Patent application number | Description | Published |
20080207036 | Bga-Type Test And Burn-In Socket For Integrated Circuits (Ics) - Disclosed herein is a BGA-type test and burn-in socket for ICs. The socket includes contacts, a socket body, a cover, a slide, and an IC holder. The socket body has contact holes to receive the contacts, and positioning pins to secure the socket body to a PCB. A stopper, receiving a contact body, and a lead guide, guiding a contact lead, are provided on the lower portion of the socket body, and the slide and the cover are provided on the upper portion of the socket body. The cover includes holder rotating pins, and open cams and closure cams to move the slide. The slide includes open cam contact parts contacting the open cams when the cover is pressed down, and closure cam contact parts contacting the closure cams when the cover moves upwards. The IC holder moves downwards by the holder rotating pins, thus pressing an IC. | 08-28-2008 |
20090275220 | TEST AND BURN-IN SOCKET FOR INTEGRATED CIRCUITS (ICS) - Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body ( | 11-05-2009 |
20110021056 | TEST AND BURN-IN SOCKET FOR INTEGRATED CIRCUITS (ICS) - Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body ( | 01-27-2011 |
20110028019 | TEST AND BURN-IN SOCKET FOR INTEGRATED CIRCUITS (ICS) - Disclosed herein is a test and burn-in socket for integrated circuits. The socket includes a socket body ( | 02-03-2011 |
20120238136 | SPRING CONTACT AND A SOCKET EMBEDDED WITH SPRING CONTACTS - The present invention relates to a spring contact and a socket embedded with spring contacts. The spring contact comprises: an upper contact pin, which includes a contact portion of a predetermined shape intended to be in contact with the lead of a separate semiconductor IC to be inspected, two spring-fixed protrusions and a body; a lower contact two spring-fixed protrusions and a body; a lower contact pin coupled orthogonally to the upper contact pin; and a spring to be inserted between the upper contact pin and the lower contact pin, wherein the body has an oblique end surface with a locking protrusion formed thereon and two symmetric elastic portions, and wherein the two elastic portions form inside thereof an escape groove to provide a flow space when coupled with the lower contact pin and a flow groove to receive the locking protrusion of the lower contact pin and allow it to flow therein, the flow groove being intended to have an electric contact with the locking protrusion of the lower contact pin and with a side contact portion. Further, the present invention provides a variety of structure, such as a structure for minimizing a compressed length of a contact, a structure for an in-line fine pitch spring contact and socket or a structure for a soldered spring contact and socket. | 09-20-2012 |
20130012076 | STRUCTURE FOR A SPRING CONTACT - A spring contact, including: an upper contact pin having a contact portion, a head, a neck, a body and two spring holding protrusions; a lower contact pin having a construction that is the same as or similar to that of the upper contact pin and being coupled to the upper contact pin while crossing at right angles; and a spring fitted over an assembly of the upper and lower contact pins, wherein to increase the strength of the upper contact pin and increase the surface area of the contact portion, the head forms a cylindrical or square column shape or a part of the contact pin within the range from the contact portion to the spring holding protrusions has a thickness greater than the thickness of the body, thereby increasing the strength of the upper contact pin and increasing the surface area of the contact portion. | 01-10-2013 |
20140239993 | SOCKET DEVICE FOR AN IC TEST - Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized. | 08-28-2014 |
20150377924 | SOCKET DEVICE FOR TESTING SEMICONDUCTOR DEVICE - The present invention relates to a socket device for testing a semiconductor device. More particularly, the present invention relates to a socket device that is capable of testing ball grid array (BGA) and land grid array (LGA) type semiconductor devices, or BGA/LGA hybrid semiconductor devices according to the shapes of leads of the semiconductor devices. A latch structure for pressing and holding a semiconductor device is improved such that a roller is provided at the front end of a latch so as to minimize wear caused by friction with a sandpaper-like surface on an upper surface of the semiconductor device, even in the case of approximately one hundred thousand or more rounds of testing, thereby remarkably extending the life of the socket device, increasing testing efficiency, and reducing costs. | 12-31-2015 |
20150377925 | SPRING CONTACT - The present invention relates to a spring contact, which is integrally formed by blanking and bending a metal plate member, the spring contact comprising: an upper head portion | 12-31-2015 |