Patent application number | Description | Published |
20100053918 | ELECTRONIC-PARTS PACKAGE AND MANUFACTURING METHOD THEREFOR - An electronic-parts package includes a base member, a conductive member extending through the base member, the conductive member having the insulating substance on the surface removed by polishing, electronic parts disposed on one surface of the conductive member through a connection portion, an exterior electrode disposed through a metal film on the opposite surface of the surface of the base member on which the electronic parts is disposed, and a cap member that protects the electronic parts on the base member. | 03-04-2010 |
20100290201 | ELECTRONIC COMPONENT, MANUFACTURING METHOD FOR ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE - To provide an improved solderability for mounting an electronic component onto a circuit board, a package of an electronic component ( | 11-18-2010 |
20100295421 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND BASE MEMBER MANUFACTURING METHOD - An electronic component capable of withstanding stress from a printed-circuit board or the like is provided. In an electronic component, a cavity hermetically sealed by a base and a lid is formed. In the cavity, a crystal resonator is supported by a supporting member over the top surface of the base. The base is made of glass. A stress buffer layer made of a conductive resin or the like is formed over the whole bottom surface of the base. An external electrode and an external electrode that are in continuity with the electrodes of the crystal resonator individually extend to the bottom surface of the stress buffer layer via the side surfaces of the base and stress buffer layer. The thus configured electronic component is surface-mounted by, for example, soldering the external electrode and external electrode formed on the bottom surface of the stress buffer layer to a printed-circuit board. | 11-25-2010 |
20100326721 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - In a structure where an electronic component is mounted on a glass base material, an external electrode is provided on an opposite side to the component mounted on the base, and a through electrode and the base are welded to each other at a temperature equal to or higher than a glass softening point, electrical conduction is ensured between the electronic component and the external electrode. An electronic device includes a base, a through electrode which pass through the base and has a metal film formed on both end surfaces after an insulating material on the surface is removed by polishing, an electronic component which is provided on one surface of the through electrode through a connection portion, an external electrode which is provided on an opposite side to a side of the base on which the electronic component is provided, and a cap which protects the electronic component on the base. | 12-30-2010 |
20110179613 | PACKAGE MANUFACTURING METHOD, PIEZOELECTRIC VIBRATOR MANUFACTURING METHOD, OSCILLATOR, ELECTRONIC DEVICE, AND RADIO-CONTROLLED TIMEPIECE - A package manufacturing method capable of manufacturing a package easily and efficiently. The package manufacturing method includes a jig disposing step of disposing a covering jig covering an outer peripheral portion on one surface of a first board so as to expose a hole forming region through a jig opening formed on the covering jig; and a filling step of filling a filling material constituting at least a part of penetration electrodes into holes. The filling step includes a metal mask disposing step of disposing a metal mask | 07-28-2011 |
20120044025 | ELECTRONIC DEVICE, ELECTRONIC APPARATUS, AND ELECTRONIC DEVICE MANUFACTURING METHOD - An electronic device is provided which includes a base, a through-electrode that passes through the base and from which an insulating material on an end face thereof is removed by polishing, a circuit pattern that is formed on an end face of the through-electrode, an electronic component that is disposed via an internal wiring formed on the circuit pattern, an electrode pattern that is formed on the surface of the base opposite to the surface on which the electronic component is disposed and that is connected to the other end face of the through-electrode, an external electrode that is formed on the electrode pattern, and a cap that is bonded to the base so as to protect the electronic component on the base. | 02-23-2012 |
20120153779 | ELECTRONIC COMPONENT - An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering. | 06-21-2012 |
20120248298 | OPTICAL SENSOR AND METHOD OF MANUFACTURING THE OPTICAL SENSOR - An optical sensor has a glass base having a concave portion, and a glass lid is bonded to the base and overlies the concave portion to form an hermetically sealed cavity portion. A photoelectric conversion element is accommodated in the cavity portion. Internal wirings are each connected at one end to the photoelectric conversion element and extend through notches formed in a peripheral edge of the base. The other ends of the internal wirings are connected inside the notches to external wirings that extend along an outside surface of the base and terminate in external terminals. | 10-04-2012 |
20150022988 | LID BODY PORTION AND ELECTRONIC DEVICE PACKAGE USING THE LID BODY PORTION AND ELECTRONIC DEVICE - To provide a lid body portion with an improved mounting ratio of an electronic device component, an electronic device package and an electronic device including the same. There is provided a lid body portion including a concave portion in which a space portion is formed by a bottom portion and a side plate portion and a flange portion extending from an outer edge portion in an opening portion of the concave portion to the outside, in which a side-plate inner surface as a surface facing the space portion of the concave portion in the side plate portion inclines to the outside of the space portion. | 01-22-2015 |
Patent application number | Description | Published |
20090289016 | REDUCING WATER PURIFICATION MATERIAL, METHOD FOR PRODUCING REDUCING WATER PURIFICATION MATERIAL, METHOD FOR TREATING WASTEWATER, AND WASTEWATER TREATMENT APPARATUS - A reducing water purification material having a reducing iron-based precipitate selected from green rust, iron ferrite, reducing iron hydroxide, and a mixture thereof. A wastewater treatment process having steps of adding a reducing iron compound to wastewater, leading the wastewater to which the reducing iron compound is added to a reaction tank and forming a precipitate, separating the formed precipitate by a solid-liquid separation to obtain a sludge, and alkalinizing all or a portion of the separated sludge to form an alkaline sludge followed by returning to the reaction tank, wherein in the precipitation step, the wastewater to which the reducing iron compound is added and the alkaline sludge are mixed and are allowed to react in a non-oxidizing atmosphere under alkaline condition to form a reducing iron compound precipitate as the precipitate, thereby incorporating contaminants in the precipitate to remove the contaminants from the wastewater. | 11-26-2009 |
20100000924 | REDUCING WATER PURIFICATION MATERIAL, METHOD FOR PRODUCING REDUCING WATER PURIFICATION MATERIAL, METHOD FOR TREATING WASTEWATER, AND WASTEWATER TREATMENT APPARATUS - A reducing water purification material having a reducing iron-based precipitate selected from green rust, iron ferrite, reducing iron hydroxide, and a mixture thereof. A wastewater treatment process having steps of adding a reducing iron compound to wastewater, leading the wastewater to which the reducing iron compound is added to a reaction tank and forming a precipitate, separating the formed precipitate by a solid-liquid separation to obtain a sludge, and alkalinizing all or a portion of the separated sludge to form an alkaline sludge followed by returning to the reaction tank, wherein in the precipitation step, the wastewater to which the reducing iron compound is added and the alkaline sludge are mixed and are allowed to react in a non-oxidizing atmosphere under alkaline condition to form a reducing iron compound precipitate as the precipitate, thereby incorporating contaminants in the precipitate to remove the contaminants from the wastewater. | 01-07-2010 |