Patent application number | Description | Published |
20110067907 | LOW TEMPERATURE CURABLE PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM MANUFACTURED BY USING THE SAME - The present invention provides a photosensitive resin composition comprising: a polyamic acid including a specific repeating unit; a heterocyclic amine compound; a (metha)acrylate-based compound including one or more double bonds between carbons; a photoinitiator; and an organic solvent, and a dry film prepared therefrom. The photosensitive resin composition can be cured at a low temperature to offer process safety and work convenience, and has excellent bending resistance, soldering heat resistance, and a property of filling the pattern, as well as excellent heat resistance and mechanical properties. | 03-24-2011 |
20110200939 | POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME AND DRY FILM MANUFACTURED BY THE SAME - The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition. | 08-18-2011 |
20120012366 | POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND DRY FILM MANUFACTURED FROM THE SAME - The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition. | 01-19-2012 |
20140011093 | COMPOSITION FOR PREPARING SEPARATOR, METHOD FOR PREPARING SEPARATOR, AND ELECTROCHEMICAL DEVICE HAVING SEPARATOR PREPARED THEREFROM - The present invention relates to a composition for preparing a separator for an electrochemical device, a method preparing a separator for an electrochemical device, and an electrochemical device having a separator prepared therefrom, more particularly, a composition for preparing a separator for an electrochemical device, comprising a polyolefin, a first diluent, and a second diluent, wherein an interaction energy between the first diluent and the second diluent is in the range of 2 to 3.5 cal/cm | 01-09-2014 |
20150018442 | METHOD FOR PREPARING MICROPOROUS POLYOLEFIN FILM BY THERMALLY-INDUCED PHASE SEPARATION METHOD - The present invention discloses a method for preparing a microporous polyolefin film comprising: a step of injecting a composition comprising polyolefin 30 to 60 wt % and a diluent mixture comprising a diluent, which can make liquid-liquid phase separation with the polyolefin thermodynamically 40 to 70 wt %, into an extruding machine, and melting and kneading thereof to prepare a single phase melt; and a step of extruding the melt while conducting liquid-liquid phase separation by passing through a section having the temperature below the liquid-liquid phase separation temperature and forming thereof in the form of a sheet, and a microporous polyolefin film prepared according to the method. | 01-15-2015 |
20150031780 | METHOD FOR PREPARING MICROPOROUS POLYOLEFIN FILM BY THERMALLY-INDUCED PHASE SEPARATION METHOD - The present invention discloses a method for preparing a microporous polyolefin film comprising: a step of injecting a composition comprising polyolefin 30 to 60 wt % and a diluent, which can make liquid-liquid phase separation with the polyolefin thermodynamically 40 to 70 wt %, into an extruding machine, and melting and kneading thereof to prepare a single phase melt; and a step of extruding the melt while conducting liquid-liquid phase separation by passing through a section having the temperature below the liquid-liquid phase separation temperature and forming thereof in the form of a sheet, and a microporous polyolefin film prepared according to the method. | 01-29-2015 |
Patent application number | Description | Published |
20090101393 | Metallic Laminate and Method for Preparing the Same - The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C. | 04-23-2009 |
20090139753 | Copper Clad Laminate for Chip on Film - The present invention relates to a copper clad laminate for chip on film, specifically to a copper clad laminate for a chip on film comprising a copper clad and at least one polyimide layer laminated on the copper clad, wherein the polyimide layer in contact with the copper clad comprises at least one additive selected from the group consisting of an azole-based compound, a polysiloxane-based compound, and a polyphosphate-based compound. The copper clad laminate for a chip on a film according to the present invention, upon tin plating the copper clad at high temperature, prevents delamination between the copper clad and the polyimide layer, and has excellent adhesiveness under the temperature and pressure on IC chip bonding. | 06-04-2009 |
20100113640 | ALKALI DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITION AND DRY FILM MANUFACTURED BY THE SAME - The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same. | 05-06-2010 |
20100316877 | METHOD FOR PREPARING POLYIMIDE AND POLYIMIDE PREPARED USING THE SAME - The present invention relates to a method for preparing polyimide having excellent heat resistance and processibility and, more particularly, to a method of preparing polyimide which has desirable mechanical strength during curing at low temperatures and excellent processibility to be used as an insulating film of a metal laminate plate or a coverlay film for print substrates or hard disks, and polyimide prepared using the same. | 12-16-2010 |
20120243186 | METALLIC LAMINATE AND METHOD FOR PREPARING THE SAME - The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C. | 09-27-2012 |