Guoyuan
Guoyuan Chen, Shanghai CN
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20130108654 | TELOMERASE ACTIVITY INHIBITING PEPTIDE AND MANUFACTURING METHOD AND APPLICATION THEREOF | 05-02-2013 |
Guoyuan Pan, Beijing CN
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20160023168 | COMPLEX NANOFILTRATION MEMBRANE AND THE PREPARATION THEREOF - A complex nanofiltration membrane comprising a substrate and a separating layer, wherein the separating layer is an oxidant-treated, crosslinked network structure formed from a hydroxyl-containing polymer, a thiol-containing silane coupling agent and a crosslinking agent, is disclosed. Also disclosed are a process for preparing the complex nanofiltration membrane and use of the complex nanofiltration membrane in water treatment. | 01-28-2016 |
Guoyuan Wen, Wuhan CN
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20140287496 | HEAT-RESISTANT NEWCASTLE DISEASE VIRUS LIVE VACCINE VECTOR SYSTEM AND USE THEREOF - A heat-resistant NDV live vaccine vector system includes a transcription plasmid, three helper plasmids, and host cells. The transcription plasmid is constructed by through cloning complete genomic cDNA of a heat-resistant NDV vaccine strain to a pBR322 vector. The three helper plasmids are constructed by cloning sequences coding nucleoprotein (NP), phosphoprotein, large polymerase protein of a heat-resistant NDV vaccine strain respectively to pcDNA3.1 vectors. A recombinant NDV artificially obtained by cotransfacting host cells with the transcription plasmid and the three helper plasmids shows heat-resistance. | 09-25-2014 |
Guoyuan Zhao, Shenzhen CN
Patent application number | Description | Published |
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20140092562 | INSULATION AND HEAT RADIATION STRUCTURE OF POWER DEVICE, CIRCUIT BOARD, AND POWER SUPPLY APPARATUS - Embodiments of the present application provide an insulation and heat radiation structure of a power device, a circuit board, and a power supply apparatus. The insulation and heat radiation structure of the power device includes a power device, an insulation ceramic piece, and a heat radiator, where the power device is of a sheet structure, the insulation ceramic piece is an alumina ceramic piece, a heat radiator pin is disposed on the heat radiator, the heat radiator pin is used for being mechanically connected to the circuit board, a heating surface of the power device is adhesively fixed to one surface of the insulation ceramic piece through a first insulating thermal conductive adhesive, and the other surface of the insulation ceramic piece is adhesively fixed to a contact heat radiation surface of the heat radiator through a second insulating thermal conductive adhesive. | 04-03-2014 |