Dirocco
Anthony Dirocco, Juno Beach, FL US
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20150278733 | METHOD AND SYSTEM FOR REPORTING EVENTS AND CONDITIONS - A system for reviewing, surveying, and maintaining a facility or other area may include one or more mobile devices and a central computer processing unit. A computer software program may be operating on the one or more mobile devices. Using the software and the one or more mobile devices, one or more users may collect data and observations about events occurring at the facility, such as unsafe conditions of the facility or nearly catastrophic events. Maintenance may be scheduled, and reports may be generated, using the event data collected. | 10-01-2015 |
Daniel Dirocco, Fort Collins, CO US
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20130116445 | TRIAZOLIUM CARBENE CATALYSTS AND PROCESSES FOR ASYMMETRIC CARBON-CARBON BOND FORMATION - Provided herein are chiral triazolium catalysts useful for asymmetric C—C bond formation and processes for their preparation. Also provided are synthetic reactions in which these catalysts are used, in particular, in asymmetric C—C bond formation. | 05-09-2013 |
Derek Paul Dirocco, Brookline, MA US
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20130303543 | PROTECTION OF RENAL TISSUES FROM ISCHEMIA THROUGH INHIBITION OF THE PROLIFERATIVE KINASES CDK4 AND CDK6 - The presently disclosed subject matter relates to methods and compositions for protecting cells and or tissues from damage due to ischemia. In particular, the presently disclosed subject matter relates to the protective action of cyclin dependent kinase 4/6 (CDK4/6) lithibitors administered to subjects that have been exposed to, or that are at risk of, ischemia. | 11-14-2013 |
Mark A. Dirocco, South Burlington, VT US
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20140239469 | INFORMATION ENCODING USING WIREBONDS - A method and structure for encoding information on an integrated circuit chip. The method includes selecting a set of chip pads of the integrated circuit chip for encoding the information; encoding the information during a wirebonding process, the wirebonding process comprising forming ball bonds on chip pads of the integrated circuit chip and wedge bonds on leadframe fingers adjacent to one or more edges of the integrated circuit chip, the ball bonds and the wedge bonds connected by respective and integral wires; and wherein the information is encoded by varying one or more wirebonding parameters on each chip pad of the set of chip pads, the wirebonding parameters selected from the group consisting of the location of a ball bond, the diameter of a ball bond, both the location and diameter of a ball bond, the location of a wedge bond and combinations thereof. | 08-28-2014 |
20140367684 | METHODS FOR TESTING INTEGRATED CIRCUITS OF WAFER AND TESTING STRUCTURES FOR INTEGRATED CIRCUITS - Aspects of the present invention relate to methods of testing an integrated circuit of a wafer and testing structures for integrated circuits. The methods include depositing a sacrificial material over a first conductor material of the integrated circuit, and contacting a test probe to the deposited sacrificial material. The methods can also include testing the integrated circuit using the test probe contacting the sacrificial material. Finally, the methods can include removing the sacrificial material over the first conductor material of the integrated circuit subsequent to the testing of the integrated circuit. | 12-18-2014 |
20150185273 | SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR - According to a method herein, a multi-level inductor is created around a through-silicon-via (TSV) in a semiconductor substrate. A voltage induced in the multi-level inductor by current flowing in the TSV is sensed, using a computerized device. The voltage is compared to a reference voltage, using the computerized device. An electrical signature of the TSV is determined based on the comparing the voltage to the reference voltage, using the computerized device. | 07-02-2015 |
20150362534 | SIGNAL MONITORING OF THROUGH-WAFER VIAS USING A MULTI-LAYER INDUCTOR - According to a method herein, a multi-level inductor is created around a through-silicon-via (TSV) in a semiconductor substrate. A voltage induced in the multi-level inductor by current flowing in the TSV is sensed, using a computerized device. The voltage is compared to a reference voltage, using the computerized device. An electrical signature of the TSV is determined based on the comparing the voltage to the reference voltage, using the computerized device. | 12-17-2015 |
Robert Dirocco, Humble, TX US
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20160047188 | MOLDED SHEAR SLIP - A molded slip assembly comprises a shear ring coupled to a plurality of slip segments to form a unitary solid ring and a plurality of drillable bases. A drillable base is molded to an inner surface of each of the plurality of slip segments. | 02-18-2016 |
Thomas Dirocco, South San Francisco, CA US
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20140308273 | CELL CULTURE MEDIA AND METHODS OF ANTIBODY PRODUCTION - Cell culture media are provided herein as are methods of using the media for cell culture and antibody production from cells. Compositions comprising antibodies and fragments thereof, produced by the methods herein are also provided. | 10-16-2014 |
Thomas Dirocco, South San Francico, CA US
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20160102141 | CELL CULTURE MEDIA AND METHODS OF ANTIBODY PRODUCTION - Cell culture media are provided herein as are methods of using the media for cell culture and antibody production from cells. Compositions comprising antibodies and fragments thereof, produced by the methods herein are also provided. | 04-14-2016 |