Patent application number | Description | Published |
20100226173 | Nonvolatile Semiconductor Memory Device - A NAND cell unit includes memory cells which are connected in series. An erase operation is effected on all memory cells. Then, a soft-program voltage, which is opposite in polarity to the erase voltage applied in an erase operation, is applied to all memory cells, thereby setting all memory cells out of an over-erased state. Thereafter, a program voltage of 20V is applied to the control gate of a selected memory cell, 0V is applied to the control gates of the two memory cells provided adjacent to the selected memory cell, and 11V is applied to the control gates of the remaining memory cells. Data is thereby programmed into the selected memory cell. The time for which the program voltage is applied to the selected memory cell is adjusted in accordance with the data to be programmed into the selected memory cell. Hence, data “0” can be correctly programmed into the selected memory cell, multi-value data can be read from any selected memory cell at high speed. | 09-09-2010 |
20110267886 | Nonvolatile Semiconductor Memory Device - A NAND cell unit includes memory cells which are connected in series. An erase operation is effected on all memory cells. Then, a soft-program voltage, which is opposite in polarity to the erase voltage applied in an erase operation, is applied to all memory cells, thereby setting all memory cells out of an over-erased state. Thereafter, a program voltage of 20V is applied to the control gate of a selected memory cell, 0V is applied to the control gates of the two memory cells provided adjacent to the selected memory cell, and 11V is applied to the control gates of the remaining memory cells. Data is thereby programmed into the selected memory cell. The time for which the program voltage is applied to the selected memory cell is adjusted in accordance with the data to be programmed into the selected memory cell. Hence, data “0” can be correctly programmed into the selected memory cell, multi-value data can be read from any selected memory cell at high speed. | 11-03-2011 |
Patent application number | Description | Published |
20100155812 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A non-volatile memory of a semiconductor device has a tunnel insulation film provided on the active area; a floating gate electrode provided on the tunnel insulation film; a control gate electrode provided over the floating gate electrode; and an inter-electrode insulation film provided between the floating gate electrode and the control gate electrode, wherein, in a section of the non-volatile memory cell in a channel width direction, a dimension of a top face of the active area in the channel width direction is equal to or less than a dimension of a top face of the tunnel insulation film in the channel width direction, and the dimension of the top face of the tunnel insulation film in the channel width direction is less than a dimension of a bottom face of the floating gate electrode in the channel width direction. | 06-24-2010 |
20120217571 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - Nonvolatile semiconductor memory device includes first memory cell array layer, first insulating layer formed thereabove, and second memory cell array layer formed thereabove. First memory cell array layer includes first NAND cell units each including plural first memory cells. The first memory cell includes first semiconductor layer, first gate insulating film formed thereabove, and first charge accumulation layer formed thereabove. The second memory cell array layer includes second NAND cell units each including plural second memory cells. The second memory cell includes second charge accumulation layer, second gate insulating film formed thereabove, and second semiconductor layer formed thereabove. Control gates are formed, via an inter-gate insulating film, on first-direction both sides of the first and second charge accumulation layers positioned the latter above the former via the first insulating layer. The control gates extend in a second direction perpendicular to the first direction. | 08-30-2012 |
20130228844 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A nonvolatile semiconductor memory device according to an embodiment includes a plurality of cell array layers, each cell array layer including: a plurality of semiconductor layers that extends in a first direction; gate insulating layers; a plurality of floating gates arranged in the first direction; inter-gate insulating layers; and a plurality of control gates that extends in a second direction intersecting semiconductor layers, and faces the floating gates via the inter-gate insulating layers, in which, in the cell array layers adjacent each other in a stacking direction, the control gates of a lower cell array layer and the control gates of the an upper cell array layer are intersecting each other, and the floating gates within the lower cell array layer and the semiconductor layers within the upper cell array layer are aligned in position with each other. | 09-05-2013 |
20130235666 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACURING THE SAME - A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array in which a plurality of NAND cell units are arranged, the NAND cell units including a plurality of memory cells, and select gate transistors, the memory cell including a semiconductor layer, a gate insulating film, a charge accumulation layer, and a control gate; and a control circuit. The control circuit adjusts a write condition of each of the memory cells in accordance with write data to each of the memory cells and memory cells adjacent to the memory cells within the data to be written. | 09-12-2013 |
Patent application number | Description | Published |
20090014304 | Key sheet - A thin-film-like key sheet covering pushbutton switches is equipped with a plurality of key tops constituting operating pushbuttons, and a film-like base sheet on an upper surface of which the key tops are placed, in which a depression load is small, and no interference with the adjacent key tops and a frame sheet occurs when depressing the key tops, thus avoiding undulating movement of those components. There is further provided a film-like shape maintaining sheet covering a lower surface of a base sheet and stacked on the base sheet, and the shape maintaining sheet has, at dividing positions between the adjacent key tops, insulating slits insulating a stress generated along a surface of the shape maintaining sheet when the key tops are depressed. Thus, the key tops do not easily rise or become shaky at a time of depressing operation. | 01-15-2009 |
20100032276 | KEY SHEET - Provided is a key sheet which can effect reliable fixation inside a casing without occupying a large space, and includes key tops having large operating surfaces. A sheet surface of a base sheet is set substantially the same in size as a projection surface in a depressing direction of a key top group, and a frame-shaped elastic fixation portion is formed at an outer edge of the base sheet. Thus, a mounting space for a key sheet inside a casing can be contained within a range of the projection surface in the depressing direction of the key top group, and the key sheet can be firmly fixed to a circuit board. The key top group is the same in size as the base sheet. Thus, the key sheet including key tops having large operating surfaces can be realized. | 02-11-2010 |
Patent application number | Description | Published |
20090283815 | SEMICONDUCTOR DEVICE INCLUDING NONVOLATILE MEMORY AND METHOD FOR FABRICATING THE SAME - A semiconductor device including a nonvolatile memory and the fabrication method of the same is described formed on a semiconductor substrate. According to the semiconductor device, a second gate electrode film is used for a gate electrode film of a logic circuit, and for a control gate electrode film of a nonvolatile memory. As the second gate electrode film is formed at a relatively later step in fabrication, subsequent thermal process may be avoided. The gate structure is suitable for miniaturization of the transistor in the logic circuit. | 11-19-2009 |
20100019311 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - This semiconductor memory device comprises a semiconductor substrate, a plurality of tunnel insulator films formed on the semiconductor substrate along a first direction and a second direction orthogonal to the first direction with certain spaces in each directions, a plurality of charge accumulation layers formed on the plurality of tunnel insulator films, respectively, a plurality of element isolation regions formed on the semiconductor substrate, the plurality of element isolation regions including a plurality of trenches formed along the first direction between the plurality of tunnel insulator films, a plurality of element isolation films filled in the plurality of trenches, a plurality of inter poly insulator films formed over the plurality of element isolation regions and on the upper surface and side surfaces of the plurality of charge accumulation layer along the second direction in a stripe shape, a plurality of air gaps formed between the plurality of element isolation films filled in the plurality of trenches and the plurality of inter poly insulator films and a plurality of control gate electrodes formed on the plurality of inter poly insulator films. | 01-28-2010 |
20100020608 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory cell array region having memory cells connected in series; a control circuit region disposed below the memory cell array region; and an interconnection portion electrically connecting the control circuit region and the memory cell array region. The memory cell array region includes: a plurality of first memory cell regions having the memory cells; and a plurality of connection regions. The interconnection portion is provided in the connection regions. The first memory cell regions are provided at a first pitch in a first direction orthogonal to a lamination direction of the memory cell array region and the control circuit region. The connection regions are provided between the first memory cell regions mutually adjacent in the first direction, and at a second pitch in a second direction orthogonal to the lamination direction and the first direction. | 01-28-2010 |
20110215473 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor device includes a first contact, a second contact, and an intermediate interconnection. The first contact is made of a first conductive material. The second contact is made of a second conductive material. A lower end portion of the second contact is connected to an upper end portion of the first contact. The intermediate interconnection is made of a third conductive material and isolated from the first contact and the second contact. A lower face of the intermediate interconnection is positioned higher than a lower face of the first contact. An upper face of the intermediate interconnection is positioned lower than an upper face of the second contact. A diffusion coefficient of the first conductive material with respect to the second conductive material is lower than a diffusion coefficient of the third conductive material with respect to the second conductive material. | 09-08-2011 |
20110300703 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - This semiconductor memory device comprises a semiconductor substrate, a plurality of tunnel insulator films formed on the semiconductor substrate along a first direction and a second direction orthogonal to the first direction with certain spaces in each directions, a plurality of charge accumulation layers formed on the plurality of tunnel insulator films, respectively, a plurality of element isolation regions formed on the semiconductor substrate, the plurality of element isolation regions including a plurality of trenches formed along the first direction between the plurality of tunnel insulator films, a plurality of element isolation films filled in the plurality of trenches, a plurality of inter poly insulator films formed over the plurality of element isolation regions and on the upper surface and side surfaces of the plurality of charge accumulation layer along the second direction in a stripe shape, a plurality of air gaps formed between the plurality of element isolation films filled in the plurality of trenches and the plurality of inter poly insulator films and a plurality of control gate electrodes formed on the plurality of inter poly insulator films. | 12-08-2011 |
20120025293 | SEMICONDUCTOR MEMORY DEVICE HAVING A FLOATING GATE AND A CONTROL GATE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor memory device having a memory cells and word lines is provided. The memory cells are formed in a semiconductor layer and arranged in matrix. Each of the memory cells has a floating gate and a control gate. Each plurality of the memory cells is connected in series in a row direction. Each of the word lines is connected to each plurality of the control gates in a column direction. First and second intervals are provided for the memory cells alternately in the column direction. The second interval is larger than the first interval. | 02-02-2012 |
20120217567 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - This semiconductor memory device comprises a semiconductor substrate, a plurality of tunnel insulator films formed on the substrate along a first direction and a second direction orthogonal to the first direction, a plurality of charge accumulation layers formed on the tunnel insulator films, respectively, a plurality of element isolation regions formed on the substrate, the element isolation regions including a plurality of trenches formed along the first direction between the tunnel insulator films, a plurality of element isolation films filled in the trenches, a plurality of inter-poly insulator films formed over the element isolation regions and on the upper and side surfaces of the charge accumulation layers along the second direction in a stripe shape, a plurality of air gaps formed between the element isolation films filled in the trenches and the inter-poly insulator films and a plurality of control gate electrodes formed on the inter-poly insulator films. | 08-30-2012 |