Patent application number | Description | Published |
20100270584 | Semiconductor Switching Device with Gate Connection - The present disclosure provides a semiconductor switching device including a substrate having deposited thereon a cathode, an anode and a gate of the semiconductor switching device, and a connection means for electrically connecting the cathode in the gate of the semiconductor switching device to an external circuit unit. The connection includes a cathode-gate connection unit having a coaxial structure including a gate conductor and a cathode conductor for electrically connecting the cathode and the gate of the semiconductor switching device to the external circuit unit. | 10-28-2010 |
20110013366 | ELECTRONIC CIRCUIT BOARD WITH A THERMAL CAPACITOR - An electronic circuit board includes at least one conductor path and at least one component which is one of an electronic component, electric component and heat emitting component, and which is connected to the conductor path. At least one thermal capacitor is thermally connected to the conductor in vicinity to the at least one component. The at least one thermal capacitor is suitable for transmitting and/or buffering thermal energy of the at least one component. | 01-20-2011 |
20110233608 | CONNECTION ARRANGEMENT FOR SEMICONDUCTOR POWER MODULES - A semiconductor power module includes at least two sub modules. The sub modules include at least one respective transistor having a collector, an emitter, and a gate. The module includes a connection arrangement having a collector terminal unit for connecting the collectors of the at least two sub modules collectively to external circuit components, at least two emitter terminal units for connecting the respective emitters of the at least two sub modules individually to external circuit components, and at least two gate terminal units for connecting the respective gates of the at least two sub modules individually to external circuit components. | 09-29-2011 |
20120139483 | COMPOSITE CAPACITANCE AND USE THEREOF - A composite capacitive component includes a plurality of physically distinguishable capacitor modules which are electrically connected to each other. The distinguishable modules allow for an increased electrical and/or geometrical flexibility in designing the capacitive component. Each of the capacitor modules includes a plurality of base capacitors arranged on a module-specific Printed Circuit Board PCB. All the base capacitors from the capacitor modules are of a single type, which simplifies both production and maintenance of the capacitive component. | 06-07-2012 |
20130104592 | CABINET WITH MODULES HAVING A THERMOSIPHON COOLER ARRANGEMENT | 05-02-2013 |
20130107455 | THERMOSIPHON COOLER ARRANGEMENT IN MODULES WITH ELECTRIC AND/OR ELECTRONIC COMPONENTS | 05-02-2013 |
20140050488 | COMMUNICATION SYSTEM FOR POWER ELECTRONIC CONVERTERS - Exemplary embodiments of a communication system for a power electronic converter with a plurality of converter modules includes controllable power semiconductor switches and individually mountable onto a converter cabinet or frame. The communication system includes unguided transmission of optical signals between optical elements arranged on a converter module and on the converter cabinet, respectively. The communication system provides a free-space optical signal transmission between two distinct parts of the converter that combines the flexibility offered by radio transmission and the data rate and reliability of optical communication, while at the same time avoiding the complex and expensive cabling of optical fiber solutions. | 02-20-2014 |
20160049354 | POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING POWER SEMICONDUCTOR MODULE - The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device. | 02-18-2016 |
20160079156 | POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - The present disclosure describes a power electronics module comprising a lead frame in which a chip of a first semiconductor device is embedded, a first PCB mounted on top of the lead frame and the chip of the first semiconductor device, and a support frame mounted on top of the PCB, the support frame comprising a cavity in which the chip of a second semiconductor device is embedded, wherein the chips of the first semiconductor device and the second semiconductor device are positioned on top of each other, and the first PCB comprises a first electrically conducting path between the chips of the first semiconductor device and the second semiconductor device. | 03-17-2016 |