Patent application number | Description | Published |
20110293818 | Method and Apparatus for Depositing A Film Using A Rotating Source - The disclosure generally relates to a method and apparatus for depositing a substantially solid film onto a substrate. The solid film can be an Organic Light-Emitting Diode (“OLED”). In one embodiment, the disclosure relates to using a material supply, a rotating or moving mechanism having at least one transfer surface which is supplied with film material in one orientation and delivers film material to the substrate at a second orientation such that film material delivered to the substrate deposits in substantially solid form. The delivery to the substrate can be performed without the transfer surface materially contacting the substrate. The film material can be deposited on the transfer surface in either solid form or in liquid form (e.g., as a mixture of carrier liquid and dissolved or suspended film material). | 12-01-2011 |
20120038705 | Method and Apparatus for Delivering Ink Material from a Discharge Nozzle - The disclosure relates to a method for loading ink material into discharge nozzle having a non-discharge surface and a plurality of micropores. The, method includes the steps of providing a quantity of liquid ink material defined by a carrier fluid containing dissolved or suspended film material; delivering the quantity of liquid ink onto the discharge nozzle and directing a portion of the delivered ink into at least one micropore; flowing a pressurized gas over the surface to drive the delivered ink material into the least one nozzle; evaporating the carrier fluid from the delivered ink to form a substantially carrier-free ink material at the micropore; and dispensing the substantially carrier-free ink material from the nozzle. The surface can be configured to reject the ink and the plurality of nozzles are configured to receive the ink. | 02-16-2012 |
20120056923 | CONTROL SYSTEMS AND METHODS FOR THERMAL-JET PRINTING - Embodiments of methods and apparatus for micro-printing films are disclosed. According to various embodiments, the printing apparatus includes printheads with ink-jets for dispensing droplets of ink formed from a carrier liquid and a print material. The printheads also include thermal-jets for depositing the print material onto a substrate from the droplets of ink dispensed by ink-jets. The droplets of ink dispensed by ink-jets flow into micro-structures on the thermal-jets and the thermal-jets are heated to evaporate the carrier liquid and to vaporize and direct the print material onto a substrate. The printing apparatus further includes a control unit that is configured to automatically adjust an output from one or more printheads based on one or more measured quantities. | 03-08-2012 |
20120086764 | MODULAR PRINTHEAD FOR OLED PRINTING - The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead. | 04-12-2012 |
20130316529 | METHOD OF FORMING A MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure. | 11-28-2013 |
20140008813 | COMPLIANT MONOPOLOAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODE - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 01-09-2014 |
20140048909 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 02-20-2014 |
20140057373 | Modular Printhead for OLED Printing - The disclosure generally relates to a modular printhead configured for ease of access and quick replacement of the printhead. In one embodiment, the disclosure is directed to an integrated printhead which includes: a printhead die supporting a plurality of micropores thereon; a support structure for supporting the printhead die; a heater interposed between the printhead die and the support structure; and an electrical trace connecting the heater to a supply source. The support structure accommodates the electrical trace through a via formed within it so as to form a solid state printhead containing all of the connections within and providing easily replaceable printhead. | 02-27-2014 |
20140064904 | COMPLIANT MICRO DEVICE TRANSFER HEAD WITH INTEGRATED ELECTRODE LEADS - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm. | 03-06-2014 |
20140158415 | MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer. | 06-12-2014 |
20140159324 | COMPLIANT MICRO DEVICE TRANSFER HEAD ARRAY WITH METAL ELECTRODES - Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads. | 06-12-2014 |
20140169924 | MICRO DEVICE TRANSFER SYSTEM WITH PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140169927 | MICRO PICK UP ARRAY WITH INTEGRATED PIVOT MOUNT - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array. | 06-19-2014 |
20140196851 | COMPLIANT MICRO DEVICE TRANSFER HEAD - A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure. | 07-17-2014 |
20140209248 | COMPLIANT BIPOLAR MICRO DEVICE TRANSFER HEAD WITH SILICON ELECTRODES - A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes. | 07-31-2014 |
20140241843 | Mass Transfer Tool Manipulator Assembly - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140241844 | Micro Pick Up Array Mount With Integrated Displacement Sensor - Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices. | 08-28-2014 |
20140299572 | COMPLIANT MICRO DEVICE TRANSFER HEAD WITH INTEGRATED ELECTRODE LEADS - A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm. | 10-09-2014 |
20140355168 | MICRO PICK UP ARRAY WITH COMPLIANT CONTACT - Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array. | 12-04-2014 |