Patent application number | Description | Published |
20120024840 | Temperature sensor and induction heating cooker having the same - An induction heating cooker including a temperature sensor disposed between a plurality of working coils which are uniformly disposed below a cooking table and a heat transfer member to transfer heat from the working coils adjacent to the temperature sensor to the temperature sensor, thereby improving productivity and space utilization. | 02-02-2012 |
20120248095 | INDUCTION HEATING COOKER - An induction heating cooker including a cooking plate on which a cooking vessel is placed, a plurality of heating coils disposed while being adjacent to one other below the cooking plate, and a Printed Circuit Board (PCB) on which circuits configured to drive the heating coils are placed, wherein the PCB is divided into a high frequency circuit part on which circuits characterized by high frequency are placed and a low frequency circuit part on which circuits characterized by low frequency are placed, and the high frequency circuit part is spaced apart from the low frequency circuit part by a predetermined distance. The interference between the high frequency circuit part and the low frequency circuit part is minimized while enhancing the operation efficiency of each heating coil. The assembly efficiency and the working efficiency are enhanced when an inverter circuit is wired to a corresponding heating coil. | 10-04-2012 |
20120248096 | INDUCTION HEATING COOKER AND CONTROL METHOD THEREOF - An induction heating cooker and a control method thereof that prevents the occurrence of an error caused during recognition of a container in the induction heating cooker that performs cooking regardless of where the container is placed on a cooking plate includes a plurality of heating coils disposed below a cooking plate, current detectors to detect values of current flowing in the respective heating coils, and a controller to determine whether a container is placed on the respective heating coils based on the detected current values of the heating coils and change amounts of the current values. | 10-04-2012 |
20120255946 | INDUCTION HEATING COOKER AND CONTROL METHOD THEREOF - An induction heating cooker and a control method thereof that stably adjust power of a cooking coil when a plurality of containers having different cooking conditions is placed on the cooking coil includes a plurality of heating coils disposed below a cooking plate and a controller to determine whether a container is placed on the heating coils, wherein the controller determines whether a plurality of containers is placed on one of the heating coils and, when the containers are placed on one of the heating coils, adjusts a power of the heating coil on which the containers are placed based on powers of other heating coils occupied by the containers. Cooking using a plurality of containers is stably performed based on user intention even when cooking conditions of the containers placed on a heating coil differ. | 10-11-2012 |
20150187532 | FILM TARGET FOR LASER-INDUCED PARTICLE ACCELERATION AND METHOD OF MANUFACTURING THE SAME - A film target for laser-induced particle acceleration includes a first target layer on which a laser is incident; an intermediate layer located behind the first target layer along a propagating direction of the laser, and in which an intended ion beam is generated; and a second target layer located opposite to the first target layer with the intermediate layer interposed therebetween. | 07-02-2015 |
Patent application number | Description | Published |
20080261196 | NAPHTHALENE DIIMIDE-ZN(II) COMPLEX HAVING SELECTIVITY FOR PYROPHOSPHATE, PREPARATION METHOD THEREOF AND DETECTING METHOD OF PYROPHOSPHATE USING THE SAME - The present invention provides a novel fluorescent chemosensor including a naphthalene diimide-Zn(II) complex, which can efficiently recognize pyrophosphate (PPi) at pH 7.4. The fluorescent chemosensor exhibits a new kind of excimer fluorescence, which is selective for PPi in 100% aqueous solution. Further, since the naphthalene diimide-Zn(II) complex of the present invention does not couple with inorganic phosphate (Pi) or adenosine triphosphate (ATP) and has high selectivity for PPi, it can be usefully used to detect pyrophosphate (PPi), which serves to transfer signals and store energy in living organisms. | 10-23-2008 |
20080318361 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A method for manufacturing a semiconductor package includes forming a groove in the portion outside of the bonding pad of a semiconductor chip provided with the bonding pad on an upper surface thereof; forming an insulation layer on the side wall of the groove; forming a metal layer over the semiconductor chip so as to fill the groove formed with the insulation layer; etching the metal layer to simultaneously form a through silicon via for filling the groove and a distribution layer for connecting the through silicon via and the bonding pad; and removing a rear surface of the semiconductor chip such that the lower surface of the through silicon via protrudes from the semiconductor chip. | 12-25-2008 |
20130235740 | METHOD AND MOBILE TERMINAL FOR MANAGING CIRCUIT SWITCHED FALLBACK PROCEDURE AND NETWORK REGISTRATION - A method that uses a processor to manage a circuit switched fall back (CSFB) procedure includes connecting to a circuit switched network for the CSFB procedure, processing, using the processor, a voice call using the circuit switched network, and determining whether to register to a packet switched network according to a connection possibility of the packet switched network. A mobile terminal includes a first mobile communication modem to connect to a packet switched network, a second mobile communication modem to switch from the packet switched network to a circuit switched network, and a controller to determine whether to re-register to the packet switched network according to a connection possibility of the packet switched network. | 09-12-2013 |
20140181269 | METHOD FOR CONTROLLING FILE NAME AND ELECTRONIC DEVICE THEREOF - A method for controls a file name in an electronic device. The method includes when a data transmission event occurs, detecting at least one file for attachment to data transmission; determining whether a renamed file exists among the at least one file; when at least one renamed file exists, generating a header in consideration of a changed name with respect to the at least one renamed file; and generating and transmitting a data packet including the header. | 06-26-2014 |
20140181737 | METHOD FOR PROCESSING CONTENTS AND ELECTRONIC DEVICE THEREOF - A method for enlarging contents and an electronic device thereof are provided. The method includes displaying contents on a front side of a double-sided touch-sensitive display, detecting a selection for enlarging a specific area of the contents, upon the detection of selection, switching the double-sided touch-sensitive display to a semi-transparent mode, sensing a touch on a rear side of the double-sided touch-sensitive display, and displaying a threshold area of the double-sided touch-sensitive display corresponding to a coordinate at which the touch is sensed by enlarging the area by a pre-set magnification factor. | 06-26-2014 |
20150066622 | METHOD FOR PROVIDING MOBILE COUPON AND MOBILE ELECTRONIC DEVICE SUPPORTING THE SAME - A method for providing a mobile coupon in a mobile electronic device is provided. The method includes collecting information about the mobile coupon including a domain to which the mobile coupon is applicable, from a mobile coupon image including the mobile coupon, determining whether the domain to which the mobile coupon is applicable is identical with a domain of a web site accessed by the mobile electronic device and outputting, when the domain to which the mobile coupon is applicable is identical with a domain of a web site accessed by the mobile electronic device, the information about the mobile coupon. | 03-05-2015 |
Patent application number | Description | Published |
20090166853 | MULTI-LAYER STACKED WAFER LEVEL SEMICONDUCTOR PACKAGE MODULE - A stacked wafer level semiconductor package module includes a semiconductor chip module including first and second semiconductor chips each having a rectangular shape. The first semiconductor chip has first pads disposed along a first short side of a lower surface thereof. The second semiconductor chip has second pads disposed along a first short side of a lower surface thereof. The first and second semiconductor chips are stacked so as to expose the first pad and the second pad on one side of the stacked first and second semiconductor chips. The package also includes a substrate having a first connection pad facing the first pad and a second connection pad facing the second pad. The package also includes a first connection member for connecting the first pad to the first connection pad, and a second connection member for connecting the second pad to the second connection pad. | 07-02-2009 |
20090184414 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 07-23-2009 |
20090189267 | SEMICONDUCTOR CHIP WITH CHIP SELECTION STRUCTURE AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor chip with a chip selection structure suitable for a stacked semiconductor chip includes a semiconductor chip body and a chip selection structure. The chip selection structure includes a chip selection pad disposed over the semiconductor chip body, a main through electrode electrically connected to the chip selection pad, and a sub through electrode interposed between the main through electrode and the chip selection pad. A plurality of the semiconductor chips, each having the same chip selection structure, can be stacked by offsetting the stacked semiconductor chips. | 07-30-2009 |
20090197372 | METHOD FOR MANUFACTURING STACK PACKAGE USING THROUGH-ELECTRODES - Manufacturing a wafer level stack package includes the steps of back-grinding a lower surface of a wafer including a plurality of first semiconductor chips. A support member is attached to a lower surface of the back-grinded wafer. One or more second semiconductor chips are stacked on the respective first semiconductor chips of the back-grinded wafer. First through-electrodes are formed to electrically connect the stacked first semiconductor chips and second semiconductor chips. Third semiconductor chips are attached to uppermost ones of the stacked second semiconductor chips, and the third semiconductor chips have second through-electrodes which are electrically connected to the first through-electrodes and re-distribution lines which are connected to the second through-electrodes. Outside connection terminals are attached to the re-distribution lines of the third semiconductor chips. The first semiconductor chips of a wafer level on which the second and third semiconductor chips are stacked are sawed to for semiconductor packages at a chip level. | 08-06-2009 |
20130078807 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 03-28-2013 |
Patent application number | Description | Published |
20110086292 | JOINING DEVICE FOR FUEL CELL STACK AND FUEL CELL STACK PROVIDED WITH THE SAME - The present invention features a fuel cell stack that preferably includes an electricity generating assembly having a plurality of unit cells that are suitably disposed one after another; a pair of end plates pressedly disposed respectively at upper and lower ends of the electricity generating assembly; and a joining device suitably engaging the end plates by a rope, where pressure is applied to the electricity generating assembly by means of tension of the rope, and the length and tension of the rope is suitably controlled. | 04-14-2011 |
20110129737 | COMPOSITE SEPARATOR FOR POLYMER ELECTROLYTE MEMBRANE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a composite separator for a polymer electrolyte membrane fuel cell (PEMFC) and a method for manufacturing the same, in which a graphite foil prepared by compressing expanded graphite is stacked on a carbon fiber-reinforced composite prepreg or a mixed solution prepared by mixing graphite flake and powder with a resin solvent is applied to the cured composite prepreg such that a graphite layer is integrally molded on the outermost end of the separator. | 06-02-2011 |
20110281203 | METHOD FOR MANUFACTURING COMPOSITE SEPARATOR FOR FUEL CELL AND COMPOSITE SEPARATOR MANUFACTURED BY THE SAME - The present invention provides a method for manufacturing a composite separator for a fuel cell, which can reduce the electrical contact resistance by performing an additional post-treatment to remove residual resin remaining on the surface of the composite separator by plasma etching. In certain preferred embodiments, the present invention provides a method for manufacturing a composite separator for a fuel cell, in which a liquid phase resin for gasket is applied to the surface of the composite separator along a predetermined gasket pattern, or a semi-cured resin for gasket in the form of a film with a predetermined gasket pattern is stacked on the surface of the composite separator, and then plasma etching is performed to remove the residual resin and, at the same time, cure the resin for gasket, thus reducing the overall processing time to improve the productivity and preventing a composite material of the separator from being damaged. | 11-17-2011 |
20130266891 | JOINING DEVICE FOR FUEL CELL STACK AND FUEL CELL STACK PROVIDED WITH THE SAME - The present invention features a fuel cell stack that preferably includes an electricity generating assembly having a plurality of unit cells that are suitably disposed one after another; a pair of end plates pressedly disposed respectively at upper and lower ends of the electricity generating assembly; and a joining device suitably engaging the end plates by a rope, where pressure is applied to the electricity generating assembly by means of tension of the rope, and the length and tension of the rope is suitably controlled. | 10-10-2013 |
20140242497 | COMPOSITE SEPARATOR FOR POLYMER ELECTROLYTE MEMBRANE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a composite separator for a polymer electrolyte membrane fuel cell (PEMFC) and a method for manufacturing the same. The inventive method involves allowing graphite foil layers to be brought into direct contact with each other when graphite foils are stacked on both sides of a carbon fiber reinforced composite material prepreg, thereby improving electrical conductivity in the thickness direction of the separator. | 08-28-2014 |
20150140472 | COMPOSITE SEPARATOR FOR POLYMER ELECTROLYTE MEMBRANE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a composite separator for a polymer electrolyte membrane fuel cell (PEMFC) and a method for manufacturing the same, in which a graphite foil prepared by compressing expanded graphite is stacked on a carbon fiber-reinforced composite prepreg or a mixed solution prepared by mixing graphite flake and powder with a resin solvent is applied to the cured composite prepreg such that a graphite layer is integrally molded on the outermost end of the separator. | 05-21-2015 |
Patent application number | Description | Published |
20090269671 | Fuel cell separator and method for manufacturing the same - The present invention provides a fuel cell separator formed of a continuous carbon-fiber composite, and a method for manufacturing the same. | 10-29-2009 |
20090286134 | END PLATE FOR FUEL CELL STACK AND METHOD FOR MANUFACTURING THE SAME - The present invention provides an end plate for fuel cell stack and a method for manufacturing an end plate, which can increase flexural rigidity per weight, and improve strain at break, and reduce heat transmission by applying hybrid core element having honeycomb and form structures to an end plate having sandwich structure combined to both end portions of a fuel cell stack. | 11-19-2009 |
20090311566 | SEPARATING PLATE FOR FUEL CELL STACK AND METHOD OF MANUFACTURING THE SAME - The present invention provides a separating plate for a fuel cell stack and method of manufacturing the same, and more particularly, to a separating plate for a fuel cell stack and method of manufacturing the same, in which the separating plate constituting the fuel cell stack is formed in such a fashion as to interpose an array of metal pipes between two sheets of composite material, and a gasket abutting against the separating plate is formed in such a fashion as to define hydrogen and air flow channels, thereby removing a contact resistance between two adjoining separating plates constituting unit cells to improve the efficiency of the fuel cell. | 12-17-2009 |
20120077107 | COMPOSITE SEPARATOR FOR POLYMER ELECTROLYTE MEMBRANE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a composite separator for a polymer electrolyte membrane fuel cell (PEMFC) and a method for manufacturing the same. The inventive method involves allowing graphite foil layers to be brought into direct contact with each other when graphite foils are stacked on both sides of a carbon fiber reinforced composite material prepreg, thereby improving electrical conductivity in the thickness direction of the separator. | 03-29-2012 |
Patent application number | Description | Published |
20090140132 | APPARATUS AND METHOD FOR PROCESSING SUBSTRATE USING NEUTRALIZED BEAMS INCLUDING APPLYING A VOLTAGE TO A SUBSTRATE SUPPORT - An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate. | 06-04-2009 |
20110244666 | Methods Of Manufacturing Stair-Type Structures And Methods Of Manufacturing Nonvolatile Memory Devices Using The Same - Methods of manufacturing stair-type structures and methods of manufacturing nonvolatile memory devices using the same. Methods of manufacturing stair-type structures may include forming a plurality of thin layers stacked in plate shapes, forming a mask on an utmost thin layer, patterning the utmost layer using the mask as an etch mask, escalating a width of the mask and etching each of the thin layers at a different width of the mask to form a stair-type structure of the thin layers. Control gates may be formed into the stair-type structures using the methods of manufacturing stair-type structures. | 10-06-2011 |
20120068058 | Apparatus and Method for Processing Substrate Using Neutralized Beams Including Applying a Voltage to a Substrate Support - An apparatus and method for processing a substrate using neutralized beams are provided. A substrate processing apparatus includes an ion source generating device configured to form an ion source. An ion extraction device is configured to extract and accelerate ions from the ion source. An ion neutralizing device is configured to convert the ions extracted and accelerated from the ion extraction device into neutralized beams. A remaining portion of the ions extracted and accelerated from the ion extraction device is not converted into the neutralized beams. A substrate support is configured to support a substrate such that the neutralized beams are directed towards the substrate support. A substrate power supply is configured to apply a voltage to the substrate support such that the remaining portion of the ions that is not converted into the neutralized beams is directed away from the substrate support by the applied voltage of the substrate. | 03-22-2012 |
20140084182 | LIGHT EMITTING DEVICE PACKAGE - Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member. | 03-27-2014 |
20140106569 | METHOD OF FABRICATING THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND THREE-DIMENSIONAL SEMICONDUCTOR DEVICE FABRICATED USING THE SAME - According to example embodiments of inventive concepts, a method of fabricating a 3D semiconductor device may include: forming a stack structure including a plurality of horizontal layers sequentially stacked on a substrate including a cell array region and a contact region; forming a first mask pattern covering the cell array region and defining openings extending in one direction over the contact region; performing a first etching process with a first etch-depth using the first mask pattern as an etch mask on the stack structure; forming a second mask pattern covering the cell array region and exposing a part of the contact region; and performing a second etching process with a second etch-depth using the second mask pattern as an etch mask structure on the stack structure. The second etch-depth may be greater than the first etch-depth. | 04-17-2014 |
20140191276 | LIGHT EMITTING DEVICE PACKAGE - Disclosed is a light emitting device package with improved light extraction efficiency. The light emitting device package includes a substrate, a light emitting device disposed on the substrate, and a light transmission unit disposed above the light emitting device, the light transmission unit being spaced from the light emitting device, wherein a distance between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm. | 07-10-2014 |
20140246604 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers. | 09-04-2014 |
20150048262 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body. | 02-19-2015 |
20150102375 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package is disclosed. The light emitting device package includes a package body including at least one ceramic layer, a submount disposed at the package body, a light emitting device disposed on the submount for emitting ultraviolet (UV)-wavelength light, and an anti-reflection (AR) coating layer disposed around the light emitting device, the AR coating layer being formed of an inorganic coating layer. | 04-16-2015 |
20150228623 | STAIRCASE-SHAPED CONNECTION STRUCTURES OF THREE-DIMENSIONAL SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - Provided is a staircase-shaped connection structure of a three-dimensional semiconductor device. The device includes an electrode structure on a substrate, the electrode structure including an upper staircase region, a lower staircase region, and a buffer region therebetween. The electrode structure includes horizontal electrodes sequentially stacked on the substrate, the horizontal electrodes include a plurality of pad regions constituting a staircase structure of each of the upper and lower staircase regions, and the buffer region has a width that is larger than that of each of the pad regions. | 08-13-2015 |
20150270463 | LIGHT EMITTING DEVICE PACKAGE - A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity. | 09-24-2015 |