Ghandehari
Hamid Ghandehari, Salt Lake City, UT US
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20130177523 | GOLD PARTICLES AND METHODS OF MAKING AND USING THE SAME IN CANCER TREATMENT - Described herein are gold particles that can be used to reduce tumor proliferation and treat cancer. In certain aspects, the gold particles can be modified in order to enhance selectivity and uptake of the particles by cancer cells. In certain aspects, the modified gold particles have a targeting group attached to the particle via a linker. The gold particles described herein can be used in combination with other anti-cancer agents in order to enhance overall cancer treatment. Methods for making and using the gold particles are also described herein. | 07-11-2013 |
20130236396 | NANOPARTICLES PRODUCED FROM RECOMBINANT POLYMERS AND METHODS OF MAKING AND USING THE SAME - Described herein are nanoparticles produced from recombinant polymers. The nanoparticles are substantially uniform in size, which provides numerous advantages with respect to the delivery of bioactive agents to a subject. Methods for making the nanoparticles are also described herein. In one aspect, the nanoparticles are produced by the method comprising: a. providing a solution comprising one or more recombinant polymer in a solvent; b. forming droplets comprising the one or more recombinant polymers and the solvent; c. removing the solvent to produce the nanoparticles; and d. separating the nanoparticles based on size to produce nanoparticles that are substantially uniform in size. Finally, pharmaceutical compositions composed of the nanoparticles and methods of using the same are also described. | 09-12-2013 |
20140358116 | METHODS FOR DELIVERING AN ANTI-CANCER AGENT TO A TUMOR - Described herein are methods for delivering an anti-cancer agent to a tumor in a subject. The method involves | 12-04-2014 |
Hamidreza Ghandehari, Salt Lake City, UT US
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20100099644 | HPMA - DOCETAXEL OR GEMCITABINE CONJUGATES AND USES THEREFORE - Disclosed are water-soluble compositions of gemcitabine and docetaxel formed by conjugating the gemcitabine or docetaxel to a water-soluble polymer such as N-2-hydroxypropyl methacrylamide (HPMA). Also disclosed are methods of using the compositions of the invention for the treatment of cancer. | 04-22-2010 |
20120197060 | RADIATION ENHANCED MACROMOLECULAR DELIVERY OF THERAPEUTIC AGENTS FOR CHEMOTHERAPY TECHNOLOGY - Described herein are anti-cancer compounds composed of a macromolecule comprising (1) at least one anti-cancer agent directly or indirectly bonded to the macromolecule and (2) at least one high Z element directly or indirectly bonded to the macromolecule that is capable of producing Auger electrons upon exposure to X-ray energy. When the compounds are exposed to low energy X-ray (e.g., kilo electron volts KeV) Auger electrons are produced by the high Z elements present in the compound. Because lower energy is required when compared to typical radiotherapy, which uses therapeutic X-ray energy in the million electron volt range (MeV), the subject experiences lower collateral damage when compared to radiation therapy. Additionally, the presence of the anti-cancer agent provides a second mechanism for killing cancer cells. Methods for making and using the anti | 08-02-2012 |
20140194370 | SILK-ELASTIN LIKE PROTEIN POLYMERS FOR EMBOLIZATION AND CHEMOEMBOLIZATION TO TREAT CANCER - A chemoembolic agent is disclosed that includes an injectable, recombinantly synthesized silk-elastin like protein copolymer and one or more chemotherapeutic agents. Upon injection, the chemoembolic agent blocks the tumor vasculature, including the capillary bed, and may optionally release chemotherapeutic agents. The chemoembolic agent may be used to treat cancer, including hepatocellular carcinoma. | 07-10-2014 |
Kouros Ghandehari, Santa Clara, CA US
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20100009536 | MULTILAYER LOW REFLECTIVITY HARD MASK AND PROCESS THEREFOR - A method utilizing a multilayer anti-reflective coating layer structure can achieve low reflectivity at high numerical apertures. The multilayer anti-reflective coating structure can be utilized as a hard mask forming various integrated circuit structures. A multilayer anti-reflective coating structure can be utilized to form gate stacks comprised of polysilicon and a dielectric layer. A photoresist is applied above the multilayer anti-reflective coating which can include silicon oxynitride (SiON) and silicon rich nitride (SiRN). | 01-14-2010 |
20120045888 | MULTILAYER LOW REFLECTIVITY HARD MASK AND PROCESS THEREFOR - A method utilizing a multilayer anti-reflective coating layer structure can achieve low reflectivity at high numerical apertures. The multilayer anti-reflective coating structure can be utilized as a hard mask forming various integrated circuit structures. A multilayer anti-reflective coating structure can be utilized to form gate stacks comprised of polysilicon and a dielectric layer. A photoresist is applied above the multilayer anti-reflective coating which can include silicon oxynitride (SiON) and silicon rich nitride (SiRN). | 02-23-2012 |
Kouros Ghandehari, Fremont, CA US
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20090294969 | SEMICONDUCTOR CONTACT FORMATION SYSTEM AND METHOD - The present invention is a semiconductor contact formation system and method. Contact insulation regions are formed with multiple etch stop sublayers that facilitate formation of contacts. This contact formation process provides relatively small substrate connections while addressing critical lithographic printing limitation concerns in forming contact holes with small dimensions. In one embodiment, a multiple etch stop insulation layer comprising multiple etch stop layers is deposited. A contact region is formed in the multiple etch stop insulation layer by selectively removing (e.g., etching) some of the multiple etch stop insulation layer. In one embodiment, a larger portion of the multiple etch stop insulation layer is removed close to the metal layer and a smaller portion is removed closer to the substrate. The different contact region widths are achieved by performing multiple etching processes controlled by the multiple etch stop layers in the multiple etch stop insulation layer and spacer formation to shrink contact size at a bottom portion. Electrical conducting material (e.g., tungsten) is deposited in the contact region. | 12-03-2009 |