Fukayama
Junichi Fukayama, Tokyo JP
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20150042225 | HEADLIGHT CONTROLLER AND VEHICLE HEADLIGHT SYSTEM - A headlight controller and a vehicle headlight system including an ADB can include a headlight controller and an optical unit. The headlight controller can include a system controller and a camera photographing vehicles located in a forward direction thereof, and the system controller can be configured to output a control signal to provide various favorable light distribution patterns by using image data output from the camera in accordance with traffic conditions. The optical unit can be configured to emit beam lights using lights emitted from a first and second light-emitting device via a projector lens so that the beam lights can be used as a high beam and a low beam without movable parts. Thus, the disclosed subject matter can include providing vehicle headlight systems that can form various favorable light distribution patterns by utilizing the characteristics of the controller and the optical unit in accordance with the traffic conditions. | 02-12-2015 |
Kazuteru Fukayama, Kanagawa JP
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20150154153 | INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD, AND PROGRAM - There is provided an information processing device including a page feed unit configured to continuously feed pages in contents including a plurality of pages, and a display control unit configured to change the number of the pages to be displayed on a display screen according to an operation by a user when the pages are fed by the page feed unit. | 06-04-2015 |
Kenzo Fukayama, Kawasaki-Shi JP
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20160070073 | OPTICAL CONNECTOR APPARATUS - An optical connector apparatus includes a connector which is connected to an electro-optical composite cable including an optical fiber and a metal conductor, and a connection object to be connected. The connector is provided with a ferrule which has a conductive portion on at least a part of the surface thereof. The connection object to be connected is provided with an electrically conductive connection member to be connected to the ferrule. The ferrule and the cable are connected by a crimping structure. When the ferrule is inserted in the connection member, the connector and the connection object to be connected are electrically and optically connected to each other. Provided is also an optical connector apparatus which comprises a connector having a plurality of ferrules having distances between the end of the ferrules and the conductive portions so that the timing of the connection of the connector to the object to be connected is delayed, and thus the optical connector apparatus is capable of hot swapping. The connection object to be connected can be a combination of an adapter and a mating connector, or an optical element and an adapter which holds the same, etc. | 03-10-2016 |
Kenzo Fukayama, Kanagawa JP
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20110293223 | OPTICAL CONNECTOR APPARATUS - Provided is an optical connector apparatus comprising a connector which is connected to an electro-optical composite cable including an optical fiber and a metal conductor, and a connection object to be connected. The connector is provided with a ferrule which has a conductive portion on at least a part of the surface thereof. The connection object to be connected is provided with an electrically conductive connection member to be connected to the ferrule. The ferrule and the cable are connected by a crimping structure. When the ferrule is inserted in the connection member, the connector and the connection object to be connected are electrically and optically connected to each other. Provided is also an optical connector apparatus which comprises a connector having a plurality of ferrules having distances between the end of the ferrules and the conductive portions so that the timing of the connection of the connector to the object to be connected is delayed, and thus the optical connector apparatus is capable of hot swapping. The connection object to be connected can be a combination of an adapter and a mating connector, or an optical element and an adapter which holds the same, etc. | 12-01-2011 |
Masashi Fukayama, Tokyo JP
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20150291694 | Cancer Diagnosis and Treatment of Cancer Using Anti-Robo 1 Antibody - A method for diagnosing cancer comprising detecting ROBO1 protein is disclosed. In addition, a method for treating a disease caused by abnormal cell growth comprising administrating an antibody that binds to ROBO1, as well as a pharmaceutical composition, a cell growth inhibitor and an anticancer agent comprising an antibody that binds to ROBO1 as an active ingredient are disclosed. Further, a method for inducing cell damages in a ROBO1 expressing cell and a method for inhibiting the growth of a ROBO1 expressing cell by bringing a ROBO1 expressing cell into contact with an antibody that binds to ROBO1, are disclosed. Furthermore, a method for monitoring progression of hepatitis by detecting ROBO1 protein is disclosed. | 10-15-2015 |
Mitsuaki Fukayama, Inuyama-Shi JP
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20140030051 | STACKER CRANE - A stacker crane includes a truck frame, a mast erected on the truck frame, and a platform raised and lowered along the mast, the platform including first and second rollers, the mast including a roller abutting member in which a first plate material is folded to define a first abutting surface onto which the first roller abuts and a second abutting surface onto which the second roller abuts, a back-side member made of a second plate material and arranged opposite to the roller abutting member, and a coupling member coupling the roller abutting member and the back-side member, the coupling member including first and second coupling surfaces which are plate-shaped and are opposite to each other, wherein the thickness of the first and second coupling surfaces is smaller than the thickness of the first plate material. | 01-30-2014 |
Motoaki Fukayama, Osaka-Shi JP
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20150355516 | DISPLAY COMPONENT AND DISPLAY DEVICE - An array board | 12-10-2015 |
20160048045 | DISPLAY COMPONENT, DISPLAY DEVICE, AND METHOD OF PRODUCING DISPLAY COMPONENT - An array board | 02-18-2016 |
Norihisa Fukayama, Mobara JP
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20090033825 | Liquid Crystal Display Device - The present invention provides a liquid crystal display device in which a light transmitting conductive layer formed on a surface of a color filter substrate is electrically connected with a backlight lower frame using conductive rubber. One end of the conductive rubber is connected with the light transmitting conductive layer, and another end of the conductive rubber is connected with the backlight lower frame through a hole which is formed in a backlight upper frame. The liquid crystal display device of the present invention can remove static electricity charged in a surface of a display panel and, at the same time, can realize the narrowing of a picture frame and the reduction of thickness thereof. | 02-05-2009 |
20090046217 | LIQUID CRYSTAL DISPLAY DEVICE - In a liquid crystal display device, a recessed portion is formed in a portion of a periphery of a lower frame, a columnar member is provided to the recessed portion, the columnar member is allowed to pass through a hole formed in a projecting portion which is provided on an optical sheet, and a side surface of a liquid crystal panel is brought into contact with the columnar member. The columnar member provided on the lower frame not only determines the position of the liquid crystal panel with respect to the lower frame, but also determines the position of the optical sheet with respect to the lower frame and firmly holds the optical sheet onto the lower frame, thus preventing the disengagement of the optical sheet from the lower frame. | 02-19-2009 |
20090109368 | Liquid Crystal Display Device - In a liquid crystal display device which uses light emitting diodes as a light source, the present invention provides a light source which can be effectively housed in a housing casing of a backlight even when an area of a printed circuit board is increased by taking radiation of heat from the light emitting diodes into consideration. A printed circuit board is formed by arranging light emitting diodes on a flexible substrate. The printed circuit board is formed with an area larger than an area of a light incident surface of a light guide plate, and is arranged to face the light incident surface of the light guide plate in an opposed manner. The light guide plate and the printed circuit board are housed in the inside of a housing casing, the printed circuit board is made foldable by forming slits in the printed circuit board thus enabling housing of the printed circuit board in the housing casing in a folded shape. Due to housing of the printed circuit board in a folded shape, a contact area of the printed circuit board with the housing casing is increased thus enhancing a heat radiation effect. | 04-30-2009 |
20100201906 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - The liquid crystal display device includes a middle frame fixing a liquid crystal display panel, a lower frame having a first plate portion, and a lower cover having a second plate portion and a housing together with the upper cover. A pitch of first through holes formed in the lower frame and a pitch of second through holes formed in the lower cover differ from each other. By selecting a combination of the first through hole and the second through hole, by aligning the selected first through hole and second through hole, and by inserting an insert into the aligned first through hole and the second through hole, a relative positional relationship between the first through hole and the second through hole is fixed. | 08-12-2010 |
20110164196 | Liquid Crystal Display Device - The present invention provides a liquid crystal display device in which a light transmitting conductive layer formed on a surface of a color filter substrate is electrically connected with a backlight lower frame using conductive rubber. One end of the conductive rubber is connected with the light transmitting conductive layer, and another end of the conductive rubber is connected with the backlight lower frame through a hole which is formed in a backlight upper frame. The liquid crystal display device of the present invention can remove static electricity charged in a surface of a display panel and, at the same time, can realize the narrowing of a picture frame and the reduction of thickness thereof. | 07-07-2011 |
Norihisa Fukayama, Yokohama JP
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20130258239 | LIQUID CRYSTAL DISPLAY DEVICE - A conductive elastic sheet includes: an outer portion sandwiched between a resin frame portion and a metal frame portion and brought into contact with the metal frame portion; an inner portion laminated to an image display screen; and a connecting portion connecting the outer and inner portions. An upper surface of the resin frame portion is arranged at a higher position than the image display screen. The outer portion of the conductive elastic sheet is arranged at a higher position than the inner portion. The inner portion of the conductive elastic sheet is laminated to the image display screen in a flat shape. The conductive elastic sheet has a slit formed between the outer and inner portions and adjacent to the connecting portion. The connecting portion is bent in a height increasing direction from the same height position as the inner portion. | 10-03-2013 |
Shinya Fukayama, Nagoya Aichi JP
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20150123270 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - According to one embodiment, a first electrode is formed on a first face of a first semiconductor chip, and a second electrode and a protrusion are formed on a second face of a second semiconductor chip. The first semiconductor chip and the second semiconductor chip are spaced from one another by the protrusion in such a manner that the first face and the second face face each other. The first semiconductor chip and the second semiconductor chip are subject to reflow to be electrically connected to each other, and then the protrusion is cured at a temperature lower than a reflow temperature. | 05-07-2015 |
20160079102 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS - A method for manufacturing a semiconductor device includes determining a position of a first semiconductor chip having a plurality of first electrodes, using one or more first alignment marks formed on the first semiconductor chip, determining a position of a second semiconductor chip having a plurality of second electrodes, using one or more second alignment marks formed on the second semiconductor chip, moving the second semiconductor chip relative to the first semiconductor chip, based on the determined positions of the first and second semiconductor chips, such that the second electrodes are aligned with the first electrodes, after said moving, stacking the second semiconductor chip on the first semiconductor chip, such that the first electrodes are electrically connected to the second electrodes, and calculating a misalignment amount between the first semiconductor chip and the second semiconductor chip stacked thereon. | 03-17-2016 |
Shinya Fukayama, Aichi JP
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20150069110 | SEMICONDUCTOR MANUFACTURING APPARATUS - A semiconductor manufacturing apparatus includes: a collet which sucks a semiconductor chip having a main surface on which a bump is formed, and an actuator which transfers the sucked semiconductor chip onto a mounting substrate or another semiconductor chip by driving the collet. A recessed portion for avoiding a contact between the collet and the bump is formed on a suction surface of the collet which sucks the semiconductor chip. | 03-12-2015 |
20150069634 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a first semiconductor chip having a first main surface and a second main surface which opposes the first main surface and on which a first electrode is mounted, a second semiconductor chip having a third main surface on which a second electrode connected to the first electrode is provided and a fourth main surface which opposes the third main surface, and a first spacer which is arranged in a region formed between the first and second electrodes and an outer peripheral surface of the first and second semiconductor chips, and ensures a gap between the first semiconductor chip and the second semiconductor chip. | 03-12-2015 |
Shohei Fukayama, Osaka JP
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20150148921 | WIRELESS DEVICE, CONTROLLED DEVICE CONTROLLED BY THE SAME, CONTROL SYSTEM INCLUDING A WIRELESS DEVICE AND CONTROLLED DEVICE, AND PROGRAM FOR CAUSING A COMPUTER IN A WIRELESS DEVICE TO CONTROL A CONTROLLED DEVICE - A wireless device ( | 05-28-2015 |
Shoichi Fukayama, Brookline, MA US
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20080241129 | ADIPOCYTE SECRETED PROTEIN CCDC80 IS A POTENT STIMULATOR OF BONE FORMATION - Disclosed herein are methods of using Ccdc80, Ccdc80 mimics, or Ccdc80 agonists or antagonists in the treatment of bone disorders. | 10-02-2008 |
Yoshio Fukayama, Tokyo JP
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20090179261 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - Provided is a manufacturing method of a semiconductor device wherein the generation of voids is prevented in aluminum-based electrodes or the like. The method is suitable for manufacturing a semiconductor device adapted for vehicles, which is required to have a high reliability. However, it is very difficult that power semiconductor devices such as power MOSFETs, in particular, trench gate type power MOS devices are formed without having any void since the thickness of aluminum-based electrodes thereof is as large as about 3500 to 5500 nm (2.5 μm or more). In the present invention, a method is provided wherein at the time of forming an aluminum-based electrode metal film positioned over a wafer and having a thickness of 2.5 μm or more over a highland/lowland-repeated region in a line and space form by sputtering, the temperature of the wafer is set to 400° C. or higher and lower than 500° C. | 07-16-2009 |
Yoshio Fukayama, Ichinomiya JP
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20100252924 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. To this end, in a region where an occupation rate of wiring is smaller than those in other regions, a dummy wiring is provided. On the contrary, when the occupation rate of wiring is larger than in other regions, slits are formed in the wiring to control the wiring occupation rate. In the respective wirings layers, the shapes, sizes and intervals of wirings below the respective electrode pads are made similar or equal to one another. | 10-07-2010 |
20120205788 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. To this end, in a region where an occupation rate of wiring is smaller than those in other regions, a dummy wiring is provided. On the contrary, when the occupation rate of wiring is larger than in other regions, slits are formed in the wiring to control the wiring occupation rate. In the respective wirings layers, the shapes, sizes and intervals of wirings below the respective electrode pads are made similar or equal to one another. | 08-16-2012 |
20140159245 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. To this end, in a region where an occupation rate of wiring is smaller than those in other regions, a dummy wiring is provided. On the contrary, when the occupation rate of wiring is larger than in other regions, slits are formed in the wiring to control the wiring occupation rate. In the respective wirings layers, the shapes, sizes and intervals of wirings below the respective electrode pads are made similar or equal to one another. | 06-12-2014 |