Patent application number | Description | Published |
20080197485 | Module comprising a semiconductor chip comprising a movable element - The invention relates to a module comprising a carrier, a first semiconductor chip applied to the carrier and having a movable element and a second semiconductor chip applied to the first semiconductor chip, wherein an active first main surface of the first semiconductor chip faces the carrier and a first cavity is formed between the two semiconductor chips. | 08-21-2008 |
20080227235 | Sensor Component And Method For Producing A Sensor Component - A device for detecting a measured quantity has a sensor chip for detecting the measured quantity, a supply for providing a power supply, and an injection-molded enclosure for accommodating the sensor chip and the supply, the injection-molded enclosure including integrated conductive traces providing an electrical connection between the sensor chip and the supply. | 09-18-2008 |
20080236278 | Electrical device with covering - The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material. | 10-02-2008 |
20080251904 | CURING LAYERS OF A SEMICONDUCTOR PRODUCT USING ELECTROMAGNETIC FIELDS - A semiconductor product including a substrate, a semiconductor chip fitted to the substrate, and a layer, which contains coated particles, located adjacent to the semiconductor chip, wherein the coated particles have a ferromagnetic, ferrimagnetic or paramagnetic core and a coating. | 10-16-2008 |
20080298621 | MODULE INCLUDING A MICRO-ELECTRO-MECHANICAL MICROPHONE - A module including a micro-electro-mechanical microphone is disclosed. One embodiment provides a substrate having a trough-shaped depression and a micro-electro-mechanical microphone. The micro-electro-mechanical microphone is mounted into the trough-shaped depression of the substrate. | 12-04-2008 |
20080315399 | Semiconductor Device Having Through Contacts Through a Plastic Housing Composition and Method for the Production Thereof - The invention relates to a semiconductor device comprising through contacts through a plastic housing composition and a method for the production thereof. For this purpose, the wiring substrate has a solder deposit on which through contact elements are arranged vertically with respect to the wiring substrate and extend as far as the top side of the semiconductor device. | 12-25-2008 |
20090026560 | SENSOR PACKAGE - A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements. | 01-29-2009 |
20090057885 | SEMICONDUCTOR DEVICE - A semiconductor device is disclosed. One embodiment provides a semiconductor chip having a main surface, wherein a first molding compound accommodates the semiconductor chip. The first molding compound has a surface that is substantially coplanar to the main surface of the semiconductor chip. A second molding compound is arranged in a space between the first molding compound and the semiconductor chip. | 03-05-2009 |
20090080138 | FLUIDIC ELECTROSTATIC ENERGY HARVESTER - One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation vibration, etc.) of the device. Other embodiments of this device are also disclosed. | 03-26-2009 |
20090085704 | CHIP INDUCTOR - A chip inductor includes a first substrate and a second substrate. The first substrate includes at least one first conductive strip line having end terminals at a surface of the first substrate and the second substrate includes at least one second conductive strip line having end terminals at a surface of the second substrate, wherein a pitch of the end terminals on the first substrate corresponds to a pitch of the end terminals on the second substrate. Furthermore, conductive studs are provided which connect the end terminals on the first substrate with the end terminals on the second substrate to form an inductor loop. | 04-02-2009 |
20090102054 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip. | 04-23-2009 |
20090127638 | ELECTRICAL DEVICE AND METHOD - An electrical device and method is disclosed. One embodiment provides a substrate, a sensor chip disposed completely above a plane section of a surface of the substrate. A structurally homogeneous material layer is disposed above the substrate and the sensor chip. A cavity is formed between the substrate and the material layer. The sensor chip is disposed inside the cavity. | 05-21-2009 |
20090153138 | SENSOR MODULE AND METHOD FOR MANUFACTURING A SENSOR MODULE - A method of manufacturing a sensor module includes providing a substrate comprising an array of magnetically sensitive elements on a first main face of the substrate. An array of conducting lines is applied over the first main face of the substrate. An array of electrical interconnects is applied over the first main face of the substrate. The substrate is singulated after application of the electrical interconnects. | 06-18-2009 |
20090212645 | ELECTRONIC DEVICE FOR HARVESTING ENERGY - An electrical device for harvesting energy includes a container, a magnet situated in the container, a fluid partially filling the container, and a conductive member coiled around the container, wherein oscillation of the magnet through the coil induces an electrical signal. | 08-27-2009 |
20090243595 | SENSOR MODULE WITH MOLD ENCAPSULATION FOR APPLYING A BIAS MAGNETIC FIELD - A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one mold material that is configured to apply a bias magnetic field to the sensor element. | 10-01-2009 |
20090256361 | ENERGY HARVESTER - An energy harvesting system and method includes a rotatable member with an electrically conductive coil mounted to the rotatable member and adapted to move with the rotatable member such that the movement of the coil through a magnetic field induces a voltage in the coil. An energy storage device is coupled to the coil. | 10-15-2009 |
20090295381 | MAGNETIC SENSOR INTEGRATED CIRCUIT DEVICE AND METHOD - An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second surface that is not parallel to the first surface. A non-magnetic member is situated between the magnetic field sensor and the magnetic flux conducting member. | 12-03-2009 |
20090309191 | SEMICONDUCTOR DEVICE - A semiconductor device includes a wafer having a first surface opposite a second surface, and at least one laser irradiated region between the first and second surfaces. The laser irradiated region includes a laser-induced stress that is configured to minimize curvature of at least one of the first and second surfaces. | 12-17-2009 |
20090313817 | SENSOR MODULE - A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. | 12-24-2009 |
20100072626 | WAFER LEVEL PACKAGED MEMS INTEGRATED CIRCUIT - A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer. | 03-25-2010 |
20100078832 | SENSOR NODE MODULE - A method of manufacturing a sensor node module includes forming a protruding structure on a carrier. A sensor die is applied onto the protruding structure with an active sensing surface of the sensor die facing the carrier. The sensor die is encapsulated with mold material, wherein the protruding structure prevents the mold material from covering the active sensing surface. The carrier and the protruding structure are removed from the sensor die. | 04-01-2010 |
20100127355 | SEMICONDUCTOR DEVICE AND METHOD - A semiconductor device and method. One embodiment provides a semiconductor substrate having a plurality of cut regions. A metal layer is located within a cut region. The metal layer includes a recess, the recess having a slit-like shape. | 05-27-2010 |
20100181687 | SEMICONDUCTOR DEVICE INCLUDING SINGLE CIRCUIT ELEMENT - A semiconductor device includes a chip. The chip includes a single circuit element formed in a semiconductor substrate, a first metal layer on a first face of the semiconductor substrate, and a second metal layer on a second face of the semiconductor substrate opposite the first face. The first metal layer and the second metal layer are configured for accessing the single circuit element. A smaller of a first width of the first face of the semiconductor substrate and a second width of the first face of the semiconductor substrate perpendicular to the first width is less than or equal to a distance between an exposed face of the first metal layer parallel to the first face of the semiconductor substrate and an exposed face of the second metal layer parallel to the second face of the semiconductor substrate. | 07-22-2010 |
20100203676 | CHIP ASSEMBLY - A method of manufacturing an array of semiconductor devices comprises providing a first carrier having multiple chip alignment regions. Multiple chips are placed over the multiple chip alignment regions. Then, alignment of the chips to the multiple chip alignment regions is obtained. The multiple chips are then placed on a second carrier. The first carrier is detached from the multiple chips. An encapsulation material is applied to the multiple chips to form an encapsulated array of semiconductor chips. The second carrier is then detached from the encapsulated array of semiconductor devices. | 08-12-2010 |
20100221854 | SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes attaching a first semiconductor substrate to a support substrate, and thinning the first semiconductor substrate to form a thinned semiconductor layer. The method additionally includes integrating a functional element with the thinned semiconductor layer, and forming at least one through-connect through the thinned semiconductor layer. | 09-02-2010 |
20100230766 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 09-16-2010 |
20100264523 | Panel, Semiconductor Device and Method for the Production Thereof - A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components. | 10-21-2010 |
20100276769 | SEMICONDUCTOR DEVICE - A semiconductor device includes a magnetic sensor chip, an electrically conducting layer wafer-level patterned in contact with the magnetic sensor chip, encapsulation material disposed on the magnetic sensor chip, and an array of external contact elements electrically coupled with the magnetic sensor chip through the electrically conducting layer. | 11-04-2010 |
20100295140 | SEMICONDUCTOR DEVICE - A semiconductor device includes a housing defining a cavity, a magnetic sensor chip disposed in the cavity, and mold material covering the magnetic sensor chip and substantially filling the cavity. One of the housing or the mold material is ferromagnetic, and the other one of the housing or the mold material is non-ferromagnetic. | 11-25-2010 |
20100300191 | ACTIVE AND ADAPTIVE TIRE SYSTEMS - An active and adaptive tire system is disclosed. The active and adaptive tire system comprises a tire and an active material configured to alter at least one characteristic of the tire in response to at least one condition. Also disclosed are an intelligent tire system and a method of monitoring a condition. | 12-02-2010 |
20110001493 | FLUIDIC ELECTROSTATIC ENERGY HARVESTER - One embodiment of the present invention relates to a variable capacitor that operates without moving mechanical parts. In this capacitor electrically conductive electrodes are separated by an enclosed chamber filled with an electrically conductive material. The electrically conductive material can freely vary its position within the chamber. The capacitance of the device will vary as position of the conductive material changes due to external mechanical motion (ex: rotation, vibration, etc.) of the device. Other embodiments of this device are also disclosed. | 01-06-2011 |
20110012214 | MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT WITH CAVITY STRUCTURE AND METHOD FOR PRODUCING THE SAME - One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The microelectromechanical structure is surrounded by walls of at least one cavity. A covering, which covers the cavity, is arranged on the walls. The walls have a photolithographically patterned polymer. The covering has a layer with a polymer of identical type. In one case, the molecular chains of the polymer of the walls are crosslinked with the molecular chains of the polymer layer of the covering layer to form a dimensionally stable cavity housing. | 01-20-2011 |
20110027942 | SEMICONDUCTOR PACKAGE - A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip. | 02-03-2011 |
20110127998 | GMR SENSOR WITHIN MOLDED MAGNETIC MATERIAL EMPLOYING NON-MAGNETIC SPACER - An integrated circuit includes a leadframe, and a die having a top surface, a bottom surface, and a plurality of perimeter sides and including at least one magnetic field sensor element disposed proximate to the top surface, wherein the bottom surface is bonded to the leadframe. A molded magnetic material encapsulates the die and at least a portion of the leadframe, and provides a magnetic field substantially perpendicular to the top surface of the die. A non-magnetic material is disposed between the die and the molded magnetic material at least along perimeter sides of the die intersecting a lateral magnetic field component which is parallel to the top surface of the die. | 06-02-2011 |
20110147930 | Semiconductor Component of Semiconductor Chip Size with Flip-Chip-Like External Contacts - A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side. | 06-23-2011 |
20110163440 | SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes providing a carrier and attaching a plurality of semiconductor chips to the carrier. The semiconductor chips have a first electrode pad on a first main face and at least a second electrode pad on a second main face opposite to the first main face, whereby the first electrode pad is electrically connected to the carrier. A plurality of first bumps are formed on the carrier, the first bumps being made of a conductive material. The carrier is then singulated into a plurality of semiconductor devices, wherein each semiconductor device includes at least one semiconductor chip and one first bump. | 07-07-2011 |
20110210450 | SEMICONDUCTOR DEVICE WITH HOLLOW STRUCTURE - A device comprising a chip, which is held in casting compound and on which a hollow structure is arranged is disclosed. | 09-01-2011 |
20110241190 | Semiconductor Package - A method of manufacturing a semiconductor package includes providing a carrier and attaching at least one semiconductor piece to the carrier. An encapsulant is deposited onto the at least one semiconductor piece to form an encapsulated semiconductor arrangement. The encapsulated semiconductor arrangement is then singulated in at least two semiconductor packages, wherein each package includes a semiconductor die separated from the semiconductor piece during singulation. | 10-06-2011 |
20110241197 | Device and Method for Manufacturing a Device - A device includes a first semiconductor chip and a first encapsulant that encapsulates the first semiconductor chip and that includes a cavity. A carrier and an electrical component are mounted on the carrier. The carrier is arranged such that the electrical component is enclosed by the cavity. | 10-06-2011 |
20110298088 | Semiconductor Package with Integrated Inductor - A semiconductor package includes a semiconductor chip. An inductor is applied to the semiconductor chip. The inductor has at least one winding. An encapsulation body is formed of an encapsulation material. The encapsulation material contains a magnetic component and fills a space within the winding to form a magnetic winding core. | 12-08-2011 |
20120012949 | PRESSURE SENSOR PACKAGE SYSTEMS AND METHODS - Embodiments relate to integrated circuit (IC) sensors and sensing systems and methods. In an embodiment, an IC sensor device includes at least one sensing element; a framing element disposed around the at least one sensing element at a wafer-level; and a package having at least one port predefined at the wafer-level by the framing element, the at least one port configured to expose at least a portion of the at least one sensing element to an ambient environment. | 01-19-2012 |
20120038352 | Sensor Package and Method of Manufacturing Thereof - A sensor package and a method for manufacturing a sensor package are disclosed. An embodiment comprises a sensor and a conductive line, wherein the sensor is arranged proximate to the conductive line. The sensor and the conductive line are isolated and at least partially encapsulated. A soft magnet is arranged in, on and/or around the encapsulation, wherein the soft magnet comprises a composition of an insulating material and a material having soft magnetic properties. | 02-16-2012 |
20120073371 | MICROELECTROMECHANICAL SENSOR - In various embodiments, a microelectromechanical system may include a mass element; a substrate; a signal generator; and a fixing structure configured to fix the mass element to the substrate; wherein the mass element is fixed in such a way that, upon an acceleration of the microelectromechanical system, the mass element can be moved relative to the substrate in at least two spatial directions, and wherein a signal is generated by the movement of the mass element by means of the signal generator. | 03-29-2012 |
20120073372 | MICROELECTROMECHANICAL SYSTEM - In various embodiments, a microelectromechanical system may include a chip, a substrate, a signal generator, and a fixing structure configured to fix the chip to the substrate. The chip may be fixed in such a way that, upon an acceleration of the microelectromechanical system, the chip is moved relative to the substrate. Furthermore, a signal may be generated by the movement of the chip by means of the signal generator. | 03-29-2012 |
20120126344 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 05-24-2012 |
20120162948 | SENSOR MODULE - A sensor module. One embodiment provides a cap whose perimeter defines a rim. A first semiconductor chip is attached to the cap. The first semiconductor chip includes first connection elements. The rim and the first connection elements define a common plane. | 06-28-2012 |
20120273935 | Semiconductor Device and Method of Making a Semiconductor Device - A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate. | 11-01-2012 |
20120285230 | ACTIVE AND ADAPTIVE TIRE SYSTEMS - Next-generation intelligent tire systems, such as active and adaptive tire systems and methods, are disclosed. Various embodiments of the invention can sense actual tire, road and driving conditions and characteristics, and/or respond to externally controlled influences, and dynamically adapt thereto, thereby improving vehicle and passenger safety. | 11-15-2012 |
20120299170 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module comprises a first semiconductor device, a frame arranged on the first semiconductor device, the frame comprising a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 11-29-2012 |
20120309130 | Method of Manufacturing a Semiconductor Device - In one embodiment a method for manufacturing a semiconductor device comprises arranging a wafer on a carrier, the wafer comprising singulated chips; bonding the singulated chips to a support wafer, and removing the carrier. | 12-06-2012 |
20130001803 | METHOD FOR ATTACHING A METAL SURFACE TO A CARRIER, A METHOD FOR ATTACHING A CHIP TO A CHIP CARRIER, A CHIP-PACKAGING MODULE AND A PACKAGING MODULE - A method for attaching a metal surface to a carrier is provided, the method including: depositing a porous layer over at least one of a metal surface and a side of a carrier; and attaching the at least one of a metal surface and a side of a carrier to the porous layer by bringing a material into pores of the porous layer, resulting in the material forming an interconnection between the metal surface and the carrier. | 01-03-2013 |
20130043575 | CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE - A chip-packaging module for a chip is provided, the chip-packaging module including a chip including a first chip side, wherein the first chip side includes an input portion configured to receive a signal; a chip carrier configured to be in electrical connection with the first chip side, wherein the chip is mounted to the chip carrier via the first chip side; and a mold material configured to cover the chip on at least the first chip side, wherein at least part of the input portion is released from the mold material. | 02-21-2013 |
20130056703 | Sensor Device and Method - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 03-07-2013 |
20130082340 | APPARATUS HAVING A BACK-BIAS MAGNET AND A SEMICONDUCTOR CHIP ELEMENT - An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element. | 04-04-2013 |
20130088941 | SONIC SENSORS AND PACKAGES - Embodiments relate to integrated sonic sensors having a transmitter, a receiver and driver electronics integrated in a single, functional package. In one embodiment, a piezoelectric signal transmitter, a silicon microphone receiver and a controller/amplifier chip are concomitantly integrated in a semiconductor housing. The semiconductor housing, in embodiments, is functional in that at least a portion of the housing can comprise the piezoelectric element of the transmitter, with an inlet aperture opposite the silicon microphone receiver. | 04-11-2013 |
20130095609 | Device and Method for Manufacturing a Device - A device includes a first semiconductor chip and a first encapsulant that encapsulates the first semiconductor chip and that includes a cavity. A carrier and an electrical component are mounted on the carrier. The carrier is arranged such that the electrical component is enclosed by the cavity. | 04-18-2013 |
20130122660 | SENSOR DEVICE AND METHOD - A sensor device and method. One embodiment provides a first semiconductor chip having a sensing region. A porous structure element is attached to the first semiconductor chip. A first region of the porous structure element faces the sensing region of the first semiconductor chip. An encapsulation material partially encapsulates the first semiconductor chip and the porous structure element. | 05-16-2013 |
20130152696 | MICROMECHANICAL SEMICONDUCTOR SENSING DEVICE - Micromechanical semiconductor sensing device comprises a micromechanical sensing structure being configured to yield an electrical sensing signal, and a piezoresistive sensing device provided in the micromechanical sensing structure, said piezoresistive sensing device being arranged to sense a mechanical stress disturbing the electrical sensing signal and being configured to yield an electrical disturbance signal based on the sensed mechanical stress disturbing the electrical sensing signal. | 06-20-2013 |
20130175527 | SENSOR ARRANGEMENT, A MEASUREMENT CIRCUIT, CHIP-PACKAGES AND A METHOD FOR FORMING A SENSOR ARRANGEMENT - A sensor arrangement is provided, the sensor arrangement including a chip including a sensor circuit configured to detect a bending of the chip; and a package structure configured to protect the chip; wherein the package structure includes a first region and a second region, and wherein the package structure is configured such that it is easier to be deformed in the first region than in the second region. | 07-11-2013 |
20130187201 | Sensor Device and Method - A sensor device includes a semiconductor chip. The semiconductor chip has a sensing region sensitive to mechanical loading. A pillar is mechanically coupled to the sensing region. | 07-25-2013 |
20130234330 | Semiconductor Packages and Methods of Formation Thereof - In one embodiment, a method of forming a semiconductor package includes applying a film layer having through openings over a carrier and attaching a back side of a semiconductor chip to the film layer. The semiconductor chip has contacts on a front side. The method includes using a first common deposition and patterning step to form a conductive material within the openings. The conductive material contacts the contacts of the semiconductor chip. A reconfigured wafer is formed by encapsulating the semiconductor chip, the film layer, and the conductive material in an encapsulant using a second common deposition and patterning step. The reconfigured wafer is singulated to form a plurality of packages. | 09-12-2013 |
20130260510 | 3-D Integrated Circuits and Methods of Forming Thereof - In one embodiment, a method of forming a semiconductor device includes stacking a second wafer with a first wafer and forming a through via extending through the second wafer while the second wafer is stacked with the first wafer. In another embodiment, a method of forming a semiconductor device includes singulating a first wafer into a first plurality of dies and attaching the first plurality of dies over a second wafer having a second plurality of dies. The method further includes forming a through via extending through a die of the first plurality of dies after attaching the first plurality of dies over the second wafer. | 10-03-2013 |
20130277864 | METHOD FOR PRODUCING A COMPONENT AND DEVICE COMPRISING A COMPONENT - A method for producing a component and device including a component is disclosed. A basic substrate having paper as substrate material is provided, at least one integrated circuit is applied to the basic substrate, the at least one integrated circuit applied on the basic substrate is enveloped with an encapsulant, and at least parts of the basic substrate are removed from the at least one enveloped integrated circuit. | 10-24-2013 |
20130292852 | CHIP EMBEDDED PACKAGES AND METHODS FOR FORMING A CHIP EMBEDDED PACKAGE - A chip embedded package is provided, the chip embedded package including: a plurality of dies; wherein a first die of the plurality of dies is a chip implementing a first sensor technology, and wherein a second die of the plurality of dies is a chip implementing a second sensor technology; and wherein the plurality of dies are molded with an encapsulation material; wherein at least one of the first die and the second die includes a film interconnect. | 11-07-2013 |
20130313719 | CHIP PACKAGES AND METHODS FOR MANUFACTURING A CHIP PACKAGE - A method for manufacturing a chip package is provided. The method including: holding a carrier including a plurality of dies; forming a separation between the plurality of dies by removing from the carrier one or more portions of the carrier between the plurality of dies; forming an encapsulation material in the removed one or more portions between the plurality of dies; separating the dies through the encapsulation material. | 11-28-2013 |
20140042565 | Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device - A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area. | 02-13-2014 |
20140071642 | LOW STRESS COMPONENT PACKAGE - Representative implementations of devices and techniques provide mechanical isolation to a sensor component mounted within a housing. The housing may have a cavity, and may be arranged such that the cavity faces a carrier. An aperture may be located in a surface of the housing to provide access to the sensor component. | 03-13-2014 |
20140097514 | Semiconductor Package and Method for Fabricating the Same - A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material. | 04-10-2014 |
20140103463 | MEMS SENSOR PACKAGE SYSTEMS AND METHODS - Embodiments relate to sensor and sensing devices, systems and methods. In an embodiment, a micro-electromechanical system (MEMS) device comprises at least one sensor element; a framing element disposed around the at least one sensor element; at least one port defined by the framing element, the at least one port configured to expose at least a portion of the at least one sensor element to an ambient environment; and a thin layer disposed in the at least one port. | 04-17-2014 |
20140151701 | EMBEDDED CHIP PACKAGE, A CHIP PACKAGE, AND A METHOD FOR MANUFACTURING AN EMBEDDED CHIP PACKAGE - An embedded chip package is provided. The embedded chip package includes a plurality of chips; encapsulation material embedding the plurality of chips; at least one electrical redistribution layer electrically connected to the plurality of chips; and a common terminal connected to the at least one electrical redistribution layer, wherein the common terminal provides an interface to at least one of transmit and receive a common electrical signal between the plurality of chips and the common terminal. | 06-05-2014 |
20140170446 | Sensor Module and Battery Elements - A sensor module includes an enclosure adapted to hermetically seal an opening or a hole on the outer surface of a casing or packaging, a sensor element and a membrane. The membrane is arranged between the enclosure and the opening or hole of the casing or packaging. | 06-19-2014 |
20140197503 | SENSOR PACKAGE - A sensor package is disclosed. One embodiment provides a sensor device having a carrier, a semiconductor sensor mounted on the carrier and an active surface. Contact elements are electrically connecting the carrier with the semiconductor sensor. A protective layer made of an inorganic material covers at least the active surface and the contact elements. | 07-17-2014 |
20140203380 | CHIP PACKAGE COMPRISING A MICROPHONE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME - In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material. | 07-24-2014 |
20140205128 | CHIP ARRANGEMENT AND A METHOD FOR MANUFACTURING THE SAME - In various embodiments, a method for manufacturing a chip arrangement, the method including bonding a microphone chip to a first carrier, the microphone chip including a microphone structure, depositing adhesive material laterally disposed from the microphone structure, and arranging the microphone structure into a cavity of a second carrier such that the adhesive material fixes the microphone chip to the cavity of the second carrier. | 07-24-2014 |
20140231971 | CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT - In various embodiments, a chip arrangement may be provided. The chip arrangement may include a metallic carrier. The chip arrangement may also include at least one chip arranged on the metallic carrier, wherein the at least one chip includes a chip contact, wherein the chip contact is electrically coupled to the metallic carrier. The chip arrangement may also include encapsulation material at least partially encapsulating the at least one chip. The chip arrangement may also include an electrically conductive shielding structure formed over at least a portion of the encapsulation material to electrically contact the metallic carrier. | 08-21-2014 |
20140231974 | Module and Method of Manufacturing a Module - A module and a method for manufacturing a module are disclosed. An embodiment of a module includes a first semiconductor device, a frame arranged on the first semiconductor device, the frame including a cavity, and a second semiconductor device arranged on the frame wherein the second semiconductor device seals the cavity. | 08-21-2014 |
20140264255 | Method for Making a Sensor Device Using a Graphene Layer - A graphene layer is generated on a substrate. A plastic material is deposited on the graphene layer to at least partially cover the graphene layer. The substrate is separated into at least two substrate pieces. | 09-18-2014 |
20140312439 | Microphone Module and Method of Manufacturing Thereof - A microphone module includes a package including a semiconductor chip and having a recess on an upper surface and a micro-electro-mechanical microphone being electrically connected to the package. Further, the micro-electro-mechanical microphone is arranged on the upper surface of the package. The recess forms an acoustic back volume of the micro-electro-mechanical microphone. | 10-23-2014 |
20140319627 | CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME - In various embodiments, a chip package is provided. The chip package may include at least one chip having a plurality of pressure sensor regions and encapsulation material encapsulating the chip. | 10-30-2014 |
20140332912 | CHIP PACKAGE AND A METHOD OF MANUFACTURING THE SAME - In various embodiments, a method for manufacturing a chip package is provided. The method includes arranging a chip over a substrate, the chip including a microphone structure and an opening to the microphone structure; and encapsulating the chip with encapsulation material such that the opening is kept at least partially free from the encapsulation material. | 11-13-2014 |
20150019165 | WEIGHT DETECTION BY TIRE PRESSURE SENSING - A system includes a set of tire pressure sensors for tires of a vehicle, a control module and a user interface. The control module is configured to receive tire pressure information from the tire pressure sensors and calculate a weight or a change in weight of the vehicle based on the tire pressure information. The user interface configured to present, to a user, an indication of the weight or the change in weight of the vehicle calculated by the control module. | 01-15-2015 |
20150023523 | Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals - A surface mountable microphone package comprises a first microphone and a second microphone. Furthermore, the surface mountable microphone package comprises a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. | 01-22-2015 |
20150024807 | Surface Mountable Microphone Package, a Microphone Arrangement, a Mobile Phone and a Method for Recording Microphone Signals - A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package. | 01-22-2015 |
20150028436 | Apparatus Comprising and a Method for Manufacturing an Embedded MEMS Device - A system and a method for forming a packaged MEMS device are disclosed. In one embodiment a packaged MEMS device includes a MEMS device having a first main surface with a first area along a first direction and a second direction, a membrane disposed on the first main surface of the MEMS device and a backplate adjacent to the membrane. The packaged MEMS device further includes an encapsulation material that encapsulates the MEMS device and that defines a back volume, the back volume having a second area along the first direction and the second direction, wherein the first area is smaller than the second area. | 01-29-2015 |
20150059454 | Sensor arrangement - A sensor arrangement for sensing an environmental property of an environment of the sensor arrangement, the sensor arrangement comprising:
| 03-05-2015 |
20150061045 | MEMS Device - A MEMS device includes a first chip and a MEMS chip. The first chip has a mounting surface and includes at least an integrated circuit. The MEMS chip has a main surface on which a first set of contact pads for contacting the MEMS device and a second set of contact pads for contacting the first chip are arranged. The first chip is mechanically attached and electrically connected to the second set of contact pads via the mounting surface facing the main surface. The mounting surface of the first chip is at least 25% smaller than the main surface of the MEMS chip. | 03-05-2015 |
20150076636 | Current Sensor Device - A current sensor device for sensing a measuring current includes a semiconductor chip having a magnetic field sensitive element. The current sensor device further includes an encapsulant embedding the semiconductor chip. A conductor configured to carry the measuring current is electrically insulated from the magnetic field sensitive element. A redistribution structure includes a first metal layer having a first structured portion which forms part of the conductor. | 03-19-2015 |