Patent application number | Description | Published |
20090134498 | SEMICONDUCTOR APPARATUS - The present invention includes a semiconductor element provided with an electrode passing through front and back sides. The electrode is formed as a cylinder including a hollow portion, and stress relaxing material is provided in the hollow portion, which is used to reduce stress that is induced between the semiconductor element and the electrode. The stress relaxing material is an elastic body made of resin material. | 05-28-2009 |
20090134506 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND FLEXIBLE SUBSTRATE FOR MOUNTING SEMICONDUCTOR - A semiconductor device includes a second semiconductor package, which includes a substrate and at least one semiconductor package. The substrate includes a terminal group formed on a surface thereof. At least one first semiconductor package is stacked on the substrate, and includes a plurality of flexible substrates, each of which includes a wiring group on a surface thereof and each of which is bending-deformable. At least one first semiconductor package includes a plurality of semiconductor elements mounted on a plurality of flexible substrates. Electric conduction through the second semiconductor package is established by connecting the wiring group on each of a plurality of flexible substrates to the terminal group on the substrate. Further, at least one terminal of the terminal group on the substrate is electrically connected to all of the plurality of semiconductor elements on at least one first semiconductor package, and at least one other terminal of the terminal group is electrically connected only to particular semiconductor elements of the plurality of semiconductor elements. | 05-28-2009 |
20100224984 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE IN WHICH CIRCUIT BOARD AND SEMICONDUCTOR CHIP ARE CONNECTED BY LEADS - A semiconductor device according to one embodiment has a wiring circuit board, a semiconductor chip, a die attach material and bumps. The semiconductor chip is mounted on the wiring circuit board. The die attach material is provided between the wiring circuit board and the semiconductor chip. A wiring layer is provided on one surface of the wiring circuit board. Leads are extended from the wiring layer and connected to the semiconductor chip. The bumps are provided at outer positions relative to the region where the semiconductor chip of the wiring circuit board is mounted. The wiring layer in the wiring circuit board is formed on the surface opposite from the surface on which the semiconductor chip is mounted. | 09-09-2010 |
20100295162 | Semiconductor device - Portions of a wiring layer extending like cantilevers from an inner peripheral edge of an opening in a substrate are joined to respective terminals of a semiconductor chip mounted on the substrate. A junction portion between each portion of the wiring layer and the corresponding terminal is sealed with resin. | 11-25-2010 |
20120302007 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT THICKNESS - In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip. | 11-29-2012 |
20130093083 | SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR DEVICE - A semiconductor device according to one embodiment has a wiring circuit board, a semiconductor chip, a die attach material and bumps. The semiconductor chip is mounted on the wiring circuit board. The die attach material is provided between the wiring circuit board and the semiconductor chip. A wiring layer is provided on one surface of the wiring circuit board. Leads are extended from the wiring layer and connected to the semiconductor chip. The bumps are provided at outer positions relative to the region where the semiconductor chip of the wiring circuit board is mounted. The wiring layer in the wiring circuit board is formed on the surface opposite from the surface on which the semiconductor chip is mounted. | 04-18-2013 |
20140252576 | Semiconductor Device and Manufacturing Method Thereof - A semiconductor device has a packaging structure in which a top surface of a semiconductor chip | 09-11-2014 |
20160108514 | METHOD AND APPARATUS FOR PRODUCING NANOSTRUCTURES, AND SUBSTRATE STRUCTURE INCLUDING NANOSTRUCTURES - Provided are a method and an apparatus for producing nanostructures. The method and the apparatus can form the nanostructures having fine dimensions from a wider variety of materials. Also provided is a substrate structure including nanostructures formed from a material that is industrially widely applicable. A method forms a plurality of nanostructures on a flat surface of a substrate. The method includes the step a) of evaporating a main material for the nanostructures onto the flat surface of the substrate. In the step a), the substrate is controlled to have an absolute temperature equal to or lower than 0.25 time the melting point (absolute temperature) of the main material for the nanostructures. This enables the formation of fine nanostructures having a desired shape from a desired material. | 04-21-2016 |