Patent application number | Description | Published |
20130134397 | Sealed Structure, Light-Emitting Device, Electronic Device, and Lighting Device - A sealed structure with high sealing capability, in which a pair of substrates is attached to each other with a glass layer is provided. The sealed structure has a first and second substrates, a first surface of the first substrate facing a first surface of the second substrate, and the glass layer which is in contact with the first and second substrates, defines a space between the first and second substrates, and is provided along the periphery of the first surface of the first substrate. The first substrate has a corner portion. The area of the first surface of the first substrate is smaller than or equal to that of the first surface of the second substrate. In at least one of respective welded regions between the glass layer and the first or second substrate, the width of the corner portion is larger than that of the side portion. | 05-30-2013 |
20130134398 | Sealed Structure, Light-Emitting Device, Electronic Device, and Lighting Device - A sealed structure which has high sealing capability and whose border can be slim is provided. The sealed structure includes a pair of substrates whose respective surfaces face each other with a space therebetween, and a glass layer which is in contact with the substrates, defines a space between the substrates, and has at least one corner portion and side portions in continuity with the corner portion. The width of the corner portion of the glass layer is smaller than or equal to that of the side portion of the same. The sealed structure may comprise a highly reliable light-emitting element including a layer containing a light-emitting organic compound provided between a pair of electrodes. | 05-30-2013 |
20140116614 | Method for Bonding Substrates, Method for Maufaturing Sealing Structure, and Method for Maufaturing Light-Emitting Device - An object is to improve productivity related to a laser light irradiation step in a bonding technique of substrates using glass frit. A highly airtight sealing structure or a highly airtight light-emitting device, which can be manufactured with high productivity, is provided. When a glass layer by melting glass frit or a sintered body by sintering glass frit is irradiated with laser light, in order to increase the efficiency, a light-absorbing material is attached to a surface of the glass layer. The laser light irradiation is performed on the light-absorbing material and the glass layer. The substrates are fixed with the glass layer therebetween. | 05-01-2014 |
20140125935 | Sealed Body and Method for Manufacturing the Same - A sealed body which is sealed with low-melting-point glass and has high airtightness is provided. In the sealed body, at least a wiring layer is provided between two facing substrates, the two substrates are bonded together with the use of a sealing layer containing glass frits as a material, and a metal layer is selectively provided in a region where the wiring layer and the sealing layer overlap. In a laser light irradiation step, the metal layer functions as a laser light reflecting film and suppresses application of excess energy to a sealing member in a region overlapping with the wiring layer. | 05-08-2014 |
20140216645 | Method for Forming Glass Layer and Method for Manufacturing Sealed Structure - To form a glass layer with high productivity over a substrate provided with a material whose upper temperature limit is low. A method for forming the glass layer includes a first step of providing a frit paste including a glass frit and a binder over a substrate, and a second step of relatively moving a laser light irradiation portion over the frit paste not to overlap with a laser light irradiation start portion. A track of the laser light irradiation portion in the second step has an intersection in an intersection portion. | 08-07-2014 |
20150055118 | LIGHT-EMITTING DEVICE AND CAMERA - A light-emitting device that can switch between two modes: single light emission and intermittent light emission is provided. The light-emitting device includes a driver circuit that can supply a control pulse signal, a constant current power supply that is supplied with the control pulse signal and can supply a constant current pulse, and a light-emitting panel that is supplied with the constant current pulse. The driver circuit includes a start switch circuit that can supply a start signal, a pulse-interval modulation circuit that can supply a pulse-interval modulation signal, and a microcomputer that is supplied with the start signal and the pulse-interval modulation signal and can supply the control pulse signal. | 02-26-2015 |
20150059986 | DEVICE FOR FORMING SEPARATION STARTING POINT, STACK MANUFACTURING APPARATUS, AND METHOD FOR FORMING SEPARATION STARTING POINT - A device for forming a separation starting point that allows separation of a surface layer of a processed member to form a remaining portion is provided. A manufacturing device of a stack including a support and a remaining portion of a processed member whose surface layer is separated is provided. The device for forming the separation starting point includes a stage that supports the processed member, a cutter that faces the stage, a head portion that supports the cutter, an arm portion that supports the head portion, and a moving mechanism that relatively moves the cutter to the stage. | 03-05-2015 |
20150153862 | TOUCH PANEL AND METHOD FOR MANUFACTURING TOUCH PANEL - A touch panel capable of performing display and sensing along a curved surface or a touch panel that maintains high detection sensitivity even when it is curved along a curved surface is provided. A flexible display panel is placed along a curved portion included in a surface of a support. A first film layer is attached along a surface of the display panel by a bonding layer. Second to n-th film layers (n is an integer of 2 or more) are sequentially attached along a surface of the first film layer by bonding layers. A flexible touch sensor is attached along a surface of the n-th film layer by a bonding layer. | 06-04-2015 |