Harazono
Fumikazu Harazono, Yokohama-Shi JP
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20150206864 | Semiconductor Device - To realize further miniaturization of a semiconductor device. | 07-23-2015 |
Fumikazu Harazono, Kanagawa JP
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20100002107 | SOLID-STATE IMAGE PICKUP APPARATUS AND MANUFACTURING METHOD THEREOF - A solid-state image pickup apparatus and a manufacturing method thereof are provided to prevent a burr from dropping off onto a light reception face that causes a black point deterioration of a video image and to improve in productivity. The solid-state image pickup apparatus according to the invention is a solid-state image pickup apparatus including a flat board for placing a solid-state image pickup device and a lens, wherein the flat board has a through opening and has a wiring section for placing the solid-state image pickup device on the opening face that a light reception face of the solid-state image pickup device faces and a step part for placing the lens in the opening end part on the opening face side of the through opening, and the solid-state image pickup device placed on the wiring section and the lens placed in the step part are integrally sealed with a resin. | 01-07-2010 |
20100103296 | SOLID-STATE IMAGING APPARATUS AND MANUFACTURING METHOD THEREOF - A solid-state imaging apparatus of the invention intends to provide a thin solid-state imaging apparatus having high rigidity, high reliability and an improvement in accuracy using a flexible wiring board, and is a solid-state imaging apparatus comprising a flexible wiring board, a reinforcing plate, a solid-state imaging element substrate, a translucent member, an optical lens and a lens cabinet, and the flexible substrate and the reinforcing plate have the same outer shape and are laminated and integrated, and a positioning hole for being commonly used from the front and the back as a reference in the case of placing the lens cabinet and the case of placing the solid-state imaging element substrate is formed in the reinforcing plate, and the translucent member is placed so as to close an opening part, and the solid-state imaging element substrate and the lens cabinet are oppositely placed in a state of sandwiching an opening part using the positioning hole as a common reference. | 04-29-2010 |
Kohei Harazono, Yamaguchi JP
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20090323254 | CAPACITOR LEAD WIRE, ITS MANUFACTURING METHOD, AND CAPACITOR USING THE SAME - A capacitor is improved in reliability by suppressing the formation of burrs or protrusions at a joint portion between an aluminum wire round rod and an external terminal in a lead wire used for a capacitor. A metal cap having a higher melting point than aluminum is fitted to an end portion of the aluminum wire round rod and the metal cap is heated, thereby joining the aluminum wire round rod to the metal cap. Thereafter, the external terminal and the metal cap are welded to each other. The metal cap has a curved surface in which an outer periphery is decreased from an opening toward an end portion opposite to the opining. The opening is provided with a stepped portion, so that the sealing degree is increased when the lead wire is inserted into a hole of the sealing member. | 12-31-2009 |
Koichi Harazono, Fukuchiyama-Shi JP
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20150284759 | METHOD FOR PRODUCING D-ALLOSE - Provided herein is an enzyme protein produced by a highly safe microorganism and having the activity to isomerize D-psicose to D-allose. The protein is any of the following proteins (a) to (c) with the activity to isomerize D-psicose to D-allose. (a) A protein comprising the amino acid sequence represented by SEQ ID NO: 1 originating in strain 710 of a microorganism of genus | 10-08-2015 |
Kouhei Harazono, Yamaguchi JP
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20100108358 | ELECTRONIC COMPONENT, LEAD-WIRE AND THEIR PRODUCTION METHODS - Disclosed is a lead wire having a lead electrode made of a metal and a cap. The cap covers the front end portion of the lead electrode and is made of a metal harder than that of the lead electrode. Also disclosed is an electronic component having a functional device and the lead wire. The lead electrode is led out from the functional device. | 05-06-2010 |
Manabu Harazono, Tokyo JP
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20150106056 | SURFACE SHAPE MEASURING METHOD AND SURFACE SHAPE MEASURING DEVICE - A surface shape measuring method includes: acquiring displacement data on an object surface facing an optical displacement meter by scanning the object surface with the optical displacement meter that applies a light beam on the object surface and performs measurement; detecting an approximate range on the object surface including a groove formed on the object surface by searching the displacement data; calculating a groove start point and a groove terminating point of the groove included in the approximate range; calculating a smallest value of the displacement data in a restricted range from a center position between the groove start point and the groove terminating point to a width defined at a predetermined ratio with respect to the groove width; and calculating a difference between the smallest value of the calculated displacement data and the height of the object surface as the depth of the groove formed on the object surface. | 04-16-2015 |
Masaaki Harazono, Yasu JP
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20110139348 | Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet - According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layer | 06-16-2011 |
20110314666 | METHOD FOR MANUFACTURING CIRCUIT BOARD AND METHOD FOR MANUFACTURING STRUCTURE USING THE SAME - According to one embodiment of the invention, a method for manufacturing a circuit board comprises covering with a metal layer a surface of a first resin layer including polyimide resin; forming a plurality of conductive layers arranged on the metal layer with the conductive layers apart from each other in a planer view; roughening surfaces of the conductive layers with an alkaline aqueous solution; and etching a part of the metal layer between the conductive layers in the planer view to expose the surface of the first resin layer after roughening the surfaces of the conductive layers. | 12-29-2011 |
20120132462 | CIRCUIT BOARD AND MOUNTING STRUCTURE USING THE SAME - A circuit board comprises a substrate; a through hole penetrating the substrate along with a direction of a thickness thereof; and a through hole conductor covering an inner wall of the through hole. The substrate comprises a first fiber layer, a second fiber layer, and a resin layer arranged between the first fiber layer and the second fiber layer. Each of the first fiber layer and the second fiber layer has a plurality of fibers and a resin arranged among the plurality of the fibers. The resin layer contains a resin and doesn't contain a fiber. The inner wall of the through hole, in a cross-section view along with the direction of the thickness of the substrate, comprises a curved depression in the resin layer. | 05-31-2012 |
Masaaki Harazono, Kirishima-Shi JP
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20130192882 | WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME - A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole. | 08-01-2013 |
Masaaki Harazono, Yasu-Shi, Shiga JP
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20130081861 | PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PRODUCING THESE - A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor. | 04-04-2013 |
Masaaki Harazono, Shiga JP
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20100062249 | Method and Apparatus for Manufacturing Prepreg Sheet and Prepreg Sheet - According to the present invention, a method for manufacturing a prepreg sheet includes steps of (A) forming a resin layer | 03-11-2010 |
20100136284 | Fiber-Reinforced Resin and Method for Manufacturing the Same - A fiber-reinforced resin is provided which includes a fiber bundle | 06-03-2010 |
Toyohiro Harazono, Osaka JP
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20110042730 | Semiconductor device manufacturing method and semiconductor device - A formation method of an element isolation film according to which a high-voltage transistor with an excellent characteristic can be formed is provided. On a substrate, a gate oxide film is previously formed. A CMP stopper film is formed thereon, and thereafter, a gate oxide film and a CMP stopper film are etched. The semiconductor substrate is etched to form a trench. Further, before the trench is filled with a field insulating film, an liner insulating film is formed at a trench interior wall, and a concave portion at the side surface of the gate oxide film under the CMP stopper film is filled with the liner insulating film. In this manner, formation of void in the element isolation film laterally positioned with respect to the gate oxide film can be prevented. | 02-24-2011 |
20120139052 | Semiconductor device manufacturing method and semiconductor device - A formation method of an element isolation film according to which a high-voltage transistor with an excellent characteristic can be formed is provided. On a substrate, a gate oxide film is previously formed. A CMP stopper film is formed thereon, and thereafter, a gate oxide film and a CMP stopper film are etched. The semiconductor substrate is etched to form a trench. Further, before the trench is filled with a field insulating film, a liner insulating film is formed at a trench interior wall, and a concave portion at the side surface of the gate oxide film under the CMP stopper film is filled with the liner insulating film. In this manner, formation of void in the element isolation film laterally positioned with respect to the gate oxide film can be prevented. | 06-07-2012 |
Yasunobu Harazono, Shizuoka JP
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20140058626 | STEERING DAMPER CONTROL APPARATUS, AND A SADDLE RIDING TYPE VEHICLE HAVING THE SAME - A steering damper control apparatus includes an MR damper having an adjustable steering damping force, a suspension pressure sensor that detects a pressure of a front suspension, a command value output unit that determines a damping force command value according to a pressure change rate of the front suspension based on a detection result of the suspension pressure sensor, and a damper driver that causes the MR damper to generate a damping force corresponding to the damping force command value. At a point of time when steering becomes easily shakable, the damping force corresponding to the damping force command value is generated to prevent shaking of the steering beforehand. | 02-27-2014 |
20140058627 | STEERING DAMPER CONTROL APPARATUS, AND A SADDLE RIDING TYPE VEHICLE HAVING THE SAME - In a steering damper control apparatus, when a command value output unit detects an idle spin of a rear wheel, a damper driver increases a damping force of an MR damper to be higher than a damping force thereof used when the rear wheel is not spinning idly. Therefore, skidding of the rear wheel is prevented to prevent a posture change of a motorcycle. As a result, a driving direction of the rear wheel deviating from a traveling direction is prevented to efficiently use the drive of the rear wheel during traveling. | 02-27-2014 |
20150090546 | STEERING DAMPER, A SADDLE RIDING TYPE VEHICLE HAVING THE SAME, AND A METHOD OF MANUFACTURING THE SAME - A steering damper is configured to adjust a damping force of a rotor covered by a lower casing and an upper casing by changing the viscosity of a magnetic fluid with an electromagnet. Since a magnetic fluid chamber is provided with a volume compensating unit, even when the volume of the magnetic fluid expands, or air entrainment occurs, air bubbles lighter than the magnetic fluid are collected in the volume compensating unit. Thus, characteristic variations of the steering damper due to volume expansion or air entrainment of the magnetic fluid are prevented. | 04-02-2015 |