Patent application number | Description | Published |
20130214450 | METHOD AND APPARATUS FOR MOLDING PARTS - A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold. | 08-22-2013 |
20140069789 | CYLINDRICAL ACTIVATION OF MENU BUTTONS - Cylindrical switch assemblies and methods of making the same are provided. Cylindrical switch assemblies can mitigate false presses by using switch assembly designs with vertically or near vertically mounted activation elements positioned around a perimeter of a button. The activation elements (e.g., switches) of the switch assemblies may be fixed to a vertical sidewall of a bracket and positioned such that a portion of the activation elements extend beneath the button. When the button is actuated by a user, the button activates the activation elements. Positioning multiple activation elements around the perimeter of the button ensures that the user can press anywhere on the button and still activate the activation elements. | 03-13-2014 |
20140073182 | Reinforcing Bars in I/O Connectors - Reinforcing bars or a reinforcing element with holes can be embedded within the shell of a receptacle connector to strengthen the shell, and potentially provide shielding. For example, a receptacle connector having a plurality of contacts configured to mate with corresponding contacts of a corresponding plug connector can include a shell having an opening for receiving the corresponding plug connector. The shell can include an upper portion and reinforcing bars embedded within the upper portion. The shell can include an upper portion and a reinforcing element with holes embedded within the upper portion. Methods for manufacturing the shell are also provided. | 03-13-2014 |
20140220320 | MOLDED PARTS - A method and apparatus for injection molding plastic parts is described. In one embodiment, at least two materials are simultaneously injected into a mold. The resulting molded part can include at least two different regions. Each region can have distinct physical properties. Positions of the regions within the molded part can be at least partially controlled by controlling flow fronts of the at least two materials within the mold. | 08-07-2014 |
20140331741 | Electronic Device With Printed Circuit Board Stress Monitoring - An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment. | 11-13-2014 |
20140357316 | Electronic Device With Mapping Circuitry - An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object. | 12-04-2014 |
20150060126 | MODULES FOR INCREASING USEABLE SPACE ON CIRCUIT BOARDS - The described embodiments relate generally to electronic devices and to three dimensional modules for increasing useable space on a circuit board associated therewith. In some embodiments, the modules can have a cuboid geometry, and can include a number of surfaces having embedded circuit traces configured to interconnect electronic components arranged on various surfaces of the module. One of the surfaces of module can include at least one communication interface configured to interconnect the circuit traces on the module to associated circuit paths on a circuit board to which the module is coupled. In some embodiments the module can be operative as a standoff between the circuit board and another component of the electronic device. | 03-05-2015 |
20150092324 | LOW-PROFILE ELECTRICAL AND MECHANICAL CONNECTOR - A connector providing both an electrical and mechanical connection and an electronic device utilizing the connector. The connector includes a rigid body, a head connected to the rigid body, and a flexible conductor coupled to the body. The rigid body and the flexible conductor define an electrically conductive path to the head. An electronic device includes a housing defining at least one sidewall, an interior component, and a connector passing through at least one sidewall and mechanically contacting the interior component. The connector defines an electrically conductive path from the interior component to an exterior of the housing. | 04-02-2015 |