Patent application number | Description | Published |
20090000090 | METHOD FOR INSULATIVE FILM FOR CAPACITOR COMPONENTS - The present subject matter includes an apparatus including a capacitor stack, including at least one substantially planar anode layer arranged in stacked alignment adjacent at least one substantially planar cathode layer, with at least one separator layer disposed therebetween. In this embodiment, the present subject matter includes at least one conformed film at least partially enveloping the capacitor stack in a bound state and adapted to electrically isolate the capacitor stack. | 01-01-2009 |
20090002922 | Method and apparatus for providing flexible partially etched capacitor electrode interconnect - The present subject matter includes a capacitor stack disposed in a case, the capacitor stack including one or more substantially planar electrode layers. The one or more substantially planar electrode layers have an etched surface, an unetched surface, and a grade bordering the etched surface and the unetched surface. Also, the present subject matter includes a lid conforming sealingly connected to the material defining the first aperture. Additionally, the present subject matter includes a feedthrough assembly connected to the capacitor stack and passing through the feedthrough hole and sealingly connected to the material defining the feedthrough hole. In the present subject matter, the one or more substantially planar electrode layers are made by printing a curable resin mask onto the one or more substantially planar electrode layers and etching the layers, the curable resin mask defining the grade and adapted to resist etching. | 01-01-2009 |
20090044404 | Method for connecting electrodes having apertures - One embodiment includes a method that includes positioning a first substantially planar electrode including material defining a first aperture into a capacitor stack in alignment with a second substantially planar electrode such that a first non-aperture portion of the second substantially planar electrode at least partially overlays the first aperture and joining the first substantially planar electrode to the second substantially planar electrode proximal the material defining the first aperture and the first non-aperture portion of the second substantially planar electrode. | 02-19-2009 |
20090059472 | METHOD FOR INTERCONNECTING ANODES AND CATHODES IN A FLAT CAPACITOR - A method includes connecting together one or more anode connection members of one or more anode foils and one or more cathode connection members of one or more cathode foils and electrically isolating the one or more anode foils from the one or more cathode foils. A capacitor stack includes a plurality of cathode layers having cathode connection members and a plurality of anode layers having anode connection members. The anode connection members are connected to the cathode connection members and configured such that the anode layers can be electrically separated from the cathode layers by cutting only the anode connection members or the cathode connection members. | 03-05-2009 |
20100010562 | ELECTROLYTIC CAPACITOR INTERCONNECT - An electrolytic capacitor is constructed as a stacked structure of alternating anode and cathode plates. A clip is fitted over a peripheral portion of each cathode plate, the clips being welded together to electrically connect the cathode plates in common. The dimensions of the clips are such that the clips take up approximately the same space away from the edges of the cathode plates as the thickness of the anode plate on each side of a cathode plate when the anode and cathode plates are stacked upon one another. | 01-14-2010 |
20100095496 | METHOD FOR A CAPACITOR WITH A FLEXIBLE INTERCONNECT - The present subject matter includes a first capacitor stack including a first plurality of anode layers and a first plurality of cathode layers and a second capacitor stack including a second plurality of anode layers and a second plurality of cathode layers. In various embodiments, a flexible bus is welded to the first capacitor stack and to the second capacitor stack. The flexible bus is adapted to conduct electricity between the first capacitor stack and the second capacitor stack. Also, the present subject matter includes embodiments where the first capacitor stack and the second capacitor stack are disposed in a case filled with an electrolyte. | 04-22-2010 |
20100155362 | METHOD AND APPARATUS FOR INTERCONNECTING ELECTRODES WITH PARTIAL TITANIUM COATING - The present subject matter includes a capacitor stack having a plurality of anode layers, and a plurality of cathodic metal substrates partially coated in a titanium coating. Cathode portions lacking titanium enable weld interconnections which are substantially free of titanium, improving capacitor properties. In some embodiments, anodes are interspersed among cathodes, and are electrically separated from the cathodes, with portions of cathode material attached to the welding area of the anode. These portions of the cathode material are no longer electrically connected to the cathode. As the anode and these cathode portions are welded and aged, leakage current is reduced due to improved oxide growth in the welding area due to the absence of titanium. | 06-24-2010 |
20130041420 | SINTERED CAPACITOR ELECTRODE INCLUDING A 3-DIMENSIONAL FRAMEWORK - An example includes a capacitor case sealed to retain electrolyte, at least one anode disposed in the capacitor case, the at least one anode comprising a sintered portion disposed on a current collector formed of a framework defining cells extending to three axes, an anode conductor coupled to the current collector formed of a framework defining cells extending to three axes in electrical communication with the sintered portion, the anode conductor sealingly extending through the capacitor case to an anode terminal disposed on the exterior of the capacitor case with the anode terminal in electrical communication with the sintered portion, a cathode disposed in the capacitor case, a separator disposed between the cathode and the anode and a cathode terminal disposed on an exterior of the capacitor case and in electrical communication with the cathode, wherein the anode terminal and the cathode terminal are electrically isolated from one another. | 02-14-2013 |
20130141842 | SINTERED CAPACITOR ELECTRODE INCLUDING A FOLDED CONNECTION - This document discusses capacitive elements including a first, second and third electrode arranged in a stack. The third electrode is positioned between the first and second electrode. An interconnect includes a unitary substrate shared with the first and second electrodes. The interconnect is adapted to deform to accommodate the stacked nature of the first and second electrodes. The unitary substrate includes a sintered material disposed thereon. | 06-06-2013 |
20130206472 | FERRULE FOR IMPLANTABLE MEDICAL DEVICE - A ferrule for an implantable medical device (IMD) can employ stamped metal portion including an electrically-conductive ferrule portion. The stamped ferrule portion can be affixed to a wall of a housing of the IMD. The resulting ferrule can provide cost savings or higher production throughput over a ferrule employing machined ferrule portion. | 08-15-2013 |
20140268499 | FLAT CAPACITOR FOR AN IMPLANTABLE MEDICAL DEVICE - One aspect provides a capacitor feedthrough assembly having an electrically conductive member dimensioned to extend at least partially through a feedthrough hole of a case of the capacitor, the conductive member having a passage therethrough. | 09-18-2014 |
20150043130 | SYSTEMS AND METHODS TO CONNECT SINTERED ALUMINUM ELECTRODES OF AN ENERGY STORAGE DEVICE - This document provides an apparatus including a sintered electrode, a second electrode and a separator material arranged in a capacitive stack. A conductive interconnect couples the sintered electrode and the second electrode. Embodiments include a clip interconnect. In some embodiments, the interconnect includes a comb shaped connector. In some embodiments, the interconnect includes a wire snaked between adjacent sintered substrates. | 02-12-2015 |