Patent application number | Description | Published |
20110248692 | Turbo circuit for providing voltage regulation and related method - According to one embodiment, a turbo circuit for increasing an output of a voltage regulator having a several power stages includes an activation sub-circuit coupled to a feedback signal of the voltage regulator, the activation sub-circuit being configured to generate a multi-stage ON signal for turning on the power stages substantially concurrently. The turbo circuit further comprises a deactivation sub-circuit coupled to the feedback signal, the deactivation sub-circuit being configured to cancel the multi-stage ON signal when the feedback signal reaches an extremum value. In one embodiment, the turbo circuit may be implemented in a multi-phase buck converter fabricated as part of an integrated circuit on a semiconductor die. In another embodiment, the turbo circuit can be implemented in a multi-phase boost converter as part of an integrated circuit on a semiconductor die. | 10-13-2011 |
20130256807 | Integrated Dual Power Converter Package Having Internal Driver IC - An integrated dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET paddle configured to support a drain of a second control FET. The leadframe further includes a sync FET paddle configured to support a source of a first sync FET and a source of a second sync FET, and a driver integrated circuit (IC) paddle configured to support a driver IC for controlling each of the control FETs and each of the sync FETs. The leadframe may additionally include first and second switched nodes, configured for electrical connection to the first control FET and the first sync FET via a first clip, and to the second control FET and the second sync FET via a second clip, respectively. | 10-03-2013 |
20130256859 | Dual Power Converter Package Using External Driver IC - A dual power converter package is disclosed. The package includes a leadframe having a first control FET paddle configured to support a drain of a first control FET, and a second control FET paddle configured to support a drain of a second control PET. The leadframe further includes a sync FET paddle configured to support a source of a first sync FET and a source of a second sync FET, and a first plurality of contacts configured to receive control signals for each of the control PETS and each of the sync FETs from a driver integrated circuit (IC) external to the leadframe. The leadframe may additionally include first and second switched nodes, configured for electrical connection to the first control FET and the first sync FET via a first clip, and to the second control PET and the second sync PET via a second clip, respectively. | 10-03-2013 |
20130256905 | Monolithic Power Converter Package with Through Substrate Vias - According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. The high side power input and a power output of the half-bridge each are disposed on a top surface of the monolithic die. The high side power input is electrically coupled to the substrate through a high side power connection. The power output is electrically coupled to the substrate through a power output connection. The low side power input of the half-bridge comprises a plurality of through substrate vias that extend through the monolithic die to electrically connect a low side power pad to the monolithic die. | 10-03-2013 |
20130257524 | Monolithic Power Converter Package - According to an exemplary embodiment, a monolithic power converter package includes a monolithic die over a substrate, the monolithic die integrating a driver integrated circuit (IC) with a control power transistor and a sync power transistor connected in a half-bridge. A high side power input, a low side power input, and a power output of the half-bridge are each disposed on a top surface of the monolithic die. The high side power input is electrically and mechanically coupled to the substrate by a high side power strip. Also, the low side power input is electrically and mechanically coupled to the substrate by a low side power strip. Furthermore, the power output is electrically and mechanically coupled to the substrate by a power output strip. | 10-03-2013 |
Patent application number | Description | Published |
20110073217 | WEAR RESISTANT DEVICE AND PROCESS THEREFOR - A wear resistant device includes a substrate of a first metallic material and a wear resistant layer disposed on a substrate. The wear resistant layer includes a matrix of a second, different metallic material, particulates dispersed throughout the matrix, and a boron material dispersed within a portion of the matrix. | 03-31-2011 |
20110287239 | Multilayered Coating For Improved Erosion Resistance - An erosion resistant coating for a substrate includes two or more coating layers affixed to the substrate having an increasing modulus of elasticity and hardness from an innermost layer of the coating adjacent to the substrate to an outermost layer of the coating furthest from the substrate. A method of applying a coating system to a substrate includes applying a first layer of a high hardness and high modulus of elasticity material combined with an added metal to the substrate. A second layer of the high hardness and high modulus of elasticity material combined with the added metal is applied to the first layer, resulting in a coating system wherein the second layer has a modulus of elasticity and hardness greater than the modulus of elasticity and hardness of the first layer. | 11-24-2011 |
20140093378 | EROSION AND FATIGUE RESISTANT BLADE AND BLADE COATING - A coating is described for an airfoil blade component. The coating comprises a cermet material and has, when applied to the rotor blade, a compressive residual stress greater than about 60 ksi. In another embodiment, the compressive residual stress of the coating is in the range of approximately 90-110 ksi. | 04-03-2014 |
20140366573 | METHOD AND APPARATUS OF FORMING HEAT EXCHANGER TUBES - A heat exchange tube for a refrigerant-flooded evaporator includes a tube body and a plurality of channels for conveying a cooling medium therethrough located in the tube body. One or more outer wall textural elements are included at the outer wall of the tube body to improve thermal energy transfer between the cooling medium and a volume of boiling refrigerant. A method of forming a heat exchange tube for a refrigerant-flooded evaporator includes urging a billet into an extrusion section and forming the billet into two tube halves including an outer wall and an inner wall having a plurality of channel halves. A textural element is formed at one or more of the outer wall and the inner wall via one or more rotating dies, and the two tube halves are joined to form the heat exchange tube. | 12-18-2014 |
20150086083 | STRUCTURAL HOT SPOT AND CRITICAL LOCATION MONITORING SYSTEM AND METHOD - A method for detecting a crack in a structural component includes receiving, with a processor, signals indicative of at least one image for a critical location in the structural component; determining, with the processor, at least one shape in the at least one image, the at least one shape being representative of a structure of the critical location; representing, with the processor, at least one region around the structure into a matrix; and applying, with the processor, image processing on the matrix to detect cracks in the at least one region of the structural component. | 03-26-2015 |