes a normal access memory bank and at least one switching access memory bank. The secondary memory includes at least one secondary access memory bank corresponding to the switching access memory bank. The memory management device reads/writes the normal access memory bank or the secondary access memory bank. | 09-13-2012 |
Yi-Lin Hsin, Tainan County TW
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20120172267 | LUBRICATING OIL COMPOSITION AND METHOD FOR MANUFACTURING THE SAME - The disclosure provides a lubricating oil composition and method for manufacturing the same. The lubricating oil composition substantially consists of a base lubricant oil, and an organic-inorganic composite particle uniformly dispersed in the base lubricant oil. This lubricating oil composition is applicable to a sliding section or sliding member of an automotive internal combustion engine or power transmission apparatus to significantly reduce friction coefficient, temperature of oil and wear rate. | 07-05-2012 |
Yite Hsin, Taipei County TW
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20090073056 | Stylus arranged with antenna and portable wireless communication device having the same - A portable wireless communication device has a stylus and a main body. The stylus includes a pen tube and an antenna. The antenna is containable in the pen tube and separable from the pen tube. A portable wireless communication device includes a circuit board arranged in the main body, a containing groove and an antenna groove formed in the main body. The circuit board has a wireless communication unit. The containing groove is configured for containing the stylus. The antenna groove is configured for containing the antenna, and the antenna connects electrically to the wireless communication unit of the circuit board when the antenna is contained in the antenna groove. | 03-19-2009 |
Yu-Chen Hsin, Hsinchu County TW
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20140312468 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes a substrate, a device layer and a least one conductive post. The substrate includes a first surface, a second surface opposite to the first surface, and at least one through hole penetrating the substrate. The substrate includes a first side wall portion and a second side wall portion at the through hole. The first side wall portion is connected to the first surface and includes a plurality of first scallops. The second side wall portion is connected to the second surface and includes a non-scalloped surface. The device layer is disposed on the second surface, and the second side wall portion of the substrate further extends into the device layer along the non-scalloped surface. The conductive post is disposed in the through hole, wherein the conductive post is electrically connected to the device layer. | 10-23-2014 |
20150104927 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A method for fabricating a semiconductor device is provided. The method includes: providing a first wafer having a first active surface and a first rear surface opposite to the first active surface, the first wafer comprising a first circuit formed therein; providing a second wafer having a second active surface and a second rear surface opposite to the second active surface, the second wafer comprising a second circuit formed therein; bonding the first active surface of the first wafer with the second active surface of the second wafer so as to electrically connecting the first circuit and the second circuit; thinning the second wafer from the second rear surface; and forming at least a conductive through via in the second wafer, wherein the conductive through via is electrically connected to the first circuit through the second circuit. | 04-16-2015 |
Yue-Loong Hsin, Hualien City TW
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20140128762 | SEIZURE DETECTION AND EPILEPTOGENIC LESION LOCALIZATION - Epileptogenic source localization methods and systems based on ECoG signals are provided for obtaining spatial and temporal relationships among epileptogenic zones. Seizure detection is based on an Independent Component Analysis (ICA) and temporal and spatial relationships among the detected epileptogenic zones are based on a steepest descent-based source localization method. Embodiments of the invention facilitate the epileptiform activity investigation and seizure dynamics study and further benefit the neurophysiology community in the surgical decision making of neurosurgeons. | 05-08-2014 |
Yue-Ming Hsin, Jhongli City TW
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20140217416 | NITRIDES BASED SEMICONDUCTOR DEVICE - A nitride-based semiconductor device is disclosed, including a substrate, an active region including a plurality of nitride-based semiconductor layers disposed on the substrate, wherein a 2DEG channel and a two-dimensional hole gas (2DHG) under the two-dimensional electron gas (2DEG) channel are formed within the plurality of nitride-based semiconductor layers, a gate electrode disposed on the top of the active region and an interconnection structure electrically connected with the gate electrode and the 2DHG. | 08-07-2014 |
Yue-Ming Hsin, Tainan City TW
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20080197422 | Planar combined structure of a bipolar junction transistor and N-type/P-type metal semiconductor field-effect transistors and method for forming the same - A planar combined structure of a bipolar junction transistor (BJT) and n-type/p-type metal semiconductor field-effect transistors (MESFETs) and a method for forming the structure. The n-type GaN MESFET is formed at the same time when an inversion region (an emitter region) of the GaN BJT is formed by an ion implantation or impurity diffusion method by using a particular mask design, while a p-type GaN region is at the same time is formed as the p-type GaN MESFET. Namely, the n-type channel of the n-type MESFET is formed by the ion implantation or impurity diffusion method when the BJT is formed with the same ion implantation or impurity diffusion method performed, while a region of the p-type GaN without being subject to the ion implantation or impurity diffusion method is formed as the p-type MESFET. As such, the BJT is formed currently with the n-type/p-type MESFETs on the same GaN crystal growth layer as a planar structure. | 08-21-2008 |
20080299714 | Planar Combined Structure of a Bipolar Junction Transistor and N-type/P-type Metal Semiconductor Field-Effect Transistors and Method for Forming the Same - A planar combined structure of a bipolar junction transistor (BJT) and n-type/p-type metal semiconductor field-effect transistors (MESFETs) and a method for forming the structure. The n-type GaN MESFET is formed at the same time when an inversion region (an emitter region) of the GaN BJT is formed by an ion implantation or impurity diffusion method by using a particular mask design, while a p-type GaN region is at the same time is formed as the p-type GaN MESFET. Namely, the n-type channel of the n-type MESFET is formed by the ion implantation or impurity diffusion method when the BJT is formed with the same ion implantation or impurity diffusion method performed, while a region of the p-type GaN without being subject to the ion implantation or impurity diffusion method is formed as the p-type MESFET. As such, the BJT is formed currently with the n-type/p-type MESFETs on the same GaN crystal growth layer as a planar structure. | 12-04-2008 |
20090001489 | SILICON PHOTODETECTOR AND METHOD FOR FORMING THE SAME - A structure of a silicon photodetector and a method for forming the same by using the conventional CMOS semiconductor manufacturing process and micro-electromechanical system manufacturing process, in which the micro-electromechanical system manufacturing process (lateral etching process) is applied for elimination of effect and interference caused by a substrate of the silicon photodetector after optical absorption thereof, thereby greatly improving the response speed of the silicon photodetector. This can be done only by applying the lateral etching process onto a portion of the substrate of the silicon photodetector after the semiconductor manufacturing process is finished, through which slow diffusion carriers produced from the optical absorption of the substrate can be effectively reduced and the response speed is thus enhanced. | 01-01-2009 |
20110059533 | FLUORESCENCE DETECTION SYSTEM, METHOD, AND DEVICE FOR MEASURING BIOMOLECULES - A fluorescence detection system for measuring biomolecules is disclosed, which includes a fluorescence detection device, a light source, a sample-loading unit, and an analysis-reading device. The fluorescence detection device has a substrate and plural phototransistors arranged on the substrate, and each phototransistor contains an emitter, a collector locating on the substrate, and a base between the emitter and the collector. The base-collector diode junction functions as an absorber to convert fluorescence to photocurrent. The light source serves to excite a fluorescent dye contained in a biomolecule sample. The sample-loading unit is used to load or transport the excited biomolecule sample onto a sensing zone of the fluorescence detection device. The analysis-reading device is to measure photocurrent output from the fluorescence detection device under a bias. Hence, the biomolecule content can be easily determined by the fluorescence detection system. | 03-10-2011 |
20110079708 | SILICON PHOTODETECTION MODULE - A silicon photo-detection module is disclosed, in which a silicon photodiode detection unit and a parasitical vertical bipolar junction transistor amplification unit can be simultaneously formed by a CMOS process. The silicon photo-detection module has a silicon substrate, a silicon photodiode detection unit comprising a positive portion and a negative portion, and a parasitical vertical bipolar junction transistor amplification unit comprising a collector, a base, and an emitter. The silicon photodiode detection unit and the parasitical vertical bipolar junction transistor amplification unit are formed on the silicon substrate by a CMOS process. Besides, the positive and negative portions of the silicon photodiode detection unit are electrically connected respectively with the base and the collector of the parasitical vertical bipolar junction transistor amplification unit. | 04-07-2011 |
20120175690 | SI PHOTODIODE WITH SYMMETRY LAYOUT AND DEEP WELL BIAS IN CMOS TECHNOLOGY - A silicon photodiode with symmetry layout and deep well bias in CMOS technology is provided. The silicon photodiode includes a substrate, a deep well, and a PN diode structure. The deep well is disposed on the substrate, where an extra bias is applied to the deep well. The region surrounded by the deep well forms the main body of the silicon photodiode. The PN diode structure is located in the region surrounded by the deep well, where the silicon photodiode has a symmetry layout. The deep well is adopted when fabricating the silicon photodiode, and the extra bias is applied to the deep well to eliminate the interference and effect of the substrate absorbing light, and further greatly improve speed and bandwidth. Furthermore, the silicon photodiode has a symmetry layout, so that uniform electric field distribution is achieved, and the interference of the substrate noise is also reduced. | 07-12-2012 |
20130026604 | LATERAL AVALANCHE PHOTODIODE STRUCTURE - A lateral avalanche photodiode structure including a substrate, a PN diode and a metal layer is provided. The substrate has at least one first electrode area, at least one light receiving area, and at least one second electrode area which are arranged horizontally. The first electrode area is also an avalanche area, and the light receiving area is between the first electrode area and the second electrode area. The PN diode is disposed in the substrate in the first electrode area. The metal layer is disposed on the substrate and covers the first electrode area and the second electrode area, but does not cover the light receiving area. | 01-31-2013 |
Yu-Jen Hsin, Tainan City TW
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20090007397 | GASKET FOR FASTENING THE AUTOMOTIVE SAFETY BELT - The present invention is related to a gasket for fastening the automotive safety belt. A colloidal material is applied to form a one-piece body comprising a fixing part, a flexible part and a plug part. The plug part of the gasket is inlet into the hole of the suspension sheet of the safety belt for fastening the safety belt so as to avoid the safety belt rolling automatically to bind the human body so close that the chest are oppressed uncomfortably. In addition, the gasket mounted on the outer surface of the buckle of safety belt is made of colloidal materials. Even the gasket is touched with human body in use, to adjust and to fasten the safety belt will not result in the human body being hurt from impact. It is much safer for utility. | 01-08-2009 |
Yu-Lin Hsin, Tainan City TW
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20130155578 | CAPACITOR AND MANUFACTURING METHOD THEREOF - A capacitor and a manufacturing method thereof are provided. Two electrodes are disposed opposite to each other. Two electrode protection layers are respectively disposed on inner sides of the electrodes and include carbon particles each covered and bonded with a polymer shell. Active carbon layers are disposed on opposite inner sides of the electrode protection layers. The separator is disposed between the active carbon layers. The electrolyte fills between the electrode protection layers. The polymer shells of each electrode protection layer are bonded to the surface of the corresponding electrode by first and second functional groups. The first functional groups include thiol groups. The second functional groups include epoxy groups or carboxylic groups. The electrode protection layers serve as adhesion layers between the active carbon layers and the electrodes, and protect the electrodes from being corroded by the acid electrolyte solution. | 06-20-2013 |
20130157041 | SELF-ASSEMBLY COATING MATERIAL, HEAT SINK AND METHOD OF FORMING HEAT SINK - A self-assembly coating material including carbon particles and polymer shells is provided. The polymer shells respectively cover and are bonded to the carbon particles, wherein each polymer shell has both a first functional group for adsorbing on a surface of a substrate and a second functional group for self cross-linking. The first functional groups include thiol groups. The second functional groups include epoxy groups or carboxylic groups. The self-assembly coating material can be applied to a metal substrate to form a heat dissipation layer. | 06-20-2013 |
Yu-Lin Hsin, Tainan County TW
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20120003479 | SURFACE MODIFICATION OF NANO-DIAMONDS AND MANUFACTURING METHOD THEREOF - The invention is related to a technique that grafts polymer onto a surface of nano-diamonds, and the invention further provides applications relating to modification and dispersion of the nano-diamonds. The features of the technique are single step, one pot, low cost, and high yield, and therefore the technique has high potential for commercialization. The invention also provides a method for graphitizing monocrystalline nano-diamonds and polycrystalline nano-diamonds. Accordingly, the technique of modifying and polymer grafting can be used not only on ultra disperse diamonds but also on monocrystalline nano-diamonds with graphitized surfaces and polycrystalline nano-diamonds with graphitized surfaces. | 01-05-2012 |