Patent application number | Description | Published |
20090219681 | MULTIPLE CHIP MODULE COOLING SYSTEM AND METHOD OF OPERATION THEREOF - Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM. | 09-03-2009 |
20100277865 | MULTIPLE CHIP MODULE COOLING SYSTEM AND METHOD OF OPERATION THEREOF - Disclosed herein is computer system having a first and second multiple chip modules (MCM) and a cooling module. The cooling module includes a first cooling loop associated with said first MCM and a first evaporator. The cooling module further includes a second cooling loop associated with said second MCM and a second evaporator. Each cooling loop is coupled to a common condenser that receives thermal energy from each cooling loop. A controller is coupled to the first and second cooling loop and adapts the operation of the first and second cooling loop in response to variances in operating conditions to provide cooling of the first and second MCM. | 11-04-2010 |
20110149505 | IN-LINE MEMORY MODULE COOLING SYSTEM - A system to aid in cooling an in-line memory module may include a thermal interface material adjacent the in-line memory module. The system may also include a heat spreader adjacent the thermal interface material. The system may further include a cold-plate adjacent the heat spreader, the cold-plate, heat spreader, and thermal interface material to aid in cooling the in-line memory module. | 06-23-2011 |
20120118534 | MULTIMODAL COOLING APPARATUS FOR AN ELECTRONIC SYSTEM - An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger. | 05-17-2012 |
20120120605 | IN-LINE MEMORY AND CIRCUIT BOARD COOLING SYSTEM - A system to remove heat from an in-line memory module and/or circuit board may include a cold-rail to engage each end of an in-line memory module adjacent to where the in-line memory module is attachable to a circuit board, the cold-rail to remove heat from the in-line memory module. The system may also include a cold-plate connected to the cold-rail with the circuit board between the cold-plate and the cold-rail, the cold-plate to remove heat from the circuit board. | 05-17-2012 |
20130333865 | MODULAR PUMPING UNIT(S) FACILITATING COOLING OF ELECTRONIC SYSTEM(S) - Field-replaceable, modular pumping units are provided, configured to facilitate pumping coolant through a cooling apparatus assisting in removal of heat generated by one or more electronic systems. The cooling apparatus includes one or more heat exchange assemblies, and the modular pumping units are coupled in parallel fluid communication to the cooling apparatus. The modular pumping unit includes a housing, a coolant inlet to the housing, a coolant reservoir tank disposed within the housing, a coolant pump, and a coolant outlet of the housing. The coolant reservoir tank and coolant pump are disposed within the housing in fluid communication, and the coolant pump pumps coolant from the coolant reservoir tank to the coolant outlet of the housing. A modular pumping unit controller is associated with the modular pumping unit, and automatically adjusts operation of the coolant pump based upon one or more sensed parameters. | 12-19-2013 |
20140202678 | MULTI-LEVEL REDUNDANT COOLING SYSTEM FOR CONTINUOUS COOLING OF AN ELECTRONIC SYSTEM(S) - A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters. The redundant backup blowers are activated responsive to the sensed parameter(s) exceeding a set threshold to provide backup cooling to the electronic system(s) in the event of degraded performance of the cooling apparatus or the redundant pumping units. | 07-24-2014 |
20150075764 | MULTI-LEVEL REDUNDANT COOLING METHOD FOR CONTINUOUS COOLING OF AN ELECTRONIC SYSTEM(S) - A cooling method is provided to remove heat generated by one or more electronic systems. The method includes providing a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters. The redundant backup blowers are activated responsive to the sensed parameter(s) exceeding a set threshold to provide backup cooling to the electronic system(s) in the event of degraded performance of the cooling apparatus or the redundant pumping units. | 03-19-2015 |