Patent application number | Description | Published |
20110018119 | Semiconductor packages including heat slugs - A semiconductor package may include at least one semiconductor chip mounted on a substrate, a molding layer adapted to mold the at least one semiconductor chip, a heat slug, on the molding layer, having a structure in which a dielectric is provided between conductors, and a through mold via electrically connecting the heat slug to the substrate. | 01-27-2011 |
20130021768 | CHIP-ON-FILM PACKAGES AND DEVICE ASSEMBLIES INCLUDING THE SAME - Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided. | 01-24-2013 |
20130057559 | DISPLAY DEVICES - A display device includes a panel including pixels defined by data lines and gate lines, a housing chassis covering a sidewall and an edge of the panel, a printed circuit board under the panel, the printed circuit board including circuit elements configured to generate at least one of a data signal, a gate signal, and a control signal, a chip on film connecting the printed circuit board to the panel, the chip on film between the housing chassis and the sidewall of the panel, a driver integrated circuit mounted on the chip on film and configured to respond to the control signal and drive at least one of the data signal and the gate signal applied to the data lines and the gate lines, and a connection unit attaching the chip on film to the housing chassis and dissipating heat generated by the driver integrated circuit to the housing chassis. | 03-07-2013 |
20130091348 | SURFACE TEMPERATURE MANAGEMENT METHOD OF MOBILE DEVICE AND MEMORY THERMAL MANAGEMENT METHOD OF MULTICHIP PACKAGE - A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode. | 04-11-2013 |
20130139524 | THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF - Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature. | 06-06-2013 |
20130166093 | ELECTRONIC DEVICE AND TEMPERATURE CONTROL METHOD THEREOF - An electronic device may be operated in any of a plurality of heat-dissipation modes to accommodate temperature rises, including rapid temperature rises, while allowing an electronic device to continue operating. A parameter such as clock frequency, a supply voltage, current consumption, the number of applications running, or other operating parameter, may be manipulated to control internal heat dissipation and thereby accommodate factors, such as external temperature rises. One operation mode may be a maximum operation mode in which clock(s) operate at their highest frequencies and power is supplied at its highest level. A shut-down operation mode, in which a processor cuts power to electronic components, may be entered when a temperature of interest exceeds a predetermined threshold. | 06-27-2013 |
20130321041 | ELECTRONIC DEVICE AND METHOD FOR CONTROLLING TEMPERATURE THEREOF - A method for controlling a temperature of an electronic device which includes a semiconductor chip is provided. The temperature control method includes measuring a temperature of a measurement point using the electronic device, comparing the temperature of the measurement point with a target temperature varying according to a period of time when the semiconductor chip operates using the electronic device, and decreasing a clock frequency of the semiconductor chip using the electronic device when the temperature of the measurement point is higher than the target temperature. | 12-05-2013 |
20140136827 | MOBILE DEVICE AND DATA COMMUNICATION METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT OF MOBILE DEVICE - According to one general aspect, a data communication method may include detecting a temperature using a temperature sensor. The method may include selecting a bandwidth for data communications by a semiconductor integrated circuit based, at least in part, upon the detected temperature. The method may also include performing the communication of data based, at least in part, on the selected bandwidth. | 05-15-2014 |
20140184312 | SEMICONDUCTOR DEVICES AND METHODS OF CONTROLLING TEMPERATURE THEREOF - An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device. | 07-03-2014 |
20140327129 | PACKAGE ON PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a package on package (PoP) device and a method of manufacturing the same. In the PoP device, a thermal interface material layer is interposed between a lower semiconductor chip and an upper package substrate, and a heat sink is disposed on an upper semiconductor package substrate. This maximizes heat release. Accordingly, an operation speed can be improved and malfunction limitation can be solved. | 11-06-2014 |
20150084170 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided is a semiconductor package including a lower package, an interposer on the lower package, and an upper package on the interposer. The lower package may include a lower package substrate, a lower semiconductor chip on the lower package substrate, and a lower heat-transfer layer on the lower semiconductor chip. The interposer may include an interposer substrate, first and second heat-transfer openings defined by recessed bottom and top surfaces, respectively, of the interposer substrate, an upper interposer heat-transfer pad disposed in the second heat-transfer opening, and an upper heat-transfer layer disposed on the upper interposer heat-transfer pad. The upper package may include an upper package substrate, an upper package heat-transfer pad, which may be disposed in a third heat-transfer opening defined by a recessed bottom surface of the upper package substrate, and an upper semiconductor chip disposed on the upper package substrate. | 03-26-2015 |
20160084542 | THERMOELECTRIC COOLING PACKAGES AND THERMAL MANAGEMENT METHODS THEREOF - A device includes a first board having a first area and a second area not overlapping the first area; and a thermoelectric semiconductor disposed between the first board and the second board at the first area of the first board configured to supply a voltage to the thermoelectric semiconductor; a package disposed at the second area of the first board. | 03-24-2016 |
Patent application number | Description | Published |
20090012937 | APPARATUS, METHOD AND RECORDED MEDIUM FOR COLLECTING USER PREFERENCE INFORMATION BY USING TAG INFORMATION - Disclosed are an apparatus, a method and a recorded medium for collecting user preference information by using tag information. In accordance with the present invention, the apparatus collecting user preference information by using tag information, the apparatus can include a tag search unit, searching at least one tag of an anchor tag, a form tag and a combination thereof which are included in a web document outputted to the apparatus; a tag information extracting unit, extracting tag information from the searched tag; a keyword detecting unit, detecting a keyword from the tag information; and a user preference information managing unit, collecting user preference information including a user profile generated by using the keyword. With the present invention, it is possible that user's preference can be quickly and accurately analyzed per user and customized information based on the analyzed preference can be provided to the user. | 01-08-2009 |
20090019033 | USER-CUSTOMIZED CONTENT PROVIDING DEVICE, METHOD AND RECORDED MEDIUM - Disclosed are a user-customized content providing device, a method and a recorded medium. In accordance with an embodiment of the present invention, the user-customized content providing device can include a content searching unit, searching a content set related to user's search query word; a user preference information requesting unit, asking an apparatus for user preference information including a user profile and tag information through a network, the user profile including a keyword collected in the apparatus and a point applied with a weight given per keyword; a user preference information collecting unit, receiving the user preference information from the apparatus; a content ranking determining unit, determining a ranking of the content set according to the relation to the user preference information; and a content providing unit, providing the ranked content set to the apparatus. | 01-15-2009 |
20090313086 | USER RECOMMENDATION METHOD AND RECORDED MEDIUM STORING PROGRAM FOR IMPLEMENTING THE METHOD - A method of recommendation to a user is disclosed. In the method in accordance with an embodiment of the present invention, a recommendation system recommends a product to a user of an e-commerce site, which sells the product through the Internet. The method can include: collecting user behavior information of the user; analyzing the collected user behavior information; creating a recommendation tree for predicting a user preference for a certain product based on the analyzing; and recommending the product to the user based on the recommendation tree. The user behavior information is a command signal inputted by the user in the e-commerce site while the user is accessed to the e-commerce site, and the product can be classified into a plurality of items, which represent the product. The method in accordance with the present invention can analyze the user's preferences more quickly and accurately without inconveniencing the user. | 12-17-2009 |