Hiromichi Kobayashi
Hiromichi Kobayashi, Saitama-Ken JP
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20110019077 | CAMERA MODULE FABRICATING METHOD AND CAMERA MODULE - There is disclosed a method for fabricating a camera module includes the steps of: disposing a camera module body inside of a die; filling the die with a resin blocking a light; curing the resin; and removing the camera module body and the resin from the die. Here, disposing the camera module body inside of the die is disposing the camera module body having a lens holder secured on a sensor board inside of the die in such a manner that the side surface of the camera module body is not brought into contact with the side surface of the die. Filling the die with the resin is covering the upper end of the die with a lid so as to closely enclose the inside of the die, followed by filling the die with the resin. Taking the camera module body and the resin from the die is taking, from the die, the camera module body and the resin formed around the camera module body in close contact. | 01-27-2011 |
Hiromichi Kobayashi, Chiba JP
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20080238450 | METHOD FOR INSPECTING QUALITY OF CORE MATERIAL FOR ELECTROPHOTOGRAPHIC FERRITE CARRIER - An object of the present invention is to provide a quality inspection method for obtaining a specifying factor which can more reliably indicate powder characteristics of a core material for an electrophotographic ferrite carrier. To achieve the object, a method for inspecting the quality of a core material for an electrophotographic ferrite carrier adopts a method characterized in that the impedance of the core material for the electrophotographic ferrite carrier is measured by using an AC-resistance measurement method to obtain a Nyquist diagram (Cole-Cole plot) in which a real number impedance (Z′) is arranged in an X-axis and an imaginary number impedance (Z″) is arranged in a Y-axis and then the characteristics of the particles of the core material for the electrophotographic ferrite carrier is evaluated by using the Nyquist diagram (Cole-Cole plot). Here, the quality of a core material for the electrophotographic ferrite carrier is judged according to a predetermined equivalent circuit by using the value of the parameters one or two or more in combination selected from |Rs|, Rp | 10-02-2008 |
20080241726 | RESIN-FILLED FERRITE CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER, PRODUCTION METHOD THEREOF AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE FERRITE CARRIER - Employed are a resin-filled ferrite carrier for an electrophotographic developer filled with a resin in voids of a porous ferrite core material, wherein the resin filled in the voids is a silicone resin which has a softening point of 40° C. or above and is cured at or above such softening point, and the filled amount is 7 to 30 parts by weight based on 100 parts by weight of the core material, a method for producing thereof band an electrophotographic developer using this ferrite carrier. | 10-02-2008 |
20100111816 | INORGANIC PARTICLE-CONTAINING EMULSION AND MANUFACTURING METHOD OF A PARTICLE BY USING THE INORGANIC PARTICLE-CONTAINING EMULSION - The invention aims at providing an inorganic particle-containing emulsion which enables further size reduction of particles and can bring about a mono-disperse system and an enhanced yield and a manufacturing method of a particle by the use of the emulsion. This aim can be performed by a water in oil emulsion prepared by mixing an oil phase liquid and an water phase liquid which contains inorganic particles under agitation, in which the water phase liquid contains inorganic particle having a specific gravity of 1.5 to 11 g/cm | 05-06-2010 |
Hiromichi Kobayashi, Nagareyama-Shi JP
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20090239173 | RESIN-FILLED CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER, AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE RESIN-FILLED CARRIER - A resin-filled carrier for an electrophotographic developer obtained by filling resin into voids of a porous ferrite core material, wherein the porous ferrite core material has a pore volume of 0.04 to 0.16 mL/g and a peak pore size of 0.9 to 2.0 μm, and wherein microparticles are included in the resin to be filled, and an electrophotographic developer using this resin-filled carrier. | 09-24-2009 |
20090246526 | FERRITE PARTICLES AND PRODUCTION METHOD THEREOF - A method for producing ferrite particles by weighing, mixing, then crushing ferrite raw materials, and granulating the resultant slurry, and then sintering the resultant granulated material using a rotary furnace, wherein the sintering is carried out under a positive pressure reducing atmosphere. | 10-01-2009 |
20090263739 | RESIN-FILLED CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER, AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE RESIN-FILLED CARRIER - A resin-filled carrier for an electrophotographic developer obtained by filling resin into voids of a porous ferrite core material, wherein the porous ferrite core material has a pore volume of 0.04 to 0.16 mL/g and a peak pore size of 0.9 to 2.0 μm, and an electrophotographic developer using this resin-filled carrier. | 10-22-2009 |
20100055601 | RESIN-FILLED CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE RESIN-FILLED CARRIER - A resin-filled carrier for an electrophotographic developer which carrier is obtained by filling a resin in the voids of a porous ferrite core material, wherein the Cl concentration of the porous ferrite core material, measured by an elution method, is 10 to 280 ppm and the resin contains an amine compound, and an electrophotographic developer using the resin-filled carrier. | 03-04-2010 |
20110195357 | RESIN-FILLED FERRITE CARRIER CORE MATERIAL FOR ELECTROPHOTOGRAPHIC DEVELOPER, FERRITE CARRIER AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE FERRITE CARRIER - Disclosed are a resin-filled ferrite carrier core material for an electrophotographic developer, including a porous ferrite particle, wherein the composition of the porous ferrite particle is represented by the following formula (1), and part of (MgO) and/or (Fe | 08-11-2011 |
Hiromichi Kobayashi, Naganeyama-Shi JP
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20090176170 | RESIN-FILLED CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER, AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE RESIN-FILLED CARRIER - A resin-filled carrier for an electrophotographic developer obtained by filling resin into voids of a porous ferrite core material, wherein the porous ferrite core material has a pore volume of 0.055 to 0.16 mL/g and a peak pore size of 0.20 to 0.7 μm, and an electrophotographic developer using this resin-filled carrier. | 07-09-2009 |
Hiromichi Kobayashi, Kashiwa-Shi JP
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20080199800 | RESIN-FILLED FERRITE CARRIER FOR ELECTROPHOTOGRAPHIC DEVELOPER AND ELECTROPHOTOGRAPHIC DEVELOPER USING THE FERRITE CARRIER - A resin-filled ferrite carrier for an electrophotographic developer filled with a silicone resin in voids of a porous ferrite core material which continuously extend from a surface to a core interior, wherein the resin-filled ferrite carrier has an average particle size of 20 to 50 μm, and (Si/Fe)×100 as determined from X-ray fluorescence elemental analysis is 2.0 to 7.0, and the particle size and (Si/Fe)×100 are correlated, and wherein in the correlation relationship between [(Si/Fe)×100] and the particle size, a gradient (a) in a correlation equation thereof is −0.50≦a≦0.15. | 08-21-2008 |
Hiromichi Kobayashi, Saitama JP
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20110109791 | CERAMIC PACKAGE AND CAMERA MODULE - According to one embodiment, a ceramic package of which inner space is sealed by a ceramic base plate and a cover portion mounted on the ceramic base plate. The ceramic package has an image sensor, an element unit and a lead electrode. The image sensor and the element unit are mounted on the ceramic base plate. The lead electrode is formed on the ceramic base plate and electrically connected to the image sensor by a bonding wire. A surface on which the lead electrode is formed is the same as a surface on which the cover portion is mounted. | 05-12-2011 |
Hiromichi Kobayashi, Saku JP
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20110126612 | GAS SENSOR - Disclosed is a gas sensor in which electrode pins including a plurality of electrode pins ( | 06-02-2011 |
Hiromichi Kobayashi, Kanagawa JP
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20120139070 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - In a manufacturing method, the following regions are formed in a semiconductor substrate: a pixel region where a photoelectric conversion element is placed and a peripheral region placed in the peripheral portion of the pixel region. The following wiring and film are formed over the main surface of the semiconductor substrate: an uppermost-layer wiring and a first interlayer insulating film located over the uppermost-layer wiring. The uppermost surface of the first interlayer insulating film is flattened. After the step of flattening the uppermost surface, the uppermost surface of the first interlayer insulating film in the pixel region is flat; and a step is formed in the uppermost surface of the first interlayer insulating film in the peripheral region. | 06-07-2012 |