Patent application number | Description | Published |
20120010819 | APPARATUS AND METHOD FOR PULSED NEUTRON MEASUREMENT - A method of estimating at least one property of an earth formation includes: constructing a matrix model of a formation; constructing a shale model of the formation, the shale model including an estimation of a concentration of at least one trace element; combining the first model and the second model to generate a formation model; and comparing measured pulsed neutron data with the mixed model to estimate the at least one property. | 01-12-2012 |
20120068060 | METHOD FOR THROUGH-CASING 3-PHASE SATURATION DETERMINATION - A method for estimating a parameter of interest of an earth formation having a fluid contained in pores of the earth formation, the method includes: conveying a carrier through a borehole penetrating the earth formation; irradiating the earth formation with neutrons from a neutron source disposed at the carrier; measuring radiation emitted from the earth formation resulting from the irradiating using at least one detector; calculating or determining a mathematical parameter from radiation measured by the at least one detector; predicting values of the mathematical parameter over a range of values of an earth formation property; and comparing the mathematical parameter to the predicted values to estimate the parameter of interest. | 03-22-2012 |
20120075953 | METHOD AND APPARATUS FOR EVALUATING A CEMENTED BOREHOLE CASING - A method of evaluating a cased borehole in an earth formation includes: emitting at least one acoustic signal into the borehole via an acoustic source and detecting a return acoustic signal via an acoustic sensor, the borehole including a casing and a casing support material disposed between the casing and a borehole wall; emitting a neutron flux via a neutron source into the borehole and detecting a radiation signal via a radiation detector, the radiation signal including induced gamma radiation resulting from neutron interactions; and identifying a casing support material characteristic based on the return acoustic signal and the radiation signal. | 03-29-2012 |
20120091329 | METHOD FOR HYDROCARBON SATURATION AND HYDRAULIC FRAC PLACEMENT - A method for estimating a property of an earth formation, the method includes: conveying a carrier through a borehole penetrating the earth formation; irradiating the formation with neutrons from a neutron source disposed at the carrier; detecting a first signal from the formation due to the irradiating using a first radiation detector, the first signal being related to a saturation of a fluid in the formation; detecting a second signal from an element in the formation due to the irradiating using a second radiation detector, the second signal being related to an element emitting the second signal in the formation; and estimating the property from the first signal and the second signal. | 04-19-2012 |
20130234703 | HYDROCARBON DETERMINATION IN UNCONVENTIONAL SHALE - An apparatus is disclosed for identifying a fluid and locations of the fluid in a formation of shale having porous kerogen material and an inorganic matrix defining pores and micro-fractures. The apparatus includes: a carrier configured to be conveyed through a borehole penetrating the shale; a nuclear magnetic resonance (NMR) tool disposed at the carrier and configured to perform NMR measurements on the shale, the NMR measurements include a spectrum of transverse relaxation times; and a processor configured to receive NMR measurements on the shale performed by the NMR tool and to identify the fluid and locations of the fluid in the shale using the spectrum of transverse relaxation times. | 09-12-2013 |
20130248169 | Environmentally Powered Transmitter for Location Identification of Wellbores - A method, apparatus and system for performing an operation in a borehole is disclosed. A device is disposed in a downhole environment of the borehole to perform the downhole operation. An energy harvesting unit coupled to the device harvests energy from an energy source in a downhole environment of the device and provides the harvested energy to the device to perform the downhole operation. | 09-26-2013 |
20160084056 | Method and System for Hydraulic Fracture Diagnosis with the use of a Coiled Tubing Dual Isolation Service Tool - A hydraulic fracture diagnostic system for reservoir evaluation of a high angle wellbore includes a coiled tubing string that extends from the surface to a location within a wellbore. The system includes a sensor and a pump connected to the coiled tubing string. A tool having at least two packing elements and a port positioned between the packing elements is connected to the coiled tubing string. The coiled tubing string positions the tool adjacent a fracture. The packing elements isolate the fracture and the port is configured to provide communication with the isolated portion of the wellbore. A diagnostic method includes pumping a volume of fluid from the isolated portion of a wellbore using a coiled tubing string and monitoring the pressure within the coiled tubing string. Pressure within the coiled tubing string may also be monitored after injection of fluid into the isolated wellbore through the coiled tubing string. | 03-24-2016 |
20160084078 | Method and System for Hydraulic Fracture Diagnosis with the use of a Coiled Tubing Dual Isolation Service Tool - A hydraulic fracture diagnostic system for reservoir evaluation of a high angle wellbore includes coiled tubing that extends from the surface to a wellbore location. The system includes a sensor and a pump connected to the coiled tubing and a pump and sensor connected to an annulus between the coiled tubing and the wellbore casing. A tool having at least two packing elements and a port positioned between the packing elements is connected to the coiled tubing and is positioned adjacent a fracture. The packing elements isolate the fracture and the port is configured to provide communication with the isolated portion of the wellbore. A diagnostic method includes pumping a volume of fluid into the isolated portion of a wellbore and monitoring the pressure within the annulus via the coiled tubing. The tool may also be used in an openhole portion of a wellbore to diagnose the formation. | 03-24-2016 |
Patent application number | Description | Published |
20130189804 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS - A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure. | 07-25-2013 |
20130210214 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure. | 08-15-2013 |
20130301975 | HYBRID OPTICAL MODULATOR - An optical modulator includes an input port, a first waveguide region comprising silicon and optically coupled to the input port, and a waveguide splitter optically coupled to the first waveguide region and having a first output and a second output. The optical modulator also includes a first phase adjustment section optically coupled to the first output and comprising a first III-V diode and a second phase adjustment section optically coupled to the second output and comprising a second III-V diode. The optical modulator further includes a waveguide coupler optically coupled to the first phase adjustment section and the second phase adjustment section, a second waveguide region comprising silicon and optically coupled to the waveguide coupler, and an output port optically coupled to the second waveguide region. | 11-14-2013 |
20140037286 | METHOD AND SYSTEM FOR THE MONOLITHIC INTEGRATION OF CIRCUITS FOR MONITORING AND CONTROL OF RF SIGNALS - A method of operating a BPSK modulator includes receiving an RF signal at the BPSK modulator and splitting the RF signal into a first portion and a second portion that is inverted with respect to the first portion. The method also includes receiving the first portion at a first arm of the BPSK modulator, receiving the second portion at a second arm of the BPSK modulator, applying a first tone to the first arm of the BPSK modulator, and applying a second tone to the second arm of the BPSK modulator. The method further includes measuring a power associated with an output of the BPSK modulator and adjusting a phase applied to at least one of the first arm of the BPSK modulator or the second arm of the BPSK modulator in response to the measured power. | 02-06-2014 |
20140319656 | METHOD AND SYSTEM FOR HEIGHT REGISTRATION DURING CHIP BONDING - A method of fabricating a composite semiconductor structure is provided. Pedestals are formed in a recess of a first substrate. A second substrate is then placed within the recess in contact with the pedestals. The pedestals have a predetermined height so that a device layer within the second substrate aligns with a waveguide of the first substrate, where the waveguide extends from an inner wall of the recess. | 10-30-2014 |
20140342479 | METHOD AND SYSTEM FOR TEMPLATE ASSISTED WAFER BONDING USING PEDESTALS - A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure. | 11-20-2014 |
20150097210 | COPLANAR INTEGRATION OF A DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE - A method for fabricating a composite device comprises providing a platform, providing a chip, and bonding the chip to the platform. The platform has a base layer and a device layer above the base layer. An opening in the device layer exposes a portion of the base layer. The chip is bonded to the portion of the base layer exposed by the opening in the device layer. A portion of the chip extends above the platform and is removed. | 04-09-2015 |
20150097211 | STRUCTURES FOR BONDING A DIRECT-BANDGAP CHIP TO A SILICON PHOTONIC DEVICE - A composite photonic device comprises a platform, a chip, and a contact layer. The platform comprises silicon. The chip is made of a III-V material. The contact layer has indentations to help control a flow of solder during bonding of the platform with the chip. In some embodiments, pedestals are placed under an optical path to prevent solder from flowing between the chip and the platform at the optical path. | 04-09-2015 |
20150098676 | INTEGRATION OF AN UNPROCESSED, DIRECT-BANDGAP CHIP INTO A SILICON PHOTONIC DEVICE - A composite device for splitting photonic functionality across two or more materials comprises a platform, a chip, and a bond securing the chip to the platform. The platform comprises a base layer and a device layer. The device layer comprises silicon and has an opening exposing a portion of the base layer. The chip, a III-V material, comprises an active region (e.g., gain medium for a laser). The chip is bonded to the portion of the base layer exposed by the opening such that the active region of the chip is aligned with the device layer of the platform. A coating hermitically seals the chip in the platform. | 04-09-2015 |
20150099318 | PROCESSING OF A DIRECT-BANDGAP CHIP AFTER BONDING TO A SILICON PHOTONIC DEVICE - A method for fabricating a photonic composite device for splitting functionality across materials comprises providing a composite device having a platform and a chip bonded in the platform. The chip is processed comprising patterning, etching, deposition, and/or other processing steps while the chip is bonded to the platform. The chip is used as a gain medium and the platform is at least partially made of silicon. | 04-09-2015 |
20150123157 | VERTICAL INTEGRATION OF CMOS ELECTRONICS WITH PHOTONIC DEVICES - A method of fabricating a composite semiconductor structure includes providing an SOI substrate including a plurality of silicon-based devices, providing a compound semiconductor substrate including a plurality of photonic devices, and dicing the compound semiconductor substrate to provide a plurality of photonic dies. Each die includes one or more of the plurality of photonics devices. The method also includes providing an assembly substrate having a base layer and a device layer including a plurality of CMOS devices, mounting the plurality of photonic dies on predetermined portions of the assembly substrate, and aligning the SOI substrate and the assembly substrate. The method further includes joining the SOI substrate and the assembly substrate to form a composite substrate structure and removing at least the base layer of the assembly substrate from the composite substrate structure. | 05-07-2015 |
20150346429 | WAVEGUIDE MODE EXPANDER USING AMORPHOUS SILICON - A waveguide mode expander couples a smaller optical mode in a semiconductor waveguide to a larger optical mode in an optical fiber. The waveguide mode expander comprises a shoulder made of crystalline silicon and a ridge made of non-crystalline silicon (e.g., amorphous silicon). In some embodiments, the ridge of the waveguide mode expander has a plurality of stages, the plurality of stages have different widths and/or thicknesses at a given cross section. | 12-03-2015 |
20150378097 | INTEGRATED WAVEGUIDE COUPLER - A waveguide coupler includes a first waveguide and a second waveguide. The waveguide coupler also includes a connecting waveguide disposed between the first waveguide and the second waveguide. The connecting waveguide includes a first material having a first index of refraction and a second material having a second index of refraction higher than the first index of refraction. | 12-31-2015 |