Patent application number | Description | Published |
20090246462 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 10-01-2009 |
20110135883 | METHOD OF MANUFACTURING A SUBSTRATE FOR A MICROELECTRONIC DEVICE, AND SUBSTRATE FORMED THEREBY - A method of manufacturing a substrate for a microelectronic device comprises providing a dielectric material ( | 06-09-2011 |
20130270719 | MICROELECTRONIC PACKAGE AND STACKED MICROELECTRONIC ASSEMBLY AND COMPUTING SYSTEM CONTAINING SAME - A microelectronic package comprises a die ( | 10-17-2013 |
20140090879 | EMBEDDED ARCHITECTURE USING RESIN COATED COPPER - Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed. | 04-03-2014 |
20140177193 | BUMPLESS BUILD-UP LAYER PACKAGE INCLUDING A RELEASE LAYER - An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a release layer having a lower release layer surface, an upper release layer surface parallel to the lower release layer surface, and at least one release layer side, the release layer coupled with the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the release layer side and lower release layer surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface. | 06-26-2014 |
20140353019 | FORMATION OF DIELECTRIC WITH SMOOTH SURFACE - Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed. | 12-04-2014 |
20150279731 | EMBEDDED CIRCUIT PATTERNINGG FEATURE SELECTIVE ELECTROLESS COPPER PLATING - Embodiments describe the selective electroless plating of dielectric layers. According to an embodiment, a dielectric layer is patterned to form one or more patterned surfaces. A seed layer is then selectively formed along the patterned surfaces of the dielectric layer. An electroless plating process is used to deposit metal only on the patterned surfaces of the dielectric layer. According to an embodiment, the dielectric layer is doped with an activator precursor. Laser assisted local activation is performed on the patterned surfaces of the dielectric layer in order to selectively form a seed layer only on the patterned surfaces of the dielectric layer by reducing the activator precursor to an oxidation state of zero. According to an additional embodiment, a seed layer is selectively formed on the patterned surfaces of the dielectric layer with a colloidal or ionic seeding solution. | 10-01-2015 |
20150325491 | FLEXIBLE MICROELECTRONIC SYSTEMS AND METHODS OF FABRICATING THE SAME - Microelectronic systems encapsulated in a stretchable/flexible material, which is skin/bio-compatible and able to withstand environmental conditions. In one embodiment of the present description, the microelectronic system includes a microelectronic device that is substantially encapsulated in a non-permeable encapsulant, such as, butyl rubbers, ethylene propylene rubbers, fluoropolymer elastomers, or combinations thereof. In another embodiment, the microelectronic system includes a microelectronic device that is substantially encapsulated in a permeable encapsulant, such as polydimethylsiloxane, wherein a non-permeable encapsulant substantially encapsulates the permeable encapsulant. | 11-12-2015 |