Patent application number | Description | Published |
20110091811 | DOUBLE-LAYERED PATTERNABLE ADHESIVE FILM, METHOD OF FORMING THE SAME, AND METHOD OF FORMING PATTERNABLE ADHESIVE LAYER USING THE SAME - A patternable adhesive film is formed in a double-layered structure of an adhesive layer having patternability and an adhesive layer having both adhesion and developability. Thus, the double-layered patternable adhesive film can effectively have both patternability and adhesion. | 04-21-2011 |
20120135251 | PHOTOSENSITIVE POLYIMIDE HAVING SILICON MODIFIED GROUP, ADHESIVE COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - A photosensitive polyimide and an adhesive composition and adhesive film containing the same are provided. The photosensitive polyimide has an imide backbone and grafted side chains including a methacrylate-based side chain and a silicon-modified side chain. | 05-31-2012 |
20120175790 | COMPOSITION FOR PATTERNABLE ADHESIVE FILM, PATTERNABLE ADHESIVE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME - A composition for a patternable adhesive film, a patternable adhesive film having the same, and a method of manufacturing a semiconductor package using the patternable adhesive film are provided. The composition contains a binder resin, a radical-polymerizable acrylate monomer, a photo-radical initiator, and a thermal-radical initiator without an epoxy resin. The composition may have good patternability, adhesiveness, and low-temperature stability, and be rapidly cured at a low temperature. | 07-12-2012 |
20120181686 | METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE - A method of preparing a semiconductor package including disposing photosensitive adhesive film on a reinterconnected rear surface of a wafer on which the through electrodes are disposed, and forming a pattern corresponding to the through electrodes to prepare the semiconductor package. | 07-19-2012 |
20120181702 | PHOTOSENSITIVE ADHESIVE COMPOSITION HAVING ALKALI SOLUBLE EPOXY RESIN, AND PATTERNABLE ADHESIVE FILM USING THE SAME - Provided are a photosensitive adhesive composition having an alkali soluble epoxy resin and a patternable adhesive film using the same. The photosensitive adhesive composition has good pattern formability and adhesiveness since the photosensitive adhesive composition includes the alkali soluble epoxy resin. | 07-19-2012 |
20120181703 | PATTERNABLE ADHESIVE COMPOSITION, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE - A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator. | 07-19-2012 |
20120264963 | PHOTOCURABLE COMPOUND - Disclosed is a compound having a photocurable urethane(meth)acrylate group, its manufacturing method, and a photocurable composition including the compound. The compound is represented by Chemical Formulae 1 to 6. Each of Chemical Formulae 1 to 6 includes a urethane(meth)acrylate group represented by Chemical Formula 1-1 or 1-2. | 10-18-2012 |
20150144918 | METHOD OF MANUFACTURING OPTICAL FILM FOR REDUCING COLOR SHIFT, ORGANIC LIGHT-EMITTING DISPLAY APPARATUS USING OPTICAL FILM FOR REDUCING COLOR SHIFT, AND METHOD OF MANUFACTURING THE SAME - An optical film manufacturing method includes forming a master in which a shape corresponding to a plurality of micro-lens patterns is engraved, forming a low refractive index pattern layer in which the plurality of micro-lens patterns are formed, by using the master, forming a high refractive index material layer that has a higher refractive index than a refractive index of the low refractive index pattern layer, and imprinting the low refractive index pattern layer on the high refractive index material layer to form a high refractive index pattern layer, on a first surface of a substrate. | 05-28-2015 |