Daniel, Jr.
Gauger M. Daniel, Jr., Berlin, MA US
Patent application number | Description | Published |
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20140363010 | Controlling Stability in ANR Devices - Stability is provided in an active noise reduction (ANR) headphone by measuring a sound field to generate an input signal, filtering and applying a variable gain to the input signal to produce a first filtered signal using a first filter and a variable gain amplifier in an ANR signal pathway, outputting the filtered signal, and simultaneously with outputting the first filtered signal, sampling a signal at a point in the ANR signal pathway and filtering the sampled signal using a second filter to produce a second filtered signal. The second filtered signal is compared to a threshold, and if the comparison finds that the second filtered signal is greater than the threshold signal, the gain of the variable gain amplifier is changed to attenuate the first filtered signal. The second filter applies different gains, different by at least 10 dB, in different frequency ranges between 10 Hz and 10 kHz. | 12-11-2014 |
Malcolm N. Daniel, Jr., Austin, TX US
Patent application number | Description | Published |
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20120227233 | WORKPIECE ALIGNMENT DEVICE - An alignment device has a carriage, two rails on the carriage that are configured for a workpiece to pass therebetween, and a finger that protrudes a distance from the carriage. The finger is configured to be disposed on a carrier for the workpieces. The workpieces may be solar cells and may pass through the rails on a conveyor belt. The alignment device may move in order to align the workpieces as the workpieces are loaded into a carrier. | 09-13-2012 |
20140271050 | WAFER HANDLING SYSTEMS AND METHODS - A wafer handling system may include upper and lower linked robot arms that may move a wafer along a nonlinear trajectory between chambers of a semiconductor processing system. These features may result in a smaller footprint in which the semiconductor processing system may operate, smaller transfer chambers, smaller openings in process chambers, and smaller slit valves, while maintaining high wafer throughput. In some embodiments, simultaneous fast wafer swaps between two separate chambers, such as load locks and ALD (atomic layer deposition) carousels, may be provided. Methods of wafer handling are also provided, as are other aspects. | 09-18-2014 |
20140271054 | MULTI-POSITION BATCH LOAD LOCK APPARATUS AND SYSTEMS AND METHODS INCLUDING SAME - Various embodiments of batch load lock apparatus are disclosed. The batch load lock apparatus includes a load lock body including first and second load lock openings, a lift assembly within the load lock body, the lift assembly including multiple wafer stations, each of the multiple wafer stations adapted to provide access to wafers through the first and second load lock openings, wherein the batch load lock apparatus includes temperature control capability (e.g., heating or cooling). Batch load lock apparatus is capable of transferring batches of wafers into and out of various processing chambers. Systems including the batch load lock apparatus and methods of operating the batch load lock apparatus are also provided, as are numerous other aspects. | 09-18-2014 |
20140271055 | SUBSTRATE DEPOSITION SYSTEMS, ROBOT TRANSFER APPARATUS, AND METHODS FOR ELECTRONIC DEVICE MANUFACTURING - Electronic device processing systems are described. The system includes a mainframe housing having a transfer chamber, a first facet, a second facet opposite the first facet, a third facet, and a fourth facet opposite the third facet, a first carousel assembly coupled to a first facet, a second carousel assembly coupled to the third facet, a first load lock coupled to the second facet, a second load lock coupled to the fourth facet, and a robot adapted to operate in the transfer chamber to exchange substrates from the first and second carousels. Methods and multi-axis robots for transporting substrates are described, as are numerous other aspects. | 09-18-2014 |
20140271057 | TEMPERATURE CONTROL SYSTEMS AND METHODS FOR SMALL BATCH SUBSTRATE HANDLING SYSTEMS - Embodiments of substrate handling systems capable of heating and/or cooling batches of substrates being transferred into and out of various substrate processing chambers are provided. Methods of substrate handling are also provided, as are numerous other aspects. | 09-18-2014 |
Malcom N. Daniel, Jr., Austin, TX US
Patent application number | Description | Published |
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20150125240 | DYNAMIC PITCH SUBSTRATE LIFT - An apparatus for dynamically adjusting the pitch between substrates in a substrate stack comprises first and second lift portions. The first lift portion supports a first group of the plurality of substrates, and the second lift portion supports a second group of the plurality of substrates. The first and second lift portions are operable to move the first and second groups of substrates in a first direction independently from each other. This independent movement enables the pitch, or spacing, between adjacent substrates to be dynamically adjusted so that an end effector of a robot can be positioned between such adjacent substrates to pick one of the substrates without inadvertently engaging another substrate that is not being picked. Other embodiments are disclosed. | 05-07-2015 |
Mcallister Daniel, Jr., Akron, OH US
Patent application number | Description | Published |
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20110031770 | SAFETY SLING FOR A TIRE CURING MACHINE - A safety sling secures an upper mold section of a tire press. The safety sling includes a first link, a second link, a third link, and a fourth link. The second link is connected to the first link by a first strap section. The third link is connected to the second link by a second strap section. The fourth link is connected to the link ring by a third strap section. The fourth link is also connected to the first link by a fourth strap section to define a quadrilateral configuration. The first link is connected to a link ring by a fifth strap section. The second link is connected to a sixth link by a sixth strap section. The third link is connected to a seventh link by a seventh strap section. The fourth link is connected to an eighth link by an eighth strap section such that the fifth, sixth, seventh, and eighth links are secured to the tire press for allowing the safety sling to catch the upper mold section in the event the upper mold section becomes otherwise unsecured from the tire press. | 02-10-2011 |
Paul Daniel, Jr., Traverse City, MI US
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20130277346 | CATALYST SUBSTRATES AND METHOD OF FORMING USING CAPACATIVE DISCHARGE WELDING - A fixture for welding a substrate using capacitive discharge welding includes a support plate having a receiving portion. A back plate that is generally planar is positioned adjacent a rear wall of the support plate and perpendicular thereto, wherein the support plate and back plate are made from a non-conductive material. Another fixture for welding a substrate includes a pair of support plates having a cut-out forming a receiving portion. A back plate that is generally planar is positioned adjacent a rear wall of one of the support plates, wherein the support plate and back plate are made from a non-conductive material. A method of welding a substrate using capacitive discharge welding is also provided. | 10-24-2013 |