Patent application number | Description | Published |
20130001763 | POWER DEVICE HAVING HIGH SWITCHING SPEED - An electronic device includes at least one electronic component chip having a first conduction terminal and a control terminal on a first surface of the chip and a second conduction terminal on a second surface opposite the first surface of the chip. An insulating body embeds the chip. The insulating body includes a mounting surface and an electrically conductive heat-sink connected to the first conduction terminal on the first surface of the chip, but insulated from the control terminal. An opening in a first surface of the insulating body exposes a surface of the electrically conductive heat sink. The electrically conductive heat sink includes a perimeter cavity configured for alignment with an encircling configuration of the control terminal, wherein the perimeter cavity contains a material that insulates the control terminal from the heat sink. | 01-03-2013 |
20130001764 | POWER DEVICE HAVING REDUCED THICKNESS - An electronic device includes at least one chip and an insulating body embedding the chip. The electronic device further includes a heat-sink in contact with the chip. The heat-sink includes a plate having a first thickness. A recess is provided in the plate that defines a central portion of the plate having a second thickness less than the first thickness. The chip is mounted to the central region of the heat-sink within the recess. The insulating body includes a surface, such as a mounting surface, including an opening exposing at least a portion of the heat-sink. The device may further include a reophore extending through a side surface of the insulating body, that reophore being in contact with the heat sink. | 01-03-2013 |
20130003305 | HALF-BRIDGE ELECTRONIC DEVICE WITH COMMON HEAT SINK ON MOUNTING SURFACE - A device includes a first switch and a second switch, each switch being integrated on a chip having a back surface and an opposite front surface. Each chip includes a first conduction terminal and a control terminal on the front surface, while a second conduction terminal of the switch is located on the back surface. The first switch and the second switch are connected in a half-bridge configuration with the first switch's second conduction terminal electrically connected to the second switch's first conduction terminal. The chips are installed in a common package comprising an insulating body with an embedded heat sink. The chips of the switches are mounted on the heat sink such that the second conduction terminal of the first switch and the first conduction terminal of the second switch are in contact with the heat sink, with the heat sink providing the electrical connection between the two switches. | 01-03-2013 |
20130003308 | POWER ELECTRONIC DEVICE HAVING HIGH HEAT DISSIPATION AND STABILITY - An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip. | 01-03-2013 |
20130003309 | HALF-BRIDGE ELECTRONIC DEVICE WITH COMMON AUXILIARY HEAT SINK - An electronic device includes a first and second integrated chip switch, each having a back (drain) surface and an opposite front (source) surface. An insulating package embeds the switches along with first, second and third heat sinks. The front surface of the first switch and back surface of the second switch are mounted to the first heat sink to couple first switch source to the second switch drain through the first heat sink in a half-bridge configuration. The first switch back surface is mounted to the second heat sink and the second switch front surface is mounted to the third heat sink. The package includes first, second and third openings which expose, respectively, the first, second and third heat sinks. The first heat sink opening is provided on one surface of the package, while the second and third heat sink openings are provided on an opposite surface of the package. | 01-03-2013 |
20130003311 | SYSTEM WITH SHARED HEATSINK - First and second electronic devices each include an insulating package embedding a chip of semiconductor material which integrates at least one electronic component. Each insulating package has a mounting surface for mounting the respective electronic device on a substrate and an opposite free surface. A heatsink is fixed to the free surfaces through respective first and second base portions. A connection element is configured to connect the first base portion to the second base portion. The heatsink also includes, for each electronic device, at least one stabilizing element extending from the respective base portion to make contact with a substrate to which the mounting surfaces of the first and second electronic devices are attached. | 01-03-2013 |
20130003312 | PACKAGE/HEATSINK SYSTEM FOR ELECTRONIC DEVICE - An insulating body embeds an integrated circuit and has a mounting surface, an opposite free surface, and at least one pin exposed along an edge of the mounting surface and electrically connected to a terminal of the integrated circuit. A heatsink configured to dissipate heat produced by the integrated circuit is provided in correspondence of the free surface. The heatsink includes at least one protruding element including a connection portion partly extending in contact with the free surface and partly protruding beyond a boundary of the free surface (the connection portion having a free end being distal from the insulating body), and a mounting portion extending from the free end at least up to a plane of the mounting surface. The heatsink is further electrically connected to a terminal of the integrated circuit chip. The protruding element is placed in correspondence of the at least one pin. | 01-03-2013 |
20130003313 | SYSTEM WITH STABILIZED HEATSINK - An insulating body incorporates at least one integrated circuit chip and includes a mounting surface for mounting to a board and a free surface opposite the mounting surface. A heatsink is attached to the insulating body at the free surface. The heatsink includes at least one stabilizing element. The stabilizing element includes an attachment portion extending at least partially transversely to the free surface beyond a peripheral boundary of the free surface when considered in plan view. The attachment portion has a binding end bound to the free surface and a free end opposite the binding end. The stabilizing element also has a mounting portion extending from the free end of the attachment portion at least up to a plane of the mounting surface. | 01-03-2013 |
20130083489 | ELECTRONIC SYSTEM FOR REFLOW SOLDERING - An electronic system includes an insulating structural element with a coupling surface configured for coupling the electronic system with at least one further electronic system. The electronic system further includes at least one conducting contact element at least partially exposed on the coupling surface. Each conducting contact element has a soldering surface supporting reflow soldering of the conducting contact element with a corresponding further contact element of the further electronic system. In addition, each conducting contact element has at least one lateral surface protruding from the insulating structural element. The soldering surface of the conducting contact element includes at least one channel having an opened end at the protruding lateral surface, the channel configured to facilitate dispersion of waste gas produced during reflow soldering. | 04-04-2013 |
20130083490 | ELECTRONIC SYSTEM FOR WAVE SOLDERING - An electronic board includes conducting traces having an upper surface at least partially sunken with respect to a gluing surface of the board. A surface mount technology electronic device for mounting to the board includes insulating windows that define gluing sites within one or more pins. An electronic system is formed by one or more of such surface mount technology electronic devices mounted to electronic board. The devices are attached using a wave soldering technique that flows through channels formed by the sunken conductive traces. | 04-04-2013 |
20130126590 | WAVE SOLDERING OF SURFACE-MOUNTING ELECTRONIC DEVICES ON PRINTED CIRCUIT BOARD - A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board. | 05-23-2013 |
20130154155 | MANUFACTURING OF DSC TYPE ELECTRONIC DEVICES BY MEANS OF SPACER INSERT - A DSC type device manufacturing process includes placing a circuit assembly in a mold. The circuit assembly includes a first heat sink, a semiconductor chip mounted on the first heat sink, a second heat sink mounted on the semiconductor chip and a pin block electrically connected to the semiconductor chip. An outer surface of the first heat sink and an outer surface of the pin block are placed in contact with a first inner surface of the mold. A spacer insert is placed in contact with, and positioned between, a second inner surface of the mold and an outer surface of the second heat sink. The mold is filled with an insulating material that is subsequently hardened. After hardening, a resulting device is extracted from the mold with the outer surfaces of the first heat sink, the pin block and the second heat sink exposed. | 06-20-2013 |
20130285229 | THROUGH-HOLE ELECTRONIC DEVICE WITH DOUBLE HEAT-SINK - An electronic device includes a first chip and a second chip, where each chip has a first conduction terminal on a first surface and a second conduction terminal on a second surface. An insulating body surrounds the first and second chip, a first heat-sink coupled with the first conduction terminals of the first and second chip, and a second heat-sink coupled with the second conduction terminals of the first and second chip. A portion of the first heat-sink and/or the second heat-sink being exposed from the insulating body. The electronic device includes a first conductive lead and a second conductive lead exposed from the insulating body for through-hole mounting of the electronic device on an electronic board, the first conductive lead being coupled with the first heat-sink and the second conductive lead being coupled with the second heat-sink. | 10-31-2013 |
20130285230 | ELECTRONIC DEVICE - A power device includes a chip of semiconductor material and a further chip of semiconductor material on each of which at least one power transistor is integrated; each chip comprises a first conduction terminal on a first surface, and a second conduction terminal and a control terminal on a second surface opposite the first surface, and an insulating body embedding said chip and said further chip. In the solution according to one or more embodiments of the present disclosure, the first surface of said chip faces the second surface of said further chip, and the power device further comprises a first heat-sink arranged between said chip and said further chip and electrically coupled with the first conduction terminal of said chip and with the second conduction terminal of said further chip, the control terminal of said further chip being electrically insulated from the first heat-sink. | 10-31-2013 |
20130294032 | THROUGH-HOLE MOUNTING SYSTEM WITH HEAT SINKING ELEMENTS CLAMPED TO ONE ANOTHER AGAINST INSULATING BODY - An electronic system includes an electronic device of through-hole mounting type comprising an insulating body for embedding at least a chip on which electronic components are integrated, a plurality of conductive leads projecting from the insulating body for said mounting, and a dissipation plate exposed from the insulating body for transferring heat from said electronic component in operation towards the outside of the insulating body. The electronic system includes a heat sink in contact with said dissipation plate for dissipating said heat. The heat sink comprises a first dissipation element, a second dissipation element, and clamping means for clamping the first dissipation element and the second dissipation element together against the insulating body of said electronic device. | 11-07-2013 |
20140239413 | POWER ELECTRONIC DEVICE - A device includes a first and second transistors integrated in first and second chips. Each chip has opposed rear and front surfaces, and further has a first conduction terminal and a control terminal on the front surface and a second conduction terminal on the rear surface. The first and second transistors are electrically connected in series by having the first conduction terminals of the first and second transistors be electrically connected. The device includes a common package enclosing the first and second chips, the common package having an insulating body with a mounting surface. A heat sink is also enclosed within the insulating body, the heat sink making electrical contact with the first conduction terminals of the first and second chips on the respective front surfaces, so that the first conduction terminals are electrically connected together through the heat sink. | 08-28-2014 |
20140301042 | MANUFACTURING OF A HEAT SINK BY WAVE SOLDERING - An electronic device is attached to a first surface of a board which includes vias. A heat sink precursor for the electronic device is attached to the second surface of the electronic board. The heat sink precursor includes a cavity facing the vias. A wave of solder paste is applied to the second surface. The solder paste penetrates into the cavity of the heat sink precursor and flows by capillary action through the vias to weld a thermal radiator and/or electronic contact of the electronic device to the vias. The solder paste further remains in the cavity to form a corresponding heat sink. | 10-09-2014 |