Patent application number | Description | Published |
20140058036 | METHOD OF PRODUCING POLYIMIDE RESIN, METHOD OF PRODUCING POLYIMIDE COATING, METHOD OF PRODUCING POLYAMIC ACID SOLUTION, POLYIMIDE COATING, AND POLYAMIC ACID SOLUTION - A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N′,N′-tetramethylurea. | 02-27-2014 |
20140234784 | DEVELOPING SOLUTION AND DEVELOPMENT PROCESSING METHOD OF PHOTOSENSITIVE RESIN COMPOSITION - A developing solution for a polyimide precursor containing N,N,N′,N′-tetramethylurea and a lower alcohol having 1 to 5 carbon atoms. The developing solution increases a development margin and results in little or no decrease of the film thickness of a polyimide-based resin film. A development processing method of a photosensitive polyimide resin composition including developing a photosensitive polyimide precursor resin composition, at least a part of which is exposed, with the developing solution; and a pattern formation method including forming a coating film or molding including a photosensitive polyimide precursor resin composition, selectively exposing the coating film or molding, and developing the exposed coating film or molding by the development processing method. | 08-21-2014 |
20150252229 | CURABLE COMPOSITION, ADHESIVE, METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL - A curable composition obtained by blending a polymerizable compound (A) having predetermined types of polymerizable functional groups, a reactive compound (B) having predetermined types of reactive functional groups, a compound (C) which is an imidazolyl group-containing compound having a predetermined structure, and a compound (D) which is an oxime compound or an oxime ester compound having a predetermined structure. | 09-10-2015 |
20150261086 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING POLYIMIDE RESIN PATTERNS, AND PATTERNED POLYIMIDE RESIN FILM - A positive photosensitive resin composition containing a polyimide resin that allows patterns to be satisfactorily formed by photolithography, and provides patterns with excellent heat resistance, and a method for forming polyimide resin patterns using the positive photosensitive resin composition. A patterned polyimide resin film formed by the method for forming polyimide resin patterns. To the photosensitive resin composition are added a polyimide resin, and a compound in which an imidazole compound having a specific structure is generated by the action of light. | 09-17-2015 |
20150338734 | ENERGY-SENSITIVE RESIN COMPOSITION - The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product. | 11-26-2015 |
Patent application number | Description | Published |
20110100549 | METHOD FOR MANUFACTURING COMPONENT-EMBEDDED MODULE - A method for manufacturing a component-embedded module includes a first step of preparing a first resin layer made of a thermoplastic resin and including wiring patterns on one of primary surfaces of the first resin layer, a second resin layer made of a thermoplastic resin, and a circuit component including terminal electrodes, and a second step of stacking, heating, and press-bonding the first and second resin layers in a state in which the circuit component is arranged between the one primary surface of the first resin layer and the second resin layer. In the second step, the wiring patterns on the one primary surface of the first resin layer and the terminal electrodes of the circuit component are bonded to each other by solid phase diffusion bonding, to connect the wiring patterns on the one primary surface of the first resin layer and the terminal electrodes of the circuit component to each other. | 05-05-2011 |
20120000695 | RESIN CIRCUIT BOARD - A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and the second conductor layer have a higher thermal expansion coefficient than the first conductor layer such that the thermal expansion coefficient changes gradually, allowing a stress resulting from a difference in thermal expansion coefficient to be relieved. | 01-05-2012 |
20120003499 | FLEXIBLE BOARD - A reliable flexible board prevents disconnection from occurring in a conductor layer in a stacking process or during use of a product that repeatedly causes deformation. The flexible board includes resin layers and conductor layers that are alternately stacked on top of one another, wherein each of the conductor layers includes a first conductor layer made of a first metal and a second conductor layer made of a second metal disposed between one of the resin layers and the first conductor layer, the second metal having a higher ductility than the first metal. | 01-05-2012 |
20120228005 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND COLLECTIVE BOARD - A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut. | 09-13-2012 |
20130213699 | SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced. | 08-22-2013 |
20130299219 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a multilayer circuit board that includes a plurality of resin layers, conductive wiring layers, and via-hole conductors. Each of the resin layers includes a resin sheet containing a resin and a conductive wiring layer disposed on at least one surface of the resin sheet. The via-hole conductors contain an intermetallic compound having a melting point of 300° C. or more produced by a reaction between a first metal composed of Sn or an alloy containing 70% by weight or more Sn and a second metal composed of a Cu—Ni alloy or a Cu—Mn alloy. The second metal has a higher melting point than the first metal. | 11-14-2013 |
20150113802 | METHOD OF MANUFACTURING RESIN MULTILAYER SUBSTRATE - A method of manufacturing a resin multilayer substrate with a cavity, includes stacking insulation substrates including thermoplastic resins and thermocompression-bonding the insulation substrates. At least one of the insulation substrates is formed by affixing a peelable carrier film to one main surface of the insulation substrate, making a cut in the insulation substrate having the carrier film affixed thereto, the cut being designed to form the cavity, penetrating the insulation substrate in a thickness direction and not penetrating the carrier film in a thickness direction, and removing the carrier film and a portion of the insulation substrate that is cut out by the cut. | 04-30-2015 |
20150327374 | METHOD FOR MANUFACTURING RIGID-FLEXIBLE MULTILAYER WIRING BOARD AND COLLECTIVE BOARD - A method for manufacturing a rigid-flexible multilayer wiring board includes a step of forming a release layer such that the release layer covers a flexible portion forming region of a principal surface of a first thermoplastic resin sheet, a step of conducting surface modification on the principal surface of the first thermoplastic resin sheet while using the release layer as a mask, a step of laminating a second thermoplastic resin sheet such that the second thermoplastic resin sheet covers the release layer to form a laminate including the first and second thermoplastic resin sheets, a step of press-bonding the laminate, a step of forming a cut from at least either one of upper and lower surfaces of the laminate toward an outline of the release layer when seen in a plan view, and a step of removing a portion surrounded by the cut. | 11-12-2015 |