Patent application number | Description | Published |
20110198105 | NON-HALOGEN FLAME RETARDANT RESIN COMPOSITION AND ELECTRIC WIRE AND CABLE USING THE SAME - An electric wire and cable made of a non-halogen flame retardant resin composition has a modified polyolefin resin composition comprising a polyolefin resin grafted with a phosphate compound having a vinyl group, and an acid acceptor doped to the modified polyolefin resin. | 08-18-2011 |
20120255761 | ADHESIVE FILM AND FLAT CABLE USING SAME - The adhesive film includes an insulating film, an adhesive layer provided over one side of the insulating film, and an anchor coat layer provided between the one side of the insulating film and the adhesive layer. The adhesive layer is a copolymer polyamide resin which is soluble in a solvent at 25 degrees Celsius and has a melting point of 100 degrees Celsius or more and 150 degrees Celsius or less. The anchor coat layer enhances the adhesion between the insulating film and the adhesive layer. | 10-11-2012 |
20130043058 | ADHESIVE FILM AND FLAT CABLE - An adhesive film includes an insulation film, an adhesive layer formed on the insulation film and including a copolyamide resin being soluble in a solvent at a room temperature (25° C.) and having a melting point of not less than 100° C. and not more than 150° C., a halogen-free flame retardant at a rate of not less than 100 parts by mass and not more than 250 parts by mass relative to 100 parts by mass of the copolyamide resin, and a carbodiimide compound soluble in the solvent at the room temperature (25° C.), and a conductor adhesion layer laminated on the adhesive layer. | 02-21-2013 |
20140158398 | ADHESIVE RESIN COMPOSITION, ADHESIVE FILM USING THE SAME AND FLAT CABLE - An adhesive resin composition includes 60 to 95 parts by mass of amorphous thermoplastic polyester-based resin (A), 5 to 40 parts by mass of polyphenylene ether-based polymer (B) including a hydroxyl group and a repeating unit of 2,6-dimethylphenylene ether in a molecule thereof, and 60 to 200 parts by mass of a flame retardant per total 100 parts by mass of the amorphous thermoplastic polyester based resin (A) and the polyphenylene ether-based polymer (B). | 06-12-2014 |
20140158413 | ADHESIVE COMPOSITION, ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM - An adhesive composition includes (A) a phenoxy resin including a plurality of hydroxyl groups at a side chain: 100 parts by mass, (B) a multifunctional isocyanate compound including an isocyanate and at least one functional group selected from the group consisting of a vinyl group, an acrylate group and a methacrylate group within its molecule: 2 to 55 parts by mass, (C) a maleimide compound and/or a reaction product thereof having a plurality of maleimide groups within its molecule: 5 to 30 parts by mass, and (D) one or more kinds of an inorganic filler having an average particle size of 5 μm or less which is measured by a laser diffraction: 1 to 50 parts by mass, a total amount of the components (B) and (C) is 7 to 60 parts by mass. | 06-12-2014 |
20140202737 | ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM - An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C. | 07-24-2014 |
Patent application number | Description | Published |
20130220674 | Adhesive Composition, Varnish, Adhesive Film and Wiring Film - Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. | 08-29-2013 |
20130220677 | Thermosetting Adhesive Composition, and Heat Resistant Adhesive Film and Wiring Film Using the Same - Provided are a thermosetting adhesive composition excellent in storage stability, reliability, and low-temperature adhesion properties; and a curl-resistant heat-resistant film and a wiring film obtained using the composition. The thermosetting adhesive composition includes 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in the structure thereof; 5 to 30 parts by weight of a maleimide compound containing a plurality of maleimide groups in the structure thereof; and 3 to 20 vol % of an inorganic needle-like filler. The heat resistant adhesive film is obtained by applying the thermosetting adhesive composition onto a polyimide film, followed by drying. The wiring film is obtained by placing a conductor wiring layer on the heat resistant adhesive film. | 08-29-2013 |
20130233590 | ADHESIVE FILM AND FLAT CABLE USING THE SAME - There is provided an adhesive film, comprising: an insulator film; an adhesive layer formed on the insulator film; and an intermediate adhesive layer interposed between the insulator film and the adhesive layer, wherein the intermediate adhesive layer is made of a mixed resin composition of a copolyamide being a crystalline resin solvable in a non-halogen based organic solvent and having a melting point of 100° C. or more and 150° C. or less, and a non-crystalline resin, and the intermediate adhesive layer contains a non-halogen flame retardant by 100 pts.wt. or more and 250 pts.wt. or less with respect to 100 pts.wt. of the mixed resin composition. | 09-12-2013 |