Patent application number | Description | Published |
20090295496 | BALUN - A balun having a first balanced terminal, a second balanced terminal and an unbalanced terminal, includes a filter unit and a first transmission line. The filter unit is connected to the first balanced terminal, the second balanced terminal and the unbalanced terminal, and includes a low-pass filter and a high-pass filter. The first transmission line is connected between the filter unit and the first balanced terminal. | 12-03-2009 |
20120081869 | PRINTED CIRCUIT BOARD FOR REDUCING CROSSTALK - There is provided a printed circuit board for reducing crosstalk, having a capacitive impedance component connected between signal and ground patterns, the printed circuit board including: signal patterns including a first signal pattern transferring low frequency signals and a second signal pattern transferring high frequency signals; ground patterns including a first ground pattern connected to the first signal pattern and a second ground pattern connected to the second signal pattern which are separated from each other; and a conductive shielding film connected between the first and second ground patterns and shielding electromagnetic waves generated from the printed circuit board. Accordingly, crosstalk between the low and high frequency signals may be reduced. | 04-05-2012 |
20120161914 | TRANSFORMER - There is provided a transformer having a minimized thickness. The transformer includes: insulating layers; and coil units including primary and secondary coils disposed on the insulating layers to have a common center. | 06-28-2012 |
20130186679 | MULTILAYER WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The multilayer wiring structure includes: a substrate; a connection hole formed to pass through one surface and another surface of the substrate; and electrode wirings formed on the substrate, wherein the electrode wirings includes: a plurality of first wirings formed on one surface of the substrate; a plurality of second wirings formed on another surface of the substrate; and a plurality of connection wirings formed on an inner surface of the connection hole and electrically connecting the plurality of first wirings and the plurality of second wirings, respectively. | 07-25-2013 |
20140034357 | PRINTED CIRCUIT BOARD - A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via. | 02-06-2014 |
20140077896 | VIA STRUCTURE HAVING OPEN STUB AND PRINTED CIRCUIT BOARD HAVING THE SAME - The present invention relates to a via structure having an open stub and a printed circuit board having the same. In accordance with an embodiment of the present invention, a via structure having an open stub including: a signal transmission via passing through an insulating layer; upper and lower via pads for connecting first and second transmission lines, which are respectively formed on and under the insulating layer, and the signal transmission via; and at least one open stub connected to an outer periphery of each via pad to have a shunt capacitance with each ground pattern formed on and under the insulating layer is provided. Further, a printed circuit board with a via having an open stub is provided. | 03-20-2014 |
20140104798 | HYBRID LAMINATION SUBSTRATE, MANUFACTURING METHOD THEREOF AND PACKAGE SUBSTRATE - Disclosed herein are a hybrid lamination substrate and a manufacturing method thereof. The hybrid lamination substrate includes: a core layer; at least one first insulating layer that is made of a photosensitive resin material and is formed on an upper portion, a lower portion, or upper and lower portions of the core layer; and at least one second insulating layer that is made of a non-photosensitive resin material and is formed on the upper portion, the lower portion, or the upper and lower portions of the core layer. Further, a package substrate including the same and a manufacturing method of a hybrid lamination substrate are proposed. | 04-17-2014 |
20140124258 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board includes: a core layer having a first circuit wiring layer formed on one surface or both surfaces thereof; an insulating layer laminated, as at least one layer, on one surface or both surfaces of the core layer; and a second circuit wiring layer formed on one surface of the insulating layer, wherein a conductive core is included in upper and lower insulating layers contacting the second circuit wiring layer requiring an electromagnetic wave shielding, or the conductive core is included in the insulating layer or the core layer contacting the first circuit wiring layer requiring the electromagnetic wave shielding. | 05-08-2014 |
20140176278 | INDUCTOR AND MANUFACTURING METHOD THEREOF - There is provided an inductor, including a circuit board having an input and output terminal formed on a lower surface thereof, a connection pad formed on an upper surface thereof, and a via electrically connecting the input and output terminal and the connection pad, a coil having both ends joined to the connection pad and wound in a circular or a polygonal spiral shape in a longitudinal direction of the circuit board so as to have one or more turns, and a body stacked on the circuit board such that the coil and the connection pad are embedded therein. | 06-26-2014 |