Patent application number | Description | Published |
20080308884 | Fabrication of Inlet and Outlet Connections for Microfluidic Chips - A method of making a fluid communication channel between a micro mechanical structure provided on a front side of a device and the back side of said device is described. It includes making the required structural components by lithographic and etching processes on said front side. Holes are then drilled from the back side of said device in precise alignment with the structures on said front side, to provide inlets and/or outlets to and/or from the micromechanical structure. | 12-18-2008 |
20090195948 | METHODS FOR MAKING A STARTING SUBSTRATE WAFER FOR SEMICONDUCTOR ENGINEERING HAVING WAFER THROUGH CONNECTIONS - The invention relates to a method of making a starting substrate wafer for semiconductor engineering having electrical wafer through connections ( | 08-06-2009 |
20100006536 | METHODS FOR MAKING MICRO NEEDLES AND APPLICATIONS THEREOF - The invention relates in a general aspect to a method of making vertically protruding elements on a substrate, said elements having a tip comprising at least one inclined surface and an elongated body portion extending between said substrate and said tip. The method comprises an anisotropic, crystal plane dependent etch forming said inclined surface(s); and an anisotropic, non crystal plane dependent etch forming said elongated body portion; combined with suitable patterning processes defining said protruding elements to have a predetermined base geometry. | 01-14-2010 |
20100053922 | MICROPACKAGING METHOD AND DEVICES - A method of micro-packaging a component wherein at least a first and a second semi-conductor substrate are provided, one of which has electrical through connections (vias). A depression in either one of the substrates or in both is etched. A component is provided above vias and connected thereto. The substrates are joined to form a sealed package. A micro-packaged electronic or micromechanic device, including a thin-walled casing of a semi-conductor material having electrical through connections through the bottom of the casing is also disclosed. An electronic or micromechanic component is attached to the electrical through connections, and the package is hermetically sealed for maintaining a desired atmosphere, suitably vacuum inside the box. | 03-04-2010 |
20120288422 | GLASS MICRO FLUIDIC DEVICE - A method of making a microfluidic device, includes: providing an optically transparent bottom substrate and an optically transparent top substrate, each made of glass. Recesses are made in the top substrate and the top and bottom substrates are bonded together. Then, material is removed from the top substrate to expose the recesses, and a lid is attached to the top substrate so as to cover the recesses whereby channels are formed. At least that surface of the lid facing towards the recesses in the top substrate has a surface roughness of <5 nm, preferably <2 nm. A microfluidic device, including a body of an optically transparent material, and at least one channel extending inside the body, the channels having a bottom surface, a top surface and side walls is also described. The top and bottom surfaces both exhibit surface a roughness <5 nm, preferably <2 nm. | 11-15-2012 |
20140063580 | VIA STRUCTURE AND METHOD THEREOF - A layered micro-electronic and/or micro-mechanic structure comprises at least three alternating electrically conductive layers with insulating layers between the conductive layers. There is also provided a via in a first outer layer, said via comprising an insulated conductive connection made of wafer native material through the layer, an electrically conductive plug extending through the other layers and into said via in the first outer layer in order to provide conductivity through the layers, and an insulating enclosure surrounding said conductive plug in at least one selected layer of said other layers for insulating said plug from the material in said selected layer. It also relates to micro-electronic and/or micro- mechanic device comprising a movable member provided above a cavity such that it is movable in at least one direction. The device has a layered structure according to the invention. Methods of making such a layered MEMS structure is also provided. | 03-06-2014 |
20140378804 | INSULATION OF MICRO STRUCTURES - A method of providing a metal coating on a substrate ( | 12-25-2014 |
20150279756 | THROUGH SUBSTRATE VIAS AND DEVICE - Method of making through-substrate-vias in glass substrates includes providing a first substrate on which a plurality of needles protruding vertically from the substrate are made; providing a second substrate made of glass; locating the substrates adjacent each other such that the needles on the first substrate face the second substrate; applying heat to a temperature where the glass softens, by heating the glass or the needle substrate or both; applying a force such that the needles on the first substrate penetrate into the glass to provide impressions in the glass; and finally, removing the first substrate and providing material filling the impressions in the second substrate made of glass. A device includes a silicon substrate having a cavity in which a MEMS component is accommodated, and a cap wafer made of a material having a low dielectric constant, and through substrate vias of metal, is bonded to the silicon substrate. | 10-01-2015 |