Patent application number | Description | Published |
20100022153 | REPAIRING METHODS OF PIXEL STRUCTURE AND ORGANIC ELECTRO-LUMINESCENCE DISPLAYING UNIT - The invention provides a method of repairing the pixel structure, and the method includes the following. First, an electrical connection between the current control unit and the power line is cut. The power line is then electrically connected to the redundant active device, so that the current control unit and the redundant active device control the current provided by the power line. The invention provides a method of repairing the organic electro-luminescence display unit, suitable for repairing the above-mentioned organic electro-luminescence display unit, and the method includes the following. First, an electrical connection between the current control unit and the power line is cut. The power line is electrically connected to the redundant active device, so that the current control unit and the redundant active device control the current passing through the organic electro-luminescence layer. | 01-28-2010 |
20100219463 | QUASI-VERTICAL STRUCTURE FOR HIGH VOLTAGE MOS DEVICE - A semiconductor device provides a high breakdown voltage and a low turn-on resistance. The device includes: a substrate; a buried n+ layer disposed in the substrate; an n-epi layer disposed over the buried n+ layer; a p-well disposed in the n-epi layer; a source n+ region disposed in the p-well and connected to a source contact on one side; a first insulation layer disposed on top of the p-well and the n-epi layer; a gate disposed on top of the first insulation layer; and a metal electrode extending from the buried n+ layer to a drain contact, wherein the metal electrode is insulated from the n-epi layer and the p-well using by a second insulation layer. | 09-02-2010 |
20110073962 | METHOD AND APPARATUS FOR FORMING A SEMICONDUCTOR GATE - The present disclosure provides an apparatus and method for fabricating a semiconductor gate. The apparatus includes, a substrate having an active region and a dielectric region that forms an interface with the active region; a gate electrode located above a portion of the active region and a portion of the dielectric region; and a dielectric material disposed within the gate electrode, the dielectric material being disposed near the interface between the active region and the dielectric region. The method includes, providing a substrate having an active region and a dielectric region that forms an interface with the active region; forming a gate electrode over the substrate, the gate electrode having an opening near a region of the gate electrode that is above the interface; and filling the opening with a dielectric material. | 03-31-2011 |
20110079846 | HIGH VOLTAGE DEVICES, SYSTEMS, AND METHODS FOR FORMING THE HIGH VOLTAGE DEVICES - A high voltage (HV) device includes a gate dielectric structure over a substrate. The gate dielectric structure has a first portion and a second portion. The first portion has a first thickness and is over a first well region of a first dopant type in the substrate. The second portion has a second thickness and is over a second well region of a second dopant type. The first thickness is larger than the second thickness. A gate electrode is disposed over the gate dielectric structure. A metallic layer is over and coupled with the gate electrode. The metallic layer extends along a direction of a channel under the gate dielectric structure. At least one source/drain (S/D) region is disposed within the first well region of the first dopant type. | 04-07-2011 |
20110163376 | HIGH VOLTAGE DEVICES AND METHODS OF FORMING THE HIGH VOLTAGE DEVICES - A high voltage (HV) device includes a well region of a first dopant type disposed in a substrate. A first well region of a second dopant type is disposed in the well region of the first dopant type. An isolation structure is at least partially disposed in the well region of the first dopant type. A first gate electrode is disposed over the isolation structure and the first well region of the second dopant type. A second well region of the second dopant type is disposed in the well region of the first dopant type. The second well region of the second dopant type is spaced from the first well region of the second dopant type. A second gate electrode is disposed between and over the first well region of the second dopant type and the second well region of the second dopant type. | 07-07-2011 |
20110260245 | Cost Effective Global Isolation and Power Dissipation For Power Integrated Circuit Device - An integrated circuit device and method for fabricating the integrated circuit device is disclosed. In an embodiment, an apparatus includes a substrate having a first surface and a second surface, the second surface being opposite the first surface; a first device and a second device overlying the substrate; and an isolation structure that extends through the substrate from the first surface to the second surface and between the first device and the second device. | 10-27-2011 |
20130140667 | LOCALIZED CARRIER LIFETIME REDUCTION - A semiconductor structure includes a substrate, a first power device and a second power device in the substrate, at least one isolation feature between the first and second power device, and a trapping feature adjoining the at least one isolation feature in the substrate. | 06-06-2013 |
20130240982 | QUASI-VERTICAL STRUCTURE FOR HIGH VOLTAGE MOS DEVICE - A semiconductor device which includes a buried layer having a first dopant type disposed in a substrate. The semiconductor device further includes a second layer having the first dopant type over the buried layer, wherein a dopant concentration of the buried layer is higher than a dopant concentration of the second layer. The semiconductor device further includes a first well of a second dopant type disposed in the second layer and a first source region of the first dopant type disposed in the first well and connected to a source contact on one side. The semiconductor device further includes a gate disposed on top of the well and the second layer and a metal electrode extending from the buried layer to a drain contact, wherein the metal electrode is insulated from the second layer and the first well by an insulation layer. | 09-19-2013 |
20130337644 | Method and Apparatus for Forming a Semiconductor Gate - The present disclosure provides an apparatus and method for fabricating a semiconductor gate. The apparatus includes, a substrate having an active region and a dielectric region that forms an interface with the active region; a gate electrode located above a portion of the active region and a portion of the dielectric region; and a dielectric material disposed within the gate electrode, the dielectric material being disposed near the interface between the active region and the dielectric region. The method includes, providing a substrate having an active region and a dielectric region that forms an interface with the active region; forming a gate electrode over the substrate, the gate electrode having an opening near a region of the gate electrode that is above the interface; and filling the opening with a dielectric material. | 12-19-2013 |
20140057407 | High Voltage Resistor - Provided is a semiconductor device. The semiconductor device includes a resistor and a voltage protection device. The resistor has a spiral shape. The resistor has a first portion and a second portion. The voltage protection device includes a first doped region that is electrically coupled to the first portion of the resistor. The voltage protection device includes a second doped region that is electrically coupled to the second portion of the resistor. The first and second doped regions have opposite doping polarities. | 02-27-2014 |
20140197488 | METHOD OF FORMING HIGH VOLTAGE DEVICE - A method of forming a device includes forming a buried well region of a first dopant type in a substrate. A well region of the first dopant type is formed over the buried well region. A first well region of a second dopant type is formed between the well region of the first dopant type and the buried well region of the first dopant type. A second well region of the second dopant type is formed in the well region of the first dopant type. An isolation structure is formed at least partially in the well region of the first dopant type. A first gate electrode is formed over the isolation structure and the second well region of the second dopant type. | 07-17-2014 |
20140284706 | QUASI-VERTICAL STRUCTURE HAVING A SIDEWALL IMPLANTATION FOR HIGH VOLTAGE MOS DEVICE - A semiconductor device includes a buried layer having a first dopant type in a substrate. The semiconductor device includes a first layer having the first dopant type over the buried layer. The semiconductor device includes at least one first well of a second dopant type disposed in the first layer. The semiconductor device includes an implantation region of the second dopant type in a sidewall of the first layer, wherein the implantation region is below the at least one first well. The semiconductor device includes a first source region disposed in the at least one first well; and at least one gate disposed on top of the first well and the first layer. The semiconductor device includes a metal electrode extending from the buried layer to a drain contact, wherein the metal electrode is insulated from the first layer and the at least one first well by an insulation layer. | 09-25-2014 |