Patent application number | Description | Published |
20090281229 | PORTABLE ELECTRONIC DEVICE COVER COMPRISING RENEWABLE POLYAMIDE RESIN COMPOSITION - The invention discloses a portable electronic device cover comprising renewable thermoplastic polyamide compositions having a carbon content, wherein the carbon content comprises at least 50 percent modern carbon, as determined with ASTM-D6866 method. | 11-12-2009 |
20100028580 | HEAT RESISTANT THERMOPLASTIC ARTICLES - Disclosed is a molded or extruded thermoplastic article including a polyamide composition including (a) a polyamide resin (b) 0.1 to 10 weight percent of one or more polyhydric alcohols (c) 0 to 3 weight percent of a co-stabilizer selected from the group consisting of secondary aryl amines, hindered amine light stabilizers, and mixtures thereof; (d) 0 to less than 10 weight percent of one or more reinforcement agents; and (e) 0 to 50 weight percent polymeric toughener including a reactive functional group and/or a metal salt of a carboxylic acid; and wherein 4 mm test bars prepared from the polyamide composition, and exposed at an test temperature of 150° C. for a test period of about 1000 hours, have, on average, a retention of strain at break of greater than 80 percent compared with a control exposed at the said test temperature for 72 hours. | 02-04-2010 |
20100029819 | HEAT RESISTANT MOLDED OR EXTRUDED THERMOPLASTIC ARTICLES - Disclosed is a molded or extruded thermoplastic article having high heat stability over at least 500 hours at least 170° C. including a thermoplastic composition including a thermoplastic resin; one or more polyhydric alcohols having more than two hydroxyl groups and a having a number average molecular weight (M | 02-04-2010 |
20100160008 | LOW SINK MARKS AND EXCELLENT SURFACE APPEARANCE REINFORCED POLYAMIDE COMPOSITIONS - The invention relates to resin compositions comprising a) at least one amorphous semi-aromatic polyamide; b) at least two semi-crystalline polyamides, b1) and b2) and c) at least one glass reinforcement agent and shaped articles thereof showing a good balance of properties in terms of good mechanical properties, excellent surface appearance and reduced sink marks. | 06-24-2010 |
20100249282 | ENVIRONMENTALLY FRIENDLY ELECTRONIC DEVICE HOUSINGS - The present invention relates to the field of natural fiber reinforced polyamide compositions, particularly it relates to natural fiber reinforced polyamide compositions for manufacturing environmentally friendly electronic device housings that exhibit good mechanical properties. | 09-30-2010 |
20100307626 | MULTI-LAYERED COEXTRUDED TUBE - Multi-layered co-extruded tubes are provided that include an outer layer including a first semiaromatic semicrystalline polyamide having a melt temperature of about 240° C. to 280° C., and a thermal stabilizer; and an inner layer including a second semiaromatic semicrystalline polyamide having a glass transition equal to or greater than 100° C. | 12-09-2010 |
20120046398 | SALT RESISTANT POLYAMIDE COMPOSITIONS - Disclosed is a thermoplastic composition including: | 02-23-2012 |
20120177858 | POLYAMIDE COMPOSITIONS FOR FLOW MOLDING - The present invention relates to polyamide compositions having improved crystallization rates for blow molding articles having complex shapes. The use of tripentaerythritol in polyamide compositions slows down the crystallization rate of the polyamide compositions so that they can be used to blow mold large parts having an excellent surface appearance. Due to the longer crystallization times, these polyamide compositions can be used to blow mold very large and intricate parts. | 07-12-2012 |
20130022786 | DEVICE HOUSINGS HAVING EXCELLENT SURFACE APPEARANCE - The invention relates to resin compositions comprising at least one amorphous semi-aromatic polyamide, at least one semi-crystalline polyamide, and at least one glass reinforcement agent wherein the composition has a good balance of properties in terms of good mechanical properties, excellent surface appearance, and chemical resistance. This invention also relates to the use of such polyamide resins to manufacture device housings. | 01-24-2013 |
20130115401 | HYDROLYTIC RESISTANT POLYAMIDE COMPOSITIONS COMPRISING POLYHYDROXY POLYMERS - The present invention relates to the thermoplastic compositions having improved high temperature hydrolytic stability. The addition of polyhydroxy polymers to specific polyamides or polyamide blends increases the elongation at break of these thermoplastic compositions after exposure to high temperature aqueous ethylene glycol solutions. The thermoplastic compositions are useful in the preparation of hoses and pipes for transport of aqueous high temperature fluids. | 05-09-2013 |
20130158184 | Light-Emitting Diode Assembly Housing Comprising Poly(Cyclohexanedimethanol Terephthalate) Compositions - Light-emitting diode assembly housing comprising high temperature poly(1,4-cyclohexanedimethanol terephthalate) compositions containing titanium dioxide. | 06-20-2013 |
20140065338 | MONOLAYER TUBES COMPRISING THERMOPLASTIC POLYAMIDE - Disclosed is a monolayer tube comprising a melt-blended thermoplastic composition consisting essentially of (A) a polyamide resin selected from the group consisting of PA 614, PA 616, PA 618 and blends of these; and optionally: (B) one or more polymeric toughener(s); (C) one or more plasticizer(s); and (D) one or more functional additive(s); wherein the weight percent of (A), (B), (C), and (D) are based on the total weight of the melt-blended thermoplastic composition. | 03-06-2014 |