Deschner
Bernard K. Deschner, Calgary CA
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20100260644 | SYSTEM FOR PURIFYING AIR THROUGH GERMICIDAL IRRADIATION AND METHOD OF MANUFACTURE - An air purifying system includes one or more air permeable photocatalytic elements defining a core cavity having a sealed top end and an open bottom end. A sealed air flow path ensures that air travels from an outside of the core cavity, through the one or more photocatalytic elements, into the core cavity, to be expelled through the open bottom end. A UV radiation source disposed within the core cavity irradiates air travelling along the sealed flow path and an interior of the one or more photocatalytic elements. Each photocatalytic element is manufactured using a substrate, that is conductive of and transparent to UV radiation, coated with a photocatalyst. A non-photocatalytically active material is initially coated on the substrate and is then converted to a photocatalyst by calcination. | 10-14-2010 |
Klaus Deschner, Burgebrach DE
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20110078957 | BEARING SITE FOR A REDIRECTING ELEMENT - A window lift assembly for a motor vehicle, with a component on which a bearing site is provided for a redirecting element, in particular for a cable pulley or a deflecting piece, is provided. The redirecting element is arranged beside the component at the bearing site along a connecting axis pointing from the redirecting element to the component and the redirecting element redirects a driving force for adjusting a window pane of the motor vehicle. The redirecting element is mounted on the component along the connecting axis and the connecting axis forms a physical axis for mounting the redirecting element. The bearing site supports the redirecting element on an outer surface rimming the redirecting element at least in a direction vertical to the connecting axis, and for supporting the redirecting element the bearing site includes at least one portion protruding from the component. | 04-07-2011 |
Matt Deschner, Downers Grove, IL US
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20100034993 | IMAGING OF DEEP STRUCTURES OF RELIEFS FOR SHALLOW RELIEF EMBOSSING - A variety of deep structured decorative patterns originate with mechanical relief or etching. The present method incorporates a deeply patterned or textured etching or relief into a thin film embossing shim to simulate the look of the deep pattern or texture when used to emboss thin film or material. A transparent mold of the relief surface (such as brushed metal, engine-turned patterns, and textured glass) is formed using UV curable liquid and a transparent substrate. The relief copy in the transparent mold or overlay is mapped onto a photoresist surface or plate by shining or expanding one or more laser lights or laser beams through the transparent mold. The different heights of the relief copy of the transparent mold will cause the light to diffract/refract to form a corresponding patterned etching in the photoresist plate. The resulting photoresist plate is then metalized and electroplated to form a thin film embossing shim. The thin film embossing shim is then used with conventional embossing equipment to form thin film embossings. The embossed thin films can then be metalized and laminated onto substrate to create a product that has shifting patterns that reflect at a variety of viewing angles when (observed under normal lighting conditions) exposed to white light. | 02-11-2010 |
Matthew J. Deschner, Downers Grove, IL US
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20100116156 | MULTI-AXIS DIFFRACTION GRATING - An enhanced optical interference pattern, such as a diffraction grating, is incorporated into a photodefineable surface by shining three or more beams of coherent light from a single source at a photodefinable surface, such as a photosensitive emulsion/photoresist covered glass or an ablatable substrate and mapping the diffraction grating pattern to the photodefinable surface. Mapping of the optical interference pattern is created by interference of three or more light beams, such as laser light or other light sources producing a suitable spectrum of light. The mapped photodefinable surface can be used to create embossing shims. The embossing shim can then be used to emboss film or paper. The embossed film/paper can be metalized and laminated onto a substrate to create a product that has shifting patterns at a variety of viewing angles when exposed to white light. | 05-13-2010 |
20110195266 | SEAMLESS SLEEVE AND SEAMLESS SUBSTRATE - A seamless, embossed or cast substrate is formed using a seamless sleeve having a seamless surface relief formed thereon and configured to slide over an cylindrical base in an embossing or casting assembly. The substrate is a flat web, foil, or film of, for example, paper, polyester, polypropylene, metal or other elongated flat material. The surface relief can be applied through interfering ablation, non-interfering ablation, ink jet printing, or other techniques wherein a seamless surface relief is formed onto the seamless sleeve. A method of making a seamless, embossed or cast substrate includes expanding a diameter of a seamless sleeve having a seamless surface relief formed thereon, sliding the expanded seamless sleeve onto a cylindrical base, allowing the diameter of the seamless sleeve to contract around the cylindrical base, and conveying a substrate through the embossing or casting assembly and embossing or casting the seamless surface relief into the substrate. | 08-11-2011 |
20140191428 | MULTI-AXIS DIFFRACTION GRATING - An enhanced optical interference pattern, such as a diffraction grating, is incorporated into a photodefineable surface by shining three or more beams of coherent light from a single source at a photodefinable surface, such as a photosensitive emulsion/photoresist covered glass or an ablatable substrate and mapping the diffraction grating pattern to the photodefinable surface. Mapping of the optical interference pattern is created by interference of three or more light beams, such as laser light or other light sources producing a suitable spectrum of light. The mapped photodefinable surface can be used to create embossing shims. The embossing shim can then be used to emboss film or paper. The embossed film/paper can be metalized and laminated onto a substrate to create a product that has shifting patterns at a variety of viewing angles when exposed to white light. | 07-10-2014 |
Ryan P. Deschner, Poughkeepsie, NY US
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20080203589 | VARIABLE FILL AND CHEESE FOR MITIGATION OF BEOL TOPOGRAPHY - A method of designing features on a semiconductor wafer. A design of active or functional features is provided for chiplets separated by kerf areas on the wafer. The method then includes determining pattern density of the chiplet features, and applying a pattern of spaced dummy features on chiplet area not covered by active or functional features, as well as in the kerf areas. The dummy features are uniformly expanded or reduced in size until a desired dummy feature pattern density is reached. | 08-28-2008 |
20080286545 | MASK HAVING IMPLANT STOPPING LAYER - Methods of forming a mask for implanting a substrate and implanting using an implant stopping layer with a photoresist provide lower aspect ratio masks that cause minimal damage to trench isolations in the substrate during removal of the mask. In one embodiment, a method of forming a mask includes: depositing an implant stopping layer over the substrate; depositing a photoresist over the implant stopping layer, the implant stopping layer having a density greater than the photoresist; forming a pattern in the photoresist by removing a portion of the photoresist to expose the implant stopping layer; and transferring the pattern into the implant stopping layer by etching to form the mask. The implant stopping layer may include: hydrogenated germanium carbide, nitrogenated germanium carbide, fluorinated germanium carbide, and/or amorphous germanium carbon hydride (GeHX), where X includes carbon. The methods/mask reduce scattering during implanting because the mask has higher density than conventional masks. | 11-20-2008 |
20090004869 | MASK FORMING AND IMPLANTING METHODS USING IMPLANT STOPPING LAYER - Methods of forming a mask for implanting a substrate and implanting using an implant stopping layer with a photoresist provide lower aspect ratio masks that cause minimal damage to trench isolations in the substrate during removal of the mask. In one embodiment, a method of forming a mask includes: depositing an implant stopping layer over the substrate; depositing a photoresist over the implant stopping layer, the implant stopping layer having a density greater than the photoresist; forming a pattern in the photoresist by removing a portion of the photoresist to expose the implant stopping layer; and transferring the pattern into the implant stopping layer by etching to form the mask. The implant stopping layer may include: hydrogenated germanium carbide, nitrogenated germanium carbide, fluorinated germanium carbide, and/or amorphous germanium carbon hydride (GeHX), where X includes carbon. The methods/mask reduce scattering during implanting because the mask has higher density than conventional masks. | 01-01-2009 |