Patent application number | Description | Published |
20080211112 | Carbon Nanotube Bond Pad Structure and Method Therefor - A bond pad structure ( | 09-04-2008 |
20080266028 | Enhanced Substrate Using Metamaterials - In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate ( | 10-30-2008 |
20090009973 | Nanotube-Based Fluid Interface Material and Approach - A thermal interface material ( | 01-08-2009 |
20090102067 | ELECTRICALLY ENHANCED WIREBOND PACKAGE - Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device ( | 04-23-2009 |
20090127712 | NANOTUBE-BASED DIRECTIONALLY-CONDUCTIVE ADHESIVE - A tape adhesive type material is directionally conductive. According to an example embodiment of the present invention, carbon nanotubes ( | 05-21-2009 |
20090213551 | INTEGRATED CIRCUIT NANOTUBE-BASED STRUCTURE - Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement ( | 08-27-2009 |
20090301757 | METHOD AND SYSTEM FOR COMPOSITE BOND WIRES - Bond wires for integrated circuits are implemented using a variety of methods. Using one such method, a composite bond wire is produced for use in an integrated circuit. A conductive material is melted and mixed with a material of particles less than 100 micrometers in size to create a mixture. The mixture is used to create the composite bond wire. A composite wire having an inner core and an outer layer having a higher conductivity than the inner core is also provided. The outer layer is designed to be thicker than the skin depth at the operating frequency for carrying AC signals. | 12-10-2009 |
20110156255 | CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS - A variety of characteristics of an integrated circuit chip arrangement with a chip and package-type substrate are facilitated. In various example embodiments, a carbon nanotube-filled material ( | 06-30-2011 |