Horasawa
Akio Horasawa, Matsumoto-Shi JP
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20100068432 | ELASTIC MEMBER FOR INK JET RECORDING APPARATUS, INK JET RECORDING APPARATUS INCLUDING ELASTIC MEMBER, ELASTIC MEMBER FOR INK TANK AND INK TANK INCLUDING ELASTIC MEMBER - An elastic member for an ink jet recording apparatus comprising a material containing 100 parts by weight of a block copolymer having a crystalline polyolefin block and an amorphous polyolefin block, 3 to 40 parts by weight of a polyolefin resin and 40 to 250 parts by weight of a softening agent. | 03-18-2010 |
Takayasu Horasawa, Matsumoto-Shi JP
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20110042816 | SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF - A semiconductor apparatus includes an aluminum electrode film formed on a semiconductor chip; and a nickel plated layer formed on the aluminum electrode film, wherein a concentration of sodium and potassium present in the nickel plated layer and at an interface between the nickel plated layer and the aluminum electrode film is 3.20×10 | 02-24-2011 |
Takayasu Horasawa, Matsumoto City JP
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20100240213 | Method of manufacturing a semiconductor device - A method of manufacturing a semiconductor device on a semiconductor substrate, includes the steps of forming a first metal film on a front surface of the semiconductor substrate; forming a second metal film on the surface of the first metal film; activating a surface of the second metal film to provide an activated surface; and forming a plated film on the activated surface by a wet plating method in a plating bath that includes a reducing agent that is oxidized during plating and that has a rate of oxidation, wherein the second metal film is a metal film mainly composed of a first substance that enhances the rate of oxidation of the reducing agent in the plating bath. Wet plating is preferably an electroless process. | 09-23-2010 |