Patent application number | Description | Published |
20090026441 | Continuous plane of thin-film materials for a two-terminal cross-point memory - A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper. | 01-29-2009 |
20090026442 | Continuous plane of thin-film materials for a two-terminal cross-point memory - A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper. | 01-29-2009 |
20100159641 | Memory cell formation using ion implant isolated conductive metal oxide - Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnO | 06-24-2010 |
20110133147 | Continuous plane of thin-film materials for a two-terminal cross-point memory - A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper. | 06-09-2011 |
20110155990 | Continuous plane of thin-film materials for a two-terminal cross-point memory - A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper. | 06-30-2011 |
20110204019 | Method of making a planar electrode - Chemical mechanical polishing (CMP) of thin film materials using a slurry including a surfactant chemical operative to polish high portions of the film being planarized while preventing the polishing of low portions of the film is disclosed. The low portions can be in a step reduction region of a deposited film. The CMP process can be used for form a planar surface upon which subsequent thin-film layers can be deposited, such as an electrically conductive material for an electrode. The subsequently deposited thin-film layers are substantially planar as deposited without having to use CMP. The resulting thin-film layers are planar and have a uniform cross-sectional thickness that can be beneficial for layers of memory material for a memory cell. The processing can be performed back-end-of-the-line (BEOL) on a previously front-end-of-the-line (FEOL) processed substrate (e.g., silicon wafer) and the BEOL process can be used to fabricate two-terminal non-volatile cross-point memory arrays. | 08-25-2011 |
20110315943 | Memory Device Using A Dual Layer Conductive Metal Oxide Structure - Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below un-etched conductive metal oxide layer(s), forming the un-etched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnO | 12-29-2011 |
20110315948 | Memory Device Using Ion Implant Isolated Conductive Metal Oxide - Memory cell formation using ion implant isolated conductive metal oxide is disclosed, including forming a bottom electrode below unetched conductive metal oxide layer(s), forming the unetched conductive metal oxide layer(s) including depositing at least one layer of a conductive metal oxide (CMO) material (e.g., PrCaMnO | 12-29-2011 |
20120292585 | CONTINUOUS PLANE OF THIN-FILM MATERIALS FOR A TWO-TERMINAL CROSS-POINT MEMORY - A structure for a memory device including a plurality of substantially planar thin-film layers or a plurality of conformal thin-film layers is disclosed. The thin-film layers form a memory element that is electrically in series with first and second cladded conductors and operative to store data as a plurality of conductivity profiles. A select voltage applied across the first and second cladded conductors is operative to perform data operations on the memory device. The memory device may optionally include a non-ohmic device electrically in series with the memory element and the first and second cladded conductors. Fabrication of the memory device does not require the plurality of thin-film layers be etched in order to form the memory element. The memory element can include a CMO layer having a selectively crystallized polycrystalline portion and an amorphous portion. The cladded conductors can include a core material made from copper. | 11-22-2012 |
Patent application number | Description | Published |
20090145272 | Food Article Loading Mechanism for a Food Article Slicing Machine - An automated sequenced food article tray loading method and apparatus for a high speed slicing machine where food articles can be loaded sequentially into designated and separated lanes of a lift tray and automatically sequentially assume a preload condition. Food article separation is maintained on the lift tray after the food articles are loaded by a plurality of support plates and one or more dividers. A food article sweep mechanism receives the food articles on the lift tray in their separated positions and transfers the food articles into the food article feed mechanism while maintaining the separated positions. The food article sweep mechanism is a substantially open structure without enclosing walls. | 06-11-2009 |
20090173196 | Maintenance and Safety System for a Food Article Slicing Machine - A slicing apparatus and a weighing and classifying conveyor combination with cleanup position wherein, the elevated food article feed mechanism can be collapsed to a maintenance position, the weighing and classifying conveyor is oriented at a distance from the slicing apparatus and the slicing head cover is automatically lifted to an open cleanup position. The machine has laser intrusion detectors that are used to shut down systems when an unwanted intrusion by a person or object is detected. | 07-09-2009 |
20090188358 | Output Conveyor for a Food Article Slicing Machine - An output conveyor for a high speed slicing apparatus having four deceleration conveyors that receive slices from a jump conveyor. Each deceleration conveyor laterally position slices in an output lane. The deceleration conveyors have a pivotal axis for matching an elevation of an end of said deceleration conveyor with an elevation of an upstream conveyor. The output conveyor also comprises four weighing conveyors for weighing slices received from upstream components. The weighing conveyors each comprise a removable carrying unit for turning a conveyor belt and a drive unit for driving the carrying unit. | 07-30-2009 |
20090188362 | Food Article Transfer Mechanism for a Food Article Slicing Machine - An automated sequenced food article tray loading method and apparatus for a slicing machine where food articles can be loaded sequentially into designated and separated lanes of a lift tray and automatically sequentially assume a preload condition. Food article separation is maintained on the lift tray after the food articles are loaded. A food article sweep mechanism receives the food articles on the lift tray in their separated positions and transfers the food articles into the food article feed mechanism while maintaining the separated positions. The food article sweep mechanism is a substantially open structure without enclosing walls. | 07-30-2009 |
20120058213 | METHOD AND APPARATUS FOR ROTARY MOLDING - A rotary molding system for molding food products, mold cavities formed when a mold shell rotates mold shapes disposed along the mold shell into a fill position between a fill plate and a wear plate. Molded food products are removed from mold cavities using knock-out cups, the use of air pressure, or the use of a vacuum source disposed below the mold cavity, without the need to slow the rotation of the mold shell. Knock-out cups may be used with a heating system to reduce accumulation of unwanted materials on the knock-out cups. The rotary molding system can also be used to form products with contoured surfaces. A smart tagging system can be used to ensure that compatible sets of mold shells and knock out cups are being used. A vacuum region may be disposed upstream of the fill position to remove air within the mold cavity prior to filling. | 03-08-2012 |
20130259991 | METHOD AND APPARATUS FOR ROTARY MOLDING - A rotary molding system for molding food products, mold cavities formed when a mold shell rotates mold shapes disposed along the mold shell into a fill position between a fill plate and a wear plate. Molded food products are removed from mold cavities using knock-out cups, the use of air pressure, or the use of a vacuum source disposed below the mold cavity, without the need to slow the rotation of the mold shell. Knock-out cups may be used with a heating system to reduce accumulation of unwanted materials on the knock-out cups. The rotary molding system can also be used to form products with contoured surfaces. A smart tagging system can be used to ensure that compatible sets of mold shells and knock out cups are being used. A vacuum region may be disposed upstream of the fill position to remove air within the mold cavity prior to filling. | 10-03-2013 |
20140242231 | METHOD AND APPARATUS FOR ROTARY MOLDING - A rotary molding system for molding food products, mold cavities formed when a mold shell rotates mold shapes disposed along the mold shell into a fill position between a fill plate and a wear plate. Molded food products are removed from mold cavities using knock-out cups, the use of air pressure, or the use of a vacuum source disposed below the mold cavity, without the need to slow the rotation of the mold shell. Knock-out cups may be used with a heating system to reduce accumulation of unwanted materials on the knock-out cups. The rotary molding system can also be used to form products with contoured surfaces. A smart tagging system can be used to ensure that compatible sets of mold shells and knock out cups are being used. A vacuum region may be disposed upstream of the fill position to remove air within the mold cavity prior to filling. | 08-28-2014 |
20140338509 | Maintenance and Safety System for a Food Article Slicing Machine - A slicing apparatus and a weighing and classifying conveyor combination with cleanup position wherein, the elevated food article feed mechanism can be collapsed to a maintenance position, the weighing and classifying conveyor is oriented at a distance from the slicing apparatus and the slicing head cover is automatically lifted to an open cleanup position. The machine has laser intrusion detectors that are used to shut down systems when an unwanted intrusion by a person or object is detected. | 11-20-2014 |