Patent application number | Description | Published |
20090022446 | OPTICAL MODULATION ELEMENT AND OPTICAL MODULATION DEVICE HAVING THE SAME - An optical modulation element includes a waveguide defined based on a defect in a photonic crystal, a carrier conducting region for conducting a carrier to the waveguide, an electrode for injecting a carrier into the carrier conducting region, and a current control unit for controlling the quantity of carrier to be conducted to the waveguide, wherein the photonic crystal and the electrode are made of a material containing TiO | 01-22-2009 |
20090092368 | METHOD FOR FABRICATING THREE-DIMENSIONAL PHOTONIC CRYSTAL - At least one exemplary embodiment is directed to a method for fabricating a three-dimensional photonic crystal. In the method for fabricating the three-dimensional photonic crystal, a plurality of layers can be defined as one unit, and the total thickness of the one unit can be controlled such that an average layer-thickness of the plurality of layers in the one unit is about equal to the ideal layer-thickness so that a photonic band-gap occurs in a desired wavelength region. | 04-09-2009 |
20100260228 | METHOD OF PRODUCING THREE-DIMENSIONAL PHOTONIC CRYSTAL AND OPTICAL FUNCTIONAL DEVICE - A method of producing a three-dimensional photonic crystal by laminating a layer having a periodic structure, the method including the steps of forming a first structure and a second structure each including the layer having the periodic structure; and bonding a first bonding layer of the first structure and a second bonding layer of the second structure. The first bonding layer is one layer obtained by dividing a layer constituting the three-dimensional photonic crystal at a cross section perpendicular to a lamination direction, and the second bonding layer is the other layer obtained by dividing the layer constituting the three-dimensional photonic crystal at the cross section perpendicular to the lamination direction. | 10-14-2010 |
Patent application number | Description | Published |
20110286762 | DEVELOPING DEVICE, PROCESS CARTRIDGE, REMANUFACTURING METHOD FOR DEVELOPING DEVICE AND PROCESS CARTRIDGE - A remanufacturing method for a developing device and a process cartridge includes a dismounting step of dismounting a regulating member from a development frame member, a cleaning step of cleaning a blade sealing member, and a mounting step of mounting the regulating member to the development frame member after the cleaning step. | 11-24-2011 |
20130022368 | CARTRIDGE AND IMAGE FORMING APPARATUS - A cartridge is provided with an electrode portion for connecting a main assembly contact. The cartridge electrode includes a first contact portion, exposed toward an outside of a frame of the cartridge, contacted to a main assembly contact provided in the apparatus main assembly. The cartridge electrode further includes a second contact portion provided for being electrically connected to a process means of the cartridge, and an injection receiving portion into which resin is injected when the cartridge electrode is molded into the frame. The electroconductive resin injected from the injection receiving portion is branched to mold the first contact portion and the second contact portion so that an electroconductive path for electrically connecting the main assembly contact and the process means is formed. | 01-24-2013 |
20130121720 | CARTRIDGE AND UNIT - A cartridge detachably mountable to a main assembly of an image forming apparatus includes a cartridge frame formed of a resin material; a plurality of resin members molded on the cartridge frame by injection molding of a resin material different from that of the cartridge frame; a plurality of contact surfaces, provided on the cartridge frame, to which metal molds corresponding to the resin members are to be contacted from the same side when the resin members are molded; and a plurality of resin material inlet ports, provided in an opposite side of said cartridge frame from a side where the contact surfaces are provided. The resin material has been flowed into the cartridge frame when the resin members are molded. | 05-16-2013 |
20130129378 | CARTRIDGE AND UNIT - A cartridge detachably mountable to a main assembly of an image forming apparatus, includes: a rotatable member; a blade member contacted to the rotatable member; a frame, formed of a resin material, for supporting the blade member; and a seal member provided on the frame to be contacted to a portion of the blade member, opposite from a portion where the blade member is contacted to the rotatable member, in each of one end side and anther end side of the blade member with respect to an axial direction of the rotatable member, wherein the seal member is formed on the frame by injection molding for sealing a gap between the blade member and the frame. | 05-23-2013 |
20140093271 | CARTRIDGE AND IMAGE FORMING APPARATUS - A cartridge detachably mountable to a main assembly of an image forming apparatus includes: a frame; an accommodating portion, constituted by the frame, for accommodating a developer; a seal portion for preventing the developer from being leaking out from the accommodating portion, wherein the seal portion is formed by injection molding at a seal forming portion provided on the frame and is projected from the seal forming portion; and a sprue which is formed integrally with the seal portion by a resin material remaining in a path for permitting flow of the resin material melted when the seal portion is formed by the injection molding and which is projected from the frame in a position different from a position of the seal portion so as to be higher than the seal portion on the basis of the frame. | 04-03-2014 |
20150037065 | CARTRIDGE AND IMAGE FORMING APPARATUS - In a cartridge provided with an electrode portion for connecting a main assembly contact and process means by injecting an electroconductive resin into a frame, in order to simplify structures of the frame and the electrode portion and to improve an assembling property of the cartridge and an electrode property of the electrode portion, the cartridge electrode integrally molded by injecting the electroconductive resin into the frame includes a first contact portion, exposed toward an outside of the frame, contacted to a main assembly contact provided in the apparatus main assembly; a second contact portion provided for being electrically connected to the process means; and an injection receiving portion into which the resin is injected when the cartridge electrode is molded into the frame, and, the electroconductive resin injected from the injection receiving portion is branched to mold the first contact portion and the second contact portion so that an electroconductive path for electrically connecting the main assembly contact and the process means is formed | 02-05-2015 |
20150078779 | CARTRIDGE AND UNIT - A cartridge detachably mountable to a main assembly of an image forming apparatus, includes: a rotatable member; a blade member contacted to the rotatable member; a frame, formed of a resin material, for supporting the blade member; and a seal member provided on the frame to be contacted to a portion of the blade member, opposite from a portion where the blade member is contacted to the rotatable member, in each of one end side and anther end side of the blade member with respect to an axial direction of the rotatable member, wherein the seal member is formed on the frame by injection molding for sealing a gap between the blade member and the frame. | 03-19-2015 |
Patent application number | Description | Published |
20100190317 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SILICON OXIDE FILM FORMING METHOD - A semiconductor device manufacturing method has forming element isolation trenches in a semiconductor substrate, forming a silicon compound film in insides of the element isolation trenches in order to embed the element isolation trenches, conducting a first oxidation processing at a first temperature to reform a surface of the silicon compound film to a volatile matter emission preventing layer which permits passage of an oxidizing agent and impurities and which does not permit passage of a volatile matter containing silicon atoms, and conducting a second oxidation processing at a second temperature which is higher than the first temperature to form a coated silicon oxide film inside the element isolation trenches. | 07-29-2010 |
20100311220 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND NAND-TYPE FLASH MEMORY - A method for manufacturing semiconductor device has forming a plurality of trenches having at least two kinds of aspect ratios on a semiconductor substrate, filling the plurality of trenches with a coating material containing silicon, forming a mask on the coating material in a part of the trenches among the plurality of trenches filled with the coating material, implanting an ion for accelerating oxidation of the coating material into the coating material in the trenches on which the mask is not formed, forming a first insulating film by oxidizing the coating materials into which the ion is implanted, removing the coating material from the part of the trenches after removing the mask and forming a second insulating film in the part of the trenches from which the coating material is removed. | 12-09-2010 |
20120034754 | SEMICONDUCTOR DEVICE MANUFACATURING METHOD AND SILICON OXIDE FILM FORMING METHOD - A semiconductor device manufacturing method has forming element isolation trenches in a semiconductor substrate, forming a silicon compound film in insides of the element isolation trenches in order to embed the element isolation trenches, conducting a first oxidation processing at a first temperature to reform a surface of the silicon compound film to a volatile matter emission preventing layer which permits passage of an oxidizing agent and impurities and which does not permit passage of a volatile matter containing silicon atoms, and conducting a second oxidation processing at a second temperature which is higher than the first temperature to form a coated silicon oxide film inside the element isolation trenches. | 02-09-2012 |