Gonohe
Hisao Gonohe, Chiba JP
Patent application number | Description | Published |
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20100317802 | TACKY RESIN COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE FILM OR SHEET - A tacky resin composition which has proper initial tackiness, is sufficiently inhibited from rising in tackiness with time, can keep tackiness at a proper range even when it receives a slight heat history or is stored for a long time, has very small dependence on peeling speed, and can provide high transparency to a pressure-sensitive adhesive film or sheet as required, and a pressure-sensitive adhesive film or sheet for the surface protection of an article, which is obtained form the tacky resin composition. | 12-16-2010 |
Hisao Gonohe, Ichihara-Shi JP
Patent application number | Description | Published |
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20100255302 | ADHESIVE FILM OR SHEET - [Problem] To provide an adhesive film or sheet for protecting the surfaces of articles having proper initial adhesive force, sufficiently suppressing an increase in the adhesive force after aged, maintaining a suitable adhesive force in a proper range despite of being subjected to thermal hysteresis to some extent or even after preserved for extended periods of time and, as desired, being capable of imparting a high degree of transparency to the adhesive film or sheet. | 10-07-2010 |
Narishi Gonohe, Shizuoka JP
Patent application number | Description | Published |
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20080311741 | Selective W-Cvd Method and Method for Forming Multi-Layered Cu Electrical Interconnection - A substrate provided thereon with an electrical insulating film which carries holes or the like filled with a Cu-containing electrical interconnection film is subjected to a pre-treatment in which the surface of the electrical insulating film and that of the Cu-containing electrical interconnection film are treated at a temperature of not more than 300° C. using, in a predetermined state, a gas of a compound containing an atom selected from the group consisting of N, H and Si atoms within the chemical formula thereof, before selectively forming a W-capping film on the electrical interconnection film. After the completion of the pre-treatment, a W-capping film is selectively formed on the electrical interconnection film and then an upper Cu electrical interconnection is further formed. | 12-18-2008 |
20090095617 | BIAS SPUTTERING FILM FORMING PROCESS AND BIAS SPUTTERING FILM FORMING APPARATUS - The present invention provides a bias sputtering film forming process and film forming apparatus that can form a coating film having a good film thickness distribution in a minute coated surface of a complicated shape, such as contact holes, through-holes and wiring grooves, especially for the sidewall portions thereof. | 04-16-2009 |