Chih-Ming
Chih Ming Chen, Taipei TW
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20090081286 | Extended release venlafaxine formulation - A controlled release dosage form of venlafaxine that comprises an immediate release pellet and an extended release pellet. | 03-26-2009 |
20110195119 | CONTROLLED RELEASE METFORMIN FORMULATIONS - Sustained release pharmaceutical formulations comprising an antihyperglycemic drug or a pharmaceutically acceptable salt thereof are disclosed. The formulations provide therapeutic plasma levels of the antihyperglycemic drug to a human patient over a 24 hour period after administration. | 08-11-2011 |
20110268799 | ORAL CONTROLLED RELEASE DOSAGE FORM - A dosage form that provides a controlled release solid dosage form for the oral administration of a central nervous system stimulant, preferably methylphenidate hydrochloride. | 11-03-2011 |
20130022678 | ORAL CONTROLLED RELEASE DOSAGE FORM - A dosage form that provides a controlled release solid dosage form for the oral administration of a central nervous system stimulant, preferably methylphenidate hydrochloride. | 01-24-2013 |
20130117585 | POWER SUPPLY DEVICE FOR SUPPLYING POWER VIA INTERNET NETWORK - A power supply device for supplying power via internet network comprises a power supply unit and a power consumption unit. The power supply unit comprises a power source unit and a first processing unit. The power source unit provides a first voltage with a first power and a second voltage with a second power. The first processing unit detects a connection status of the power supply unit for controlling the power source unit to provide the first voltage, and controlling the power source unit to provide the second voltage according to a control signal. The power consumption unit comprises a connecting unit and a second processing unit. The connecting unit is for connecting the power source unit and the first processing unit. The second processing unit receives the first voltage via the connecting unit and provides the control signal according to the first voltage. | 05-09-2013 |
20140115313 | ELECTRONIC DEVICE AND START-UP METHOD THEREOF - An electronic device and a method for starting up the same, wherein the electronic device includes a firmware control unit, a power supply state storage unit, a basic input output unit, and an Ethernet interface coupled to power supply apparatus to a Power over Ethernet to receive a power supply via a network cable. The firmware control unit determines whether the power supply state of the power supply is in a first power mode, by checking a power supply state signal. When the power supply state is not in the first power mode, the basic input output unit executes a second power booting program. The firmware control unit communicates with the power supply apparatus via a network, increases the rated power of the power supply, sets the power supply state signal for controlling the power supply state to be in the first power mode, and restarts the electronic device. | 04-24-2014 |
20140115349 | COMPUTER APPARATUS AND WAKE-UP METHOD THEREOF - The disclosure provides a computer apparatus including a peripheral device, a hub unit and a control unit, and a wake-up method thereof. The peripheral device is configured to generate an input signal. The hub unit is coupled to the peripheral device. When the computer apparatus is in a power-saving state, the hub unit is configured to receive the input signal to generate a wake-up event (WUE). The control unit is coupled to the hub unit. When the computer apparatus is in the power-saving state, the control unit is configured to detect whether the WUE is generated, so as to wake up the computer apparatus, so that the computer apparatus is returned to a normal operating state from the power-saving state. | 04-24-2014 |
Chih Ming Hong, Hsin-Chu TW
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20120028174 | Defense System in Advanced Process Control - A method includes performing a lithography process on a wafer to form a patterned photo resist, and measuring the wafer to determine an overlay error of the patterned photo resist. A high/low specification is determined using the overlay error. An overlay process value setting is generated and compared with the high/low specification to determine whether the overlay process value setting is within a range defined by the high/low specification. | 02-02-2012 |
Chih Ming Lai, Pingtung City TW
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20080303041 | Light emitting element, manufacturing method thereof and light emitting module using the same - A light emitting element, and a manufacturing method thereof, and a light emitting module using the same are provided. The light emitting element includes a first light emitting diode (LED), a second LED, a first electrode and a second electrode. The first LED is disposed on a substrate and has a first P-type semiconductor and a first N-type semiconductor. The second LED is disposed above the first LED and has a second P-type semiconductor and a second N-type semiconductor. The first electrode is electrically connected to the first P-type semiconductor and the second N-type semiconductor. The second electrode is electrically connected to the first N-type semiconductor and the second P-type semiconductor. The first electrode and the second electrode are electrically connected to an alternating current for driving the first LED and the second LED to emit light by turns. | 12-11-2008 |
20090250715 | LED TRANSPARENT BRICK - An LED transparent brick comprises a transparent brick body, a photo catalyst layer, a connecting layer, a light reflection layer and one or more ultraviolet LEDs. The photo catalyst layer is placed at a first surface of the transparent brick body, and the connecting layer combines the transparent brick body and the photo catalyst layer. The light reflection layer is placed at a second surface of the transparent brick body, and the second surface corresponds to the first surface. The ultraviolet LED is placed at a side of the transparent brick body, and illuminates the photo catalyst layer to generate oxidative decomposition and hydrophilic capabilities. The light reflection layer can increase light reflection in the transparent brick body to the photo catalyst layer. | 10-08-2009 |
Chih Ming Wu, Taipei TW
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20100164741 | Wireless music transmission device for wirelessly controlling volume-adjustment and song-selection functions of ipod - A wireless music transmission device for wirelessly controlling volume-adjustment and song-selection functions of iPod includes a wireless earphone and a wireless music transmitter. The wireless music transmitter is electrically connected to iPod. The wireless earphone and the wireless music transmitter both have a radio frequency integrated circuit, so as to transmit control signals of volume-adjustment and song-selection functions between wireless earphone and wireless music transmitter via radio frequency integrated circuits. | 07-01-2010 |
20140158722 | MATERIAL DISCHARGING DEVICE AND MAKEUP MATERIAL BOX THEREOF - A material discharging device and a makeup material box thereof are provided. The material discharging device includes a plurality of makeup material boxes. Each makeup material box includes a shell, a pump, a first channel, a second channel, a material storage box, and a third channel. The pump is arranged in the shell. The first and second channels are connected to the pump, so that external gas enters the pump through the first channel and gas output from the pump is guided to the outside of the shell through the second channel. The third channel has a first end and a second end. The first end communicates with the material storage box, and the second end communicates with the first channel, the second channel, or the pump. The simple structure is used to reduce the size of the material discharging device and lower a manufacturing cost. | 06-12-2014 |
Chih Ming Yang, Hsinchu City TW
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20130185689 | METHOD OF AND SYSTEM FOR GENERATING OPTIMIZED SEMICONDUCTOR COMPONENT LAYOUT - A method of generating an optimized layout of semiconductor components in conformance with a set of design rules includes generating, for a unit cell including one or more semiconductor components, a plurality of configurations each of which satisfies some, but not all, of the design rules. For each configuration, it is checked whether a layout, which is a repeating pattern of the unit cell, satisfies the remaining design rules. Among the configurations which satisfy all of the design rules, the configuration providing an optimal value of a property is selected for generating the optimized layout of the semiconductor components. | 07-18-2013 |
20150121317 | MULTI-PATTERNING SYSTEM AND METHOD - A non-transitory, computer readable storage medium is encoded with computer program instructions, such that, when the computer program instructions are executed by a computer, the computer performs a method. The method generates mask assignment information for forming a plurality of patterns on a layer of an integrated circuit (IC) by multipatterning. The mask assignment information includes, for each of the plurality of patterns, a mask assignment identifying which of a plurality of masks is to be used to form that pattern, and a mask assignment lock state for that pattern. User inputs setting the mask assignment of at least one of the plurality of patterns, and its mask assignment lock state are received. A new mask assignment is generated for each of the plurality of patterns having an “unlocked” mask assignment lock state. | 04-30-2015 |
20150356235 | GENERATING A SEMICONDUCTOR COMPONENT LAYOUT - A method includes generating a first set of configurations of a layout of semiconductor components. The configurations of the first set of configurations each satisfy a first sub-set of a set of design rules. The method also includes generating a second set of configurations of the layout of semiconductor components. The second set of configurations are generated by eliminating one or more configurations of the first set of configurations based on a determination that the eliminated one or more configurations of the first set of configurations fail to satisfy a second sub-set of the set of design rules. The method further includes manufacturing a semiconductor device having semiconductor components arranged based on one of the configurations of the second set of configurations. | 12-10-2015 |
Chih-Ming Cheng, Tucheng City TW
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20100131028 | REMOTE SLEEP QUALITY DETECTING SYSTEM AND METHOD THEREOF - A remote sleep quality detecting system and its method provide a portable detecting device for detecting an examinee's physical activity while the examinee is sleeping, analyzing a detected activity signal by a signal processing module to generate a statistical value, and comparing a result of the computed statistical value with a sleep state index to obtain sleep quality information, and then storing the activity signal and the sleep quality information in a storage unit. The system and method also provide a remote monitoring device including a sleep information reading module for providing a user interface, connecting the portable detecting device via the Internet and receiving the sleep quality information produced by the portable detecting device after a command from the portable detecting device is received, such that the examinee's sleep quality information can be examined from a remote location for a long term without disturbing the examinee's sleep. | 05-27-2010 |
Chih-Ming Cheng, Taiping City TW
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20110061247 | QUICK-RELEASE STRUCTURE FOR OUTER COVER OF A HANDHELD CIRCULAR SAW - A quick-release structure for outer cover of a handheld circular saw, including a main body, an outer cover, a circular saw blade disposed between the main body and the outer cover, a motor disposed in the main body for driving the circular saw blade and a first, a second, a third and a fourth connection sections. The first and second connection sections are respectively disposed at a first end and a second end of the main body. The third connection section is disposed at a first end of the outer cover corresponding to the first connection section for connecting therewith. The fourth connection section is disposed at a second end of the outer cover corresponding to the second connection section for connecting therewith. The third connection section is angularly and linearly displaceable relative to the outer cover and the first connection section without detaching from the outer cover. | 03-17-2011 |
Chih-Ming Cheng, Taichung Hsien TW
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20130320513 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is provided, including: a substrate having at least a conductive pad; a semiconductor element disposed on the substrate; a conductive adhesive formed on top and side surfaces of the semiconductor element and extending to the conductive pad; and an electronic element disposed on the conductive adhesive. The conductive adhesive and the conductive pad form a shielding structure so as to prevent electromagnetic interference from occurring between the semiconductor element and the electronic element. | 12-05-2013 |
20140353850 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF - A semiconductor package is disclosed, which includes: a circuit board; a carrier disposed on the circuit board; an RF chip disposed on the carrier; a plurality of high level bonding wires electrically connecting electrode pads of the RF chip and the circuit board; and an encapsulant formed on the circuit board for encapsulating the carrier, the high level bonding wires and the RF chip. The present invention positions the RF chip at a high level so as to facilitate element arrangement and high frequency wiring on the circuit board, thereby achieving a highly integrated wireless SiP (System in Package) module. | 12-04-2014 |
Chih-Ming Cheng, Jhongli City TW
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20090069644 | Sleeping quality monitor system and a method for monitoring a physiological signal - A sleeping quality monitor system and a method for monitoring a physiological signal monitors the sleeping quality of a person under test with long hours in daily life at home. The system comprises a distributed data server, at least one physiological signal sensor, and at least one client computer. The sensor is wired or wirelessly connected to the server. The server connects on Internet to the client computer. The sensor transmits the sensed physiological signals to the server to process, calculate, analyze, and store. By means of psychological signal data processing, the client computer further calculates and analyzes the psychological signal data stored in the server and allows an authorized reader to read the result. With the household sensor working with the server connecting to Internet, the system may be available in daily life at home to monitor the sleeping quality of the person under test with long hours. | 03-12-2009 |
Chih-Ming Chiang, Zhudong Township TW
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20130133193 | SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PACKAGE PROCESS AND STENCIL USED THEREWITH - The invention provides a surface mount technology process for an advanced quad flat no-lead package process and a stencil used therewith. The surface mount technology process for an advanced quad flat no-lead package includes providing a printed circuit board. A stencil with first openings is mounted over the printed circuit board. A solder paste is printed passing the first openings to form first solder paste patterns. The stencil is taken off. A component placement process is performed to place the advanced quad flat no-lead package comprising a die pad on the printed circuit board, wherein the first solder paste patterns contact a lower surface of the die pad, and an area ratio of the first openings to the lower surface of the die pad is between 1:2 and 1:10. A reflow process is performed to melt the first solder paste patterns to surround a sidewall of the die pad. | 05-30-2013 |
Chih-Ming Chien, New Taipei TW
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20120058655 | ELECTRICAL CONNECTOR WITH IMPROVED IMPEDANCE CONTINUITY - An electrical connector ( | 03-08-2012 |
20120058680 | ELECTRICAL CONNECTOR WITH IMPROVED SIGNAL TRANSMITTING PERFORMANCE - An electrical connector ( | 03-08-2012 |
20120308188 | OPTICAL BACKPLANE ASSEMBLY - An optical backplane assembly ( | 12-06-2012 |
Chih-Ming Chuang, Taichung City 412 TW
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20140051006 | METAL SUPPORTED SOLID OXIDE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - Metal supported solid oxide fuel cells produced by high voltage medium current tri-gas atmospheric plasma spraying are revealed. These fuel cells have better electrical properties, better redox stability, better durability and higher thermal conductivity due to the metal support. Moreover, nano structure of an anode interlayer and nano structure of a cathode interlayer have more three-phase boundaries (TPB) so that performance of the solid oxide fuel cell is improved and the working temperature of the solid oxide fuel cell is reduced. The shape of the solid oxide fuel cell is planar or tubular. | 02-20-2014 |
Chih-Ming Chung, Kaohsiung County TW
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20090278242 | STACKED TYPE CHIP PACKAGE STRUCTURE - A stacked type chip package structure including a lead frame, a chip package, a second chip, and a second molding compound is provided. The lead frame includes a plurality of first leads and second leads insulated from one another. The first leads have a first upper surface, and the second leads have a second upper surface which is not co-planar with the first upper surface. The chip package is disposed on the first leads and includes a substrate, a first chip, and a first molding compound. The second chip is stacked on the chip package and electrically connected to the second leads. The second molding compound is disposed on the lead frame and filled among the first leads and the second leads for encapsulating the chip package and the second chip. | 11-12-2009 |
20090278243 | STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A stacked type chip package structure including a chip carrier, a first chip, a second chip, a third chip, and an insulating material is provided. The chip carrier includes two die pads and a plurality of leads surrounding the die pads. The first chip and the second chip are disposed on the die pads respectively, and are electrically connected to the leads by wire bonding. The third chip traverses the first chip and the second chip, and is electrically connected to the first chip and the second chip respectively. The insulating material is disposed on the chip carrier for encapsulating the first chip, the second chip and the third chip, and fills among the die pads and the leads. | 11-12-2009 |
20100213598 | CIRCUIT CARRIER AND SEMICONDUCTOR PACKAGE USING THE SAME - A circuit carrier suitable for being connected with a bump is provided. The circuit carrier includes a substrate and at least one bonding pad. The substrate has a bonding pad disposed on a surface thereof for being connected with the bump. A brown-oxide layer is disposed on a surface of the bonding pad. | 08-26-2010 |
20120032341 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor element, a package body and a conductive part. The substrate has an electrical contact. The semiconductor element is disposed on the substrate. The package body covers the semiconductor element and defines a through hole from which the electrical contact is exposed. Wherein, the package body includes a resin body and a plurality of fiber layers. The fiber layers are disposed in the resin body and define a plurality of fiber apertures which is arranged as an array. The conductive part is electrically connected to the substrate through the through hole. | 02-09-2012 |
20140011325 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a substrate, a semiconductor element, a package body and a conductive part. The substrate has an electrical contact. The semiconductor element is disposed on the substrate. The package body covers the semiconductor element and defines a through hole from which the electrical contact is exposed. Wherein, the package body includes a resin body and a plurality of fiber layers. The fiber layers are disposed in the resin body and define a plurality of fiber apertures which is arranged as an array. The conductive part is electrically connected to the substrate through the through hole. | 01-09-2014 |
Chih-Ming Chung, Miaoli TW
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20140026618 | FORMING MOLD AND RELATED FORMING DEVICE AND FORMING METHOD USING SAME - A forming mold made from a polyporous refractory material is provided for forming a glass piece. The forming mold includes an outer surface and a plurality of forming structures provided on the outer surface. Each of the forming structures includes a forming surface matching with a shape of the glass piece. The forming mold is structured and arranged to be pumped down from the outer surface to generated an absorption force on molten glass material provided at the at least one forming surface for sucking the molten glass material on the forming structure to form the glass piece. | 01-30-2014 |
Chih-Ming Chung, Dashe Township TW
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20090267210 | INTEGRATED CIRCUIT PACKAGE AND MANUFACTURING METHOD THEREOF - An integrated circuit package and a manufacturing method thereof are provided. The package includes a die pad, a plurality of first and second contact pads, a first die, a second die and a molding compound. The contact pads adjacent to at least one side of the die pad are arranged along an inner row and an outer row with respect to the die pad. The first die is fixed on the first die and electrically connected to the first contact pads by wire-bonding. The second die is fixed on the first die and electrically connected to the second contact pads by wire-bonding. The molding compound covers the second die, the first die, the die pad, the first contact pads and the second contact pads. The bottoms of the die pad, the first contact pads and the second contact pads are exposed at the bottom surface of the molding compound. | 10-29-2009 |
Chih-Ming Chung, Cupertino, CA US
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20140048957 | THIN SUBSTRATE PoP STRUCTURE - A PoP (package-on-package) package includes a bottom package with a substrate encapsulated in an encapsulant with a die coupled to the top of the substrate. At least a portion of the die is exposed above the encapsulant on the bottom package substrate. A top package includes a substrate with encapsulant on both the frontside and the backside of the substrate. The backside of the top package substrate is coupled to the topside of the bottom package substrate with at least part of the die being located in a recess in the encapsulant on the backside of the top package substrate. | 02-20-2014 |
20140084487 | PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES - A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages. | 03-27-2014 |
20140210111 | EMBEDDED PACKAGE ON PACKAGE SYSTEMS - In some embodiments, a semiconductor device package assembly may include a substrate. The substrate may include a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the substrate. The second surface may include a die electrically coupled to the second surface. In some embodiments, the semiconductor device package may include an electrically insulating material covering at least a portion of the second surface and the die. The electrically insulating material may include a dielectric polymer. The dielectric polymer may function to inhibit deformation of the package during use. The dielectric polymer may include a coefficient of thermal expansion of between about 5 to about 15 ppm/° C. The dielectric polymer may include a modulus of between about 15 to about 25 Gpa. | 07-31-2014 |
20150118795 | PoP STRUCTURE WITH ELECTRICALLY INSULATING MATERIAL BETWEEN PACKAGES - A PoP (package-on-package) package includes a bottom package coupled to a top package. Terminals on the top of the bottom package are coupled to terminals on the bottom of the top package with an electrically insulating material located between the upper surface of the bottom package and the lower surface of the top package. The bottom package and the top package are coupled during a process that applies force to bring the packages together while heating the packages. | 04-30-2015 |
20150255366 | EMBEDDED SYSTEM IN PACKAGE - In some embodiments, a system and/or method may include forming a semiconductor device package assembly. The method may include forming a substrate including a first surface and a second surface substantially opposite the first surface. The substrate may include an opening in the second surface. The first surface may include a first set of electrical conductors. The method may include positioning a first die in the opening. The first die may include a second set of electrical conductors. The method may include forming a third set of electrical conductors on a second die. The third set of conductors may include a first width and a first height. The method may include forming a fourth set of electrical conductors on the second die. The fourth set of conductors may include a second width and a second height. The second width may be less than the first width. The second height may be greater than the first height. | 09-10-2015 |
Chih-Ming Ho, Los Angeles, CA US
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20150356269 | RAPID IDENTIFICATION OF OPTIMIZED COMBINATIONS OF INPUT PARAMETERS FOR A COMPLEX SYSTEM - Multiple tests of a complex system are conducted by applying varying combinations of input parameters from a pool of input parameters. Results of the tests are fitted into a model of the complex system by using multi-dimensional fitting. Using the model of the complex system, identification is made of at least one optimized combination of input parameters to yield a desired response of the complex system. | 12-10-2015 |
Chih-Ming Ho, Brentwood, CA US
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20090075360 | APPARATUS AND METHODS FOR MANIPULATION AND OPTIMIZATION OF BIOLOGICAL SYSTEMS - The invention provides systems and methods for manipulating, e.g., optimizing and controlling, biological systems, e.g., for eliciting a more desired biological response of biological sample, such as a tissue, organ, and/or a cell. In one aspect, systems and methods of the invention operate by efficiently searching through a large parametric space of stimuli and system parameters to manipulate, control, and optimize the response of biological samples sustained in the system, e.g., a bioreactor. In alternative aspects, systems include a device for sustaining cells or tissue samples, one or more actuators for stimulating the samples via biochemical, electromagnetic, thermal, mechanical, and/or optical stimulation, one or more sensors for measuring a biological response signal of the samples resulting from the stimulation of the sample. In one aspect, the systems and methods of the invention use at least one optimization algorithm to modify the actuator's control inputs for stimulation, responsive to the sensor's output of response signals. The compositions and methods of the invention can be used, e.g., to for systems optimization of any biological manufacturing or experimental system, e.g., bioreactors for proteins, e.g., therapeutic proteins, polypeptides or peptides for vaccines, and the like, small molecules (e.g., antibiotics), polysaccharides, lipids, and the like. Another use of the apparatus and methods includes combination drug therapy, e.g. optimal drug cocktail, directed cell proliferations and differentiations, e.g. in tissue engineering, e.g. neural progenitor cells differentiation, and discovery of key parameters in complex biological systems. | 03-19-2009 |
20130130360 | APPARATUS AND METHODS FOR MANIPULATION AND OPTIMIZATION OF BIOLOGICAL SYSTEMS - The invention provides systems and methods for manipulating biological systems, for example to elicit a more desired biological response from a biological sample, such as a tissue, organ, and/or a cell. In one aspect, the invention operates by efficiently searching through a large parametric space of stimuli and system parameters to manipulate, control, and optimize the response of biological samples sustained in the system In one aspect, the systems and methods of the invention use at least one optimization algorithm to modify the actuator's control inputs for stimulation, responsive to the sensor's output of response signals. The invention can be used, e.g., to optimize any biological system, e.g., bioreactors for proteins, and the like, small molecules, polysaccharides, lipids, and the like. Another use of the apparatus and methods includes is for the discovery of key parameters in complex biological systems. | 05-23-2013 |
20140309974 | OPTIMIZATION OF INPUT PARAMETERS OF A COMPLEX SYSTEM BASED ON MULTIPLE CRITERIA - A method of combinatorial optimization includes: (1) defining an objective function to optimize a combination of N input parameters of a complex system, wherein the objective function includes a weighted sum of n different optimization criteria, N≧2, and n≧2; (2) applying an initial combination of the N input parameters to the complex system to yield an initial output response; (3) executing an optimization procedure to generate an updated combination of the N input parameters, wherein executing the optimization procedure includes calculating an initial value of the objective function based on at least one of (a) the initial combination of the N input parameters and (b) the initial output response; and (4) applying the updated combination of the N input parameters to the complex system to yield an updated output response. | 10-16-2014 |
20140363805 | APPARATUS AND METHODS FOR MANIPULATION AND OPTIMIZATION OF BIOLOGICAL SYSTEMS - A method for optimization of a response of a biological system includes: (1) obtaining measurements of a biological system in response to varying concentrations of drugs in a drug combination; (2) fitting the measurements into a model of the biological system; and (3) using the model of the biological system, predicting concentrations of the drugs in the drug combination to yield an optimized response of the biological system. | 12-11-2014 |
Chih-Ming Hsu, Douliu TW
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20080261789 | Rotatable Swissball AB Trainer - The present invention provides fitness sit-up chair, which is typically comprised of a frame and an exercise ball, wherein said frame is constructed of a support and a triangle stand, said exercise ball is mounted on the foldable triangle stand. The AB trainer has easy exercising, easy folding, occupying small volume features, meanwhile facilitates to packaging, transporting and storing. | 10-23-2008 |
Chih-Ming Hsu, Yulin TW
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20100069800 | MASSAGE DEVICE - A massage device includes an outer casing, a control circuit, a power mechanism, a transmission mechanism, a big rotary disc, a small rotary disc, a massage ball, a big lid, and a small lid. The control circular is disposed in the outer casing. The outer casing has a massage surface and an installation trough. The power mechanism, the transmission mechanism, the big rotary disc and the small rotary disc are disposed in the installation trough. The power mechanism is electrically connected to the control circuit via an electric wire and controlled by the control circuit to operate. The power mechanism brings the big rotary disc and the small rotary disc to spin, respectively, through the transmission mechanism. The small rotary disc has a central shaft secured on the big rotary disc. The small rotary disc is formed with a ball aperture. The massage ball is disposed in the ball aperture. The big lid and the small lid cover the big rotary disc and the small rotary disc. The big lid has a big hole corresponding in position to the small rotary disc. The small lid has a small hole corresponding in position to the massage ball. The small hole has a diameter smaller than that of the massage ball. The massage ball has a portion exposed out of the small hole. | 03-18-2010 |
Chih-Ming Hsu, Taipei TW
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20130215036 | KEYBOARD DEVICE - The present invention discloses a keyboard device including a plurality of first number key, a shift key, a plurality of second number key and a control unit. When the control unit receives a shift key code generated by the shift key and a first number key code generated by the first number key, the control unit outputs a special symbol signal corresponding to the first number key code. When the control unit receives the first number key code or a second number key code generated by the second number key, the control unit outputs a number signal corresponding to the first number key code. When the control unit receives the shift key code and the second number key code, the control unit outputs a cutoff signal, such that a computer system stops executing commands. | 08-22-2013 |
20140314396 | ELECTROTHERMAL ELEMENT - The present invention proposes an electrothermal element which comprises a substrate, a reflective layer, an electrothermal layer, and an auxiliary layer. The electrothermal layer can emit infrared radiation which is reflected by the reflective layer and enable infrared radiation emitted from one side of the electrothermal element. The auxiliary layer can increase the thermal uniformity of the electrothermal element and also convert the thermal energy of the electrothermal element itself into infrared radiation. It not only improves overall infrared emissivity of the electrothermal element but also reduces the temperature of the electrothermal element. This invention offers an effectively and rapidly warming up solution at selected local regions, no oxygen consumption and fan noise problems, and the electrothermal element can replace the traditional ceiling or be mounted directly on the wall, to solve the disadvantage of requiring space of the conventional electric heating device. | 10-23-2014 |
20140355968 | ELECTROTHERMAL SYSTEM - The present invention relates to an electrothermal system which comprises at least one electrothermal equipment used to emit infrared radiation, a control unit used to control the operation of the electrothermal equipments. By using the control unit, some specified electrothermal equipments can be enabled to heat up some specified regions while the other electrothermal equipments will not operate. The present invention can reduce power consumption for only heating up demanded local regions and improving efficiency of electricity utilization. | 12-04-2014 |
Chih-Ming Hsu, Taoyuan County TW
Chih-Ming Hsu, New Taipei City TW
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20130109233 | USB FEMALE CONNECTOR | 05-02-2013 |
20130130521 | USB FEMALE CONNECTOR - The USB female connector contains an insulating base and a shielding casing enclosing the insulating base. On the insulating base, there is mainly a ground terminal having a flat ground contact section at an end on the insulating base. From the ground contact section, the ground terminal is extended away from the insulating base and forked into a first ground extension section, a second ground extension section, and a third ground extension section. Through the forked first, second, and third ground extension sections, the high-frequency crosstalk problem is effectively resolved. | 05-23-2013 |
20130217272 | USB 3.0 TWO-WAY SOCKET JACK CONNECTOR STRUCTURE - A USB 3.0 socket jack connector structure allows a USB plug connector to conduct working when it is plugged in the jack connector of the present invention positively or oppositely through a two-war sharing grounding transmission conductor, and a first signal transmission conductor, second signal transmission conductor, first differential signal transmission conductor, second differential signal transmission conductor, third grounding transmission conductor, third differential signal transmission conductor, fourth differential signal transmission conductor, first power supply transmission conductor, third signal transmission conductor, fourth signal transmission conductor, second power supply transmission conductor, fourth grounding transmission conductor, fifth differential signal transmission conductor, sixth differential signal transmission conductor, seventh differential signal transmission conductor and eighth differential signal transmission conductor. | 08-22-2013 |
20130307798 | Planar Touch Panel with Single Substrate - A planar touch panel is provided. The planar touch panel includes a substrate and a plurality of periphery structures. The substrate has a plurality of transparent conductive patterns, and each of the transparent conductive patterns has a first end and a second end. The width of the first end is smaller than the width of the second end. The periphery structures are disposed adjacent to the first ends of the transparent conductive patterns, and each of the periphery structures has a first conductive layer and a decoration layer. The first conductive layer is disposed on the substrate and extends toward the first end to cover the first end. The decoration layer is disposed on the substrate and the first conductive layer. The decoration layer extends toward the first conductive layer, and is formed with an opening hole on the first conductive layer. | 11-21-2013 |
20140054978 | ELECTRONIC DEVICE AND ELECTRONIC SYSTEM AND OPERATION METHODS THEREOF - An embodiment of the disclosure provides an electronic device including a power supply, an optical to electrical converter and a controller. The power supply outputs a first electric power. The optical to electrical converter receives an infrared light beam and converts the infrared light beam to a second electric power. The controller is coupled to the power supply and the optical to electrical converter. The controller operates in a first mode and a second mode. When the controller operates in the first mode, the controller is activated by the second electric power and after the controller is activated, the controller operates in the second mode and drives the power supply. Then, the controller receives the first electric power and stops receiving the first electric power for operation. | 02-27-2014 |
20140080332 | USB PLUG CONNECTOR STRUCTURE - A USB plug connector structure can use the same set of terminals to apply on different USB connector patterns, such as plate edge connector or wire edge connector, through the design of various soldering portions and base portions being positioned on the same plane. Furthermore, the common mode signals generated from first and second differential signal transmission conductor sets can be restrained by means of first and second grounding base portions of a grounding transmission conductor surrounding first and second differential signal transmission conduct sets. In addition, crosstalk interference generated from the first and second differential signal transmission conductor sets to a signal transmission conductor set can be similarly isolated through the first and second grounding base portions. Furthermore, a bended angle of each bended portion ranges from 120 to 150 degrees, thereby guide scattered radio frequency interference. | 03-20-2014 |
20140127942 | APPLICATION STRUCTURE FOR ELECTRIC WAVE EFFECT OF TRANSMISSION CONDUCTOR - An application structure for an electric wave effect of transmission conductor solves a high frequency crosswalk problem through the following structures. The applicature structure includes at least one transmission conductor, and the application structure includes a first differential signal transmission conductor set, first signal transmission conductor set, second differential signal transmission conductor set, first ground transmission conductor, third differential signal transmission conductor set, second signal transmission conductor set, fourth differential signal transmission conductor set, first power source transmission conductor, second power transmission conductor and second ground transmission conductor. Whereby, the suppression of common mode signals, and the guiding-to-scatter suppression of radio wave interference (RFI), electromagnetic wave interference (EMI), crosstalk and electrostatic discharge (ESD) can be achieved between each two differential signal conductors through the first and second ground transmission conductors depending on the structure components mentioned above. | 05-08-2014 |
20150163590 | AUDIO OUTPUT DEVICE CAPABLE OF SWITCHING A SOUND FIELD - An audio output device includes a housing, a speaker, a switching unit, a fixing component and a control unit. An opening is formed on the housing. The speaker is for outputting sound. The switching unit is installed inside the housing. The fixing component is fixed in the opening of the housing for triggering the switching unit so that the switching unit outputs a switching signal. The control unit is electrically connected to the switching unit and the speaker, and the control unit controls the speaker to output sound in a corresponding sound field as the control unit receives the switching signal. | 06-11-2015 |
Chih-Ming Hu, Taoyuan Hsien TW
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20090039998 | Transformer structure - The present invention is related to an improved transformer structure including a main body and, accommodated in the main body, a first winding frame and two winding frames. Hollow portions of the first winding frame and each of the second winding frames are combined with openings on the main body, for forming a primary side passage in a longitudinal direction and two secondary side passages in a lateral direction, so as to penetrate respectively a first magnetic material into the primary side passage and a second magnetic material into the two secondary side passages. Through the longitudinal primary side passage and the lateral secondary side passages, the primary and the secondary side winding can have a proper interval therebetween for achieving a stable output, so that a high voltage can be directly applied to the transformer for driving the large size LCD back light module for improving the efficiency. | 02-12-2009 |
Chih-Ming Hu, Jhongli City TW
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20100165649 | Automobile Lamp - An automobile lamp includes a light emitting element used as an initial light source, a light guide element for calculating a divergence angle and a light emitting area of the divergence angle of the initial light source, and a lens element to enhance a light extraction efficiency of the light emitting element and produce a light source with a predetermined light pattern and a high light extraction efficiency. A projecting element is used for enhancing the contrast of the light pattern of the light source, so that the automobile lamp can project a high-contrast cutoff line. A light emitting surface of the light emitting element is designed with a predetermined shape, such that no other optical component is required for projecting a light beam with a cross-section of a predetermined shape, so as to enhance a light energy utilization efficiency of the automobile lamp effectively. | 07-01-2010 |
20150345042 | METHOD OF MANUFACTURING MICROSTRUCTURES OF METAL LINES - A method of manufacturing a metal line microstructure is provided. Firstly, a substrate is provided. Then, a seed layer is formed on a surface of the substrate. Then, a photoresist layer is formed on a surface of the seed layer, and a photolithography and etching process is performed to form a trench in the photoresist layer, wherein the trench has a specified width. Then, an electroplating process is performed to fill a conductive layer into the trench. Afterwards, the photoresist layer and a portion of the seed layer uncovered by the conductive layer are removed, so that the metal line microstructure is produced. | 12-03-2015 |
Chih-Ming Hu, Kaohsiung TW
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20100040869 | TRANSPARENT CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME - The disclosed is a transparent conductive film and method for manufacturing the same. First, a substrate is provided. Subsequently, an inorganic layer composed of nano-inorganic compound is formed overlying the substrate. A carbon nanotube dispersion is then coated on the inorganic layer and dried to form a carbon nanotube conductive layer. | 02-18-2010 |
Chih-Ming Kao, Jhubei City TW
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20150061082 | CONTACT PLUG AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a contact plug is provided. The method includes providing a silicon substrate having at least one opening. A titanium layer is conformably formed in the opening. A first barrier layer is conformably formed on the titanium layer in the opening. A rapid thermal process is performed on the titanium layer and the first barrier layer. After performing the rapid thermal process, a second barrier layer is conformably formed on the first barrier layer in the opening. | 03-05-2015 |
Chih-Ming Kuo, Chu-Pei City TW
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20100014353 | FLASH MEMORY DEVICE WITH SWITCHING INPUT/OUTPUT STRUCTURE - In a flash memory device with switching I/O structure for applying in flash memory products, depending on actual need for input and/or output pins, other pins may be flexibly switched to input, output, or bi-directional pins through software and/or hardware and/or CAM access. Therefore, data input and/or output rate may be changed through switching the I/O structure. Moreover, after the I/O configuration, the switched other pins may start data input/output immediately after the flash memory is started to operate, without the need of waiting for several input/output phases. | 01-21-2010 |
Chih-Ming Kuo, Xinfeng Township TW
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20120208129 | PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DEVICE - A process for forming an anti-oxidant metal layer on an electronic device comprises the steps of providing a substrate; forming a conductive metal layer on the substrate; forming a first photoresist layer on the conductive metal layer; patterning the first photoresist layer to form apertures and first grooves; forming a connecting member having a top surface and a lateral surface in the aperture and the first groove; removing the first photoresist layer to reveal the top surface and the lateral surface; forming a second photoresist layer on the conductive metal layer; patterning the second photoresist layer to form apertures and second grooves; forming an anti-oxidant metal layer in aperture and second groove, the anti-oxidant metal layer covers the top surface and the lateral surface of the connecting member; and removing the second photoresist layer to reveal the anti-oxidant metal layer and the conductive metal layer. | 08-16-2012 |
20120211257 | PYRAMID BUMP STRUCTURE - A pyramid bump structure for electrically coupling to a bond pad on a carrier comprises a conductive block disposed at the bond pad and an oblique pyramid insulation layer covered at one side of the conductive block. The oblique pyramid insulation layer comprises a bottom portion and a top portion, and outer diameter of the oblique pyramid insulation layer is tapered from the bottom portion to the top portion. When the carrier is connected with a substrate and an anisotropic conductive film disposed at the substrate, the pyramid bump structure may rapidly embed into the anisotropic conductive film to raise the flow rate of the anisotropic conductive film. Further, a short phenomenon between adjacent bumps can be avoided to raise the yield rate of package process. | 08-23-2012 |
20130002387 | METHOD FOR FABRICATING A CARRIER WITH A THREE DIMENSIONAL INDUCTOR AND STRUCTURE THEREOF - A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots. | 01-03-2013 |
Chih-Ming Kuo, Changhua County TW
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20110032386 | IMAGE CAPTURING SYSTEM AND SENSING MODULE - An image capturing system and a sensing module are provided. The image capturing system includes a lens module, an image sensing element, and an adjustment element. The lens module is used for converging light of an object to an imaging surface. The image sensing element has a receiving surface for receiving the light of the object to form an image. The adjustment element is connected to the image sensing element and used for adjusting a curvature value of the receiving surface, so that the receiving surface matches the imaging surface. | 02-10-2011 |
Chih-Ming Lee, Tainan City TW
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20140001529 | Silicide Process Using OD Spacers | 01-02-2014 |
20140015031 | Apparatus and Method for Memory Device - An apparatus comprises a gate stack formed over a substrate, wherein the gate stack comprises a first gate structure, wherein a first dielectric layer is formed between the first gate structure and the substrate and a second gate structure stacked on the first gate structure, wherein a second dielectric layer is formed between the first gate structure and the second gate structure. The apparatus further comprises a first drain/source region and a first recess formed between a top surface of the first drain/source region and the second dielectric layer. | 01-16-2014 |
20150221752 | Apparatus and Method for Memory Device - A method comprises forming a gate stack over a substrate, applying an oxygen flush process to the gate stack, forming a uniform oxide layer on the gate stack as a result of performing the step of applying the oxygen flush process and removing the uniform oxide layer through a pre-clean process. | 08-06-2015 |
Chih-Ming Lee, Xinzhuang City TW
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20100003927 | APPARATUS AND METHOD FOR POWER-SAVING AND WAKE-UP - Disclosed is an apparatus and method of power-saving and wake-up, which is not only used to reduce the power consumption of a system of electronic equipment, but also allow the system to immediately return to normal operation according to the requirement. The apparatus for power-saving and wake-up includes a first detector, a second detector, a decoder and a third detector. The method for power-saving and wake-up includes detecting a cable signal, a clock pair signal and a differential pair signal. When one of the detected signals is unusual, the system soon turns off the unusual channel power and implement the procedures for power saving and operates under the power saving mode, which can realize the effect of power saving and low power consumption. The method for power-saving and wake-up includes detecting the cable signal, the toggling and frequency of the clock signal and the synchronizing signals of the system. | 01-07-2010 |
Chih-Ming Liang, Miaoli County TW
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20140118676 | DISPLAY DEVICE AND DISPLAY APPARATUS - A display device includes a first substrate, a second substrate, a space layer, and a protective film. The first substrate has a first surface, and the second substrate comprises a visible region and a non-visible region. The second substrate has a second surface, and the second surface is opposite to the first surface. The space layer includes a plurality of spacers and at least one space component. The spacers are located on the visible region, and the space component is located in the non-visible region. The protective film has water vapor barrier property. The protective film covers the space component, and forms at least one barrier wall. The barrier wall touches the first surface and the second surface. | 05-01-2014 |
Chih-Ming Liang, Miao-Li County TW
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20130148062 | FILTER LAYER SUBSTRATE AND DISPLAY APPARATUS - A filter layer substrate comprises a substrate, a black matrix layer, a filter layer, a protection layer, a first photoresist spacer, and a second photoresist spacer. The black matrix layer is disposed on the substrate. The filter layer covers the substrate and the black matrix layer. The protection layer is disposed on the filter layer. The first photoresist spacer is disposed on the protection layer corresponding to the black matrix layer. The second photoresist spacer is disposed on the protection layer corresponding to the black matrix layer. A bottom surface of the first photoresist spacer and a bottom surface of the second photoresist spacer have a height difference. A display apparatus containing the filter layer substrate is also disclosed. Accordingly, the liquid crystal margin of the LC filling can be enlarged, and the problems caused by the stress and the external collision or vibration can be avoided. | 06-13-2013 |
20140145162 | Touch OLED Display Panel and Display Device Comprising the Same - A touch organic light-emitting diode (OLED) display panel and a display device comprising the same are disclosed. The touch OLED display panel comprises: a thin film transistor (TFT) substrate; an OLED layer disposed on the TFT substrate; a substrate disposed on the OLED layer; a sensor layer disposed on the substrate; an optical functional layer having a transmittance of 50% to 80%; and a cover plate, wherein the optical functional film is disposed on a surface of the cover plate. | 05-29-2014 |
Chih-Ming Liao, Hsin Chu City TW
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20090231045 | FREQUENCY-LOCKING DEVICE AND FREQUENCY-LOCKING METHOD THEREOF - A frequency-locking device including a digitally-controlled oscillator (DCO) and a comparing unit is disclosed. The DCO is used for generating an output frequency signal. The comparing unit receives a Keep Alive signal or a start of a frame (SOF) from a universal serial bus (USB) and the output frequency signal, and compares the Keep Alive signal or the start of a frame (SOF) with the output frequency signal to generate a calibration signal. Then, the DCO adjusts the frequency of the output frequency signal according to the calibration signal to meet the USB specification for data communication. | 09-17-2009 |
Chih-Ming Liao, Taoyuan TW
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20110134434 | METHOD AND SYSTEM FOR POSITIONING BY USING OPTICAL SPECKLE - A method and system for positioning by using optical speckle are disclosed in this invention. A highly coherent laser light irradiates a positioning template in advance to record optical speckles caused by interference by scattered light beams from the positioning template for establishing a speckle database. Furthermore, a reference point is defined to position each recorded speckle. Therefore, a coordinate with respect to the reference point corresponding to a specified speckle can be used to position a target or applied to distance measurement by the speckle database. The precision of the speckles according to the present invention is within several micrometers. Hence, it can provide high precision positioning. | 06-09-2011 |
20110141014 | MOVABLE TOUCHPAD WITH HIGH SENSITIVITY - A highly sensitive movable touchpad is disclosed in the present invention. It is used for laptop computers and has a slidable template for users to move so that a cursor can be controlled by the touchpad. A resistive or capacitive detecting surface can be applied for detecting users' click, double click, drag, or scroll motion on any point of the surface. Additionally, there is an optical displacement sensor provided under the slidable template for detecting surface information on the back surface of the slidable template. A sequence of images of surface movement are processed by an image processing unit. Then, relative movement information is calculated and sent to an operating system in the computer. The operating system controls the cursor with the relative movement information. The present invention uses edge detectors for dynamically controlling the cursor and calibrating location of the cursor so that positioning of the touchpad is synchronous with the cursor. | 06-16-2011 |
20120170259 | FLAT TUBULARLAMP - A flat fluorescent lamp which includes: a long rectangular shaped light guiding panel, a light-emitting module, a light guiding body, a reflective layer, and at least one light-emitting diode. The light guiding body seamlessly connects between an end surface of the light guiding panel and the light-emitting module. The reflective layer is located exterior of the light guiding panel. A Coupling head is installed on the side of the light-emitting module that is away from the light guiding panel, and the coupling head is connected to the light-emitting module. Thereby, an energy efficient fluorescent lamp that can be thinner and installed on general lamp socket is provided. | 07-05-2012 |
20120236597 | LAMP AND FRAME MODULE THEREOF - A frame module includes a frame strip, a light emitting diode (LED) bar, and a fastener. The frame strip has a heat-dissipating portion, two elastic arms extended in one direction from the two edges of the heat-dissipating portion, and two pressing portions inwardly protruded form the two elastic arms. The heat-dissipating portion, the two elastic arms, and the two pressing portions define an accommodating trough. The LED bar has a printed circuit board (PCB) and a plurality of LEDs mounted on the PCB. The PCB is arranged in the accommodating trough of the frame strip and clamped between the heat-dissipating portion and the two pressing portions. The fastener is fixed on the two elastic arms. Thus, the heat generated form the LED bar is conducted by the LED bar directly contacting the frame strip. Besides, the instant disclosure also provides a lamp. | 09-20-2012 |
20120320591 | LIGHT BULB - The instant disclosure relates to a light bulb, which includes a base, a conducting cap arranged on one end of the base, a heat-dissipating member disposed on the opposite end of the base, and a lamp cover. The heat-dissipating member has a wedged structure, and a plurality of inclined surfaces are formed adjacently thereon. A plurality of LEDs is disposed on the inclined surfaces, and the lamp cover is arranged over the wedged structure and the LEDs. The instant disclosure uses the LEDs to replace tungsten filament as the light sources, and arranging the LEDs on the wedged structure of the heat-dissipating member. Thereby, the light bulb can have higher heat-dissipating rate. | 12-20-2012 |
20130107570 | LED LAMP | 05-02-2013 |
20130128608 | LED LIGHT FIXTURE - The instant disclosure relates to a LED light fixture, which includes a mounting seat, a lighting module, a light guiding assembly, a retainer, and a panel. The mounting seat has a base and an annular side wall cooperatively defining a recess. The lighting module abuts the side wall and is disposed around the light guiding assembly. The retainer abuts the light guiding assembly and retains the light guiding assembly on the mounting seat. The panel is disposed between the light guiding assembly and the base, with the periphery of the panel abutting the engaging shafts. Thereby, the interaction between the retainer and the mounting seat enables the user to assemble or dismantle the light fixture with more ease. | 05-23-2013 |
20150160043 | High-Precision Angle Positioning Device - The present invention proposes a high-precision angle positioning device. To complete a high-precision angle positioning operation, the high-precision angle positioning device firstly uses a non-deformable laser-speckles image-acquiring unit to acquire N non-deformable laser-speckles images from a rotary disk unit, and then defines N coordinated non-deformable laser-speckles images and N coordinated angles through an angle calibrating unit and an angle recognizing and positioning unit; therefore, after finding an i-th coordinated non-deformable laser-speckles image having the largest overlapping area with an immediate non-deformable laser-speckles image through image comparison, an immediate image plane displacement between the immediate non-deformable laser-speckles image and the i-th coordinated non-deformable laser-speckles image can be calculated for calculating immediate sub-coordinated angle of immediate non-deformable laser-speckles image, such that an immediate angle coordinate for the immediate non-deformable laser-speckles image can be calculated through an i-th coordinated angle of the i-th coordinated non-deformable laser-speckles image and the immediate sub-coordinated angle. | 06-11-2015 |
Chih-Ming Liao, Yun-Lin County TW
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20090238842 | Vaccine for preventing and treating porcine progressive atrophic rhinitis - The present invention relates to an animal vaccine directed to progressive atrophic rhinitis (PAR), comprising at least two fragments of recombinant subunit | 09-24-2009 |
Chih-Ming Liu, Taipei TW
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20100276214 | Tablet of battery-free wireless pointing device - A tablet of a battery-free wireless pointing device has a battery-free wireless pointing device and a tablet. The wireless pointing device includes a power supply circuit and a sensing circuit. The tablet includes a signal processing unit, a first antenna loop, and a second antenna loop. The sensing circuit receives electric energy generated by the power supply and generates a sensing signal. The second antenna loop receives the sensing signal. The signal processing circuit generates a frequency signal and determines a current coordinate position of the pointing device according to the sensing signal. | 11-04-2010 |
Chih-Ming Peng, Taoyuan City TW
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20100213335 | SWIVELABLE FIXING SEAT - The present invention discloses a swivelable fixing seat, which comprises the casing sleeves the seat body. The seat body has at least one elastic element and a guide slot. Compressing the elastic element makes the accommodation base and the two movable clamp members retract into or protrude from the casing, whereby the unused fixing seat occupies less space. The casing has a shaft thereinside. A screw fastens the shaft to the seat body, and another screw penetrates the guide slot and fastens to a screw stud of the seat body. Rotating the shaft drives the screw to slide in the guide slot to guide the rotation of the electronic device. Then, the electronic device is positioned at a specified angle. | 08-26-2010 |
20100226521 | Embedded Sound Box - The present invention discloses an embedded sound box including a box body and a front panel, and the box body has a fixing plate and at least one spring plate at an end and at least one slide wedge at another end. When the sound box is installed, an end of the fixing plate having the spring plate of the box body is latched into an opening hole, and a slide wedge is retracted towards the interior of the box body, and another end of the fixing plate corresponding to the box body is installed into the opening hole, and finally the slide wedge is protruded out from the box body, such that the box body can be embedded completely into the opening hole, and the front panel is used for covering the opening hole. | 09-09-2010 |
Chih-Ming Su, Zhubei City TW
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20140306973 | METHOD, MODULE AND ELECTRONIC APPARATUS FOR UPDATING CONTENTS TO BE DISPLAYED BEFORE TURNING ON DISPLAY DEVICE - A method for updating contents to be displayed before turning on a display device is provided. The method, applicable for an electronic apparatus including a display device, includes steps of: receiving an activation event; and tuning on the display device after the contents to be displayed are updated when the display device is turned off and the activation event is received. | 10-16-2014 |
Chih-Ming Su, Tai-Nan City TW
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20090023256 | METHOD FOR FABRICATING EMBEDDED STATIC RANDOM ACCESS MEMORY - The present invention provides a method for fabricating an embedded static random access memory, including providing a semiconductor substrate; defining a logic area and a memory cell area on the semiconductor substrate and defining at least a first conductive device area and at least a second conductive device area in the logic area and the memory cell area respectively; forming a patterned mask on the memory cell area and on the second conductive device area in the logic area and exposing the first conductive device area in the logic area; performing a first conductive ion implantation process on the exposed first conductive device area in the logic area; and removing the patterned mask. | 01-22-2009 |
Chih-Ming Teng, Zhubei City TW
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20150013727 | FLUID NOZZLE DEVICE AND METHOD FOR CLEANING A SUBSTRATE USING THE SAME - A fluid nozzle device includes: at least one fluid nozzle which includes a nozzle body having a first inner surface, a second inner surface that is opposite to and spaced apart from the first inner surface, an inner bottom surface that interconnects the first and second inner surfaces and that cooperates with the first and second inner surfaces to define a receiving space thereamong; a gas-intake tube disposed on top of the nozzle body; a liquid-intake tube formed with a liquid inlet and having at least one liquid outlet that is distal from the gas-intake tube; and a plurality of ejecting channels spaced apart from each other and disposed in the nozzle body. | 01-15-2015 |
Chih-Ming Tsai, New Taipei City TW
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20150185250 | ACTIVE PROBE POD IN LOGIC ANALYZER - An active probe pod used in a logic analyzer is disclosed. The active probe pod may be connected to the logic analyzer having a FPGA decoder and to a DUT circuit board. The active probe pod may include a LVDS differential ire component connected to the FPGA decoder and a front-end circuit board for capturing a weak signal input from the DUT circuit board. The front-end circuit board is adapted not to transmit the captured weak signal input over a long-distance signal transmission path, which helps minimize interferences with the weak signal input, while outputting a LVDS differential signal to the FPGA decoder for decoding. As the front-end circuit board is used for capturing the weak signal input, which falls within the category of one short-distance signal transmission, the signal reflection may not take place, without affecting the signal quality and/or attenuating the signal strength. | 07-02-2015 |
Chih-Ming Tsao, Miaoli City TW
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20150251132 | AIR WASHER OF MAKE-UP AIR UNIT - An air washer includes a contamination removal membrane and a nozzle rack. The contamination removal membrane purifies an outdoor air for a clean room. The nozzle rack sprays water on the contamination removal membrane. The nozzle rack includes a supply pipe, a plurality of spray pipes connecting to the supply pipe and a plurality of nozzles fixed on the spray pipes to spray the water on the contamination removal membrane. The contamination removal membrane is a cellulose paper sheet, an agglomeration ceramic pad, a stainless steel filter or the combination thereof. In addition, a make-up air unit having the air washer is also disclosed therein. | 09-10-2015 |
Chih-Ming Wu, Taipei County TW
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20090262496 | HEAT DISSIPATING STRUCTURE OF AN INDUSTRIAL COMPUTER - The present invention discloses an improved heat dissipating structure of an industrial computer, and the heat dissipating structure includes a heat dissipating module and two fixing units installed on both lateral sides of a top surface of the heat dissipating module, and the heat dissipating module includes a detachable heat dissipating fan module disposed therein, and the fixing unit is secured integrally with the heat dissipating module and the industrial computer by a plurality of fixing elements to achieve the effect of facilitating the change of a heat dissipating fan module. | 10-22-2009 |
Chih-Ming Wu, Dongguan City CN
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20130155523 | LENS AND PATTERN PRINTING AND COATING METHOD FOR MANUFACTUIRNG SAME - The invention discloses a lens, which comprises an outer surface and an inner surface, wherein a pattern outline is printed on the outer surface; and an argon gas layer, a high refractive index layer, a lower refractive index layer and a waterproof layer are evaporated at an area, outside the pattern outline, of the outer surface from inside to outside in turn. By adoption of clear patterns formed on the outer surface by the manufacturing processes and a four-layer vacuum electroplating film evaporated at an area, outside the pattern outline, of the outer surface, the coating does not block the sight and the lens is more beautiful and has the functions of radiation resistance and ultraviolet resistance. The invention also discloses a pattern printing and vacuum electroplating method which has simple and efficient processes and realizes the functions of the coated lens. | 06-20-2013 |
Chih-Ming Wu, Taoyuan County TW
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20130320361 | MULTICHIP PACKAGE STRUCTURE FOR GENERATING A SYMMETRICAL AND UNIFORM LIGHT-BLENDING SOURCE - A multichip package structure for generating a symmetrical and uniform light-blending source includes a substrate unit, a light-emitting unit and a package unit. The substrate unit includes a substrate body and at least one bridging conductive layer disposed on the top surface of the substrate body. The light-emitting unit includes at least two first light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body and at least two second light-emitting elements diagonally disposed on the substrate body and electrically connected to the substrate body. The package unit includes at least two first light-transmitting package bodies respectively covering the at least two first light-emitting elements and at least two second light-transmitting package bodies respectively covering the at least two second light-emitting elements. | 12-05-2013 |
20150049477 | LED LIGHTING DEVICE - An LED lighting device includes a circuit board, an LED die module, an LED driving component, and a translucent packaged body. The circuit board has a thermally conductive substrate, an electrically conductive layer, and two electrodes disposed on the thermally conductive substrate. The electrically conductive layer is disposed on a first surface of the thermally conductive substrate, and is electrically connected to the electrodes. The LED die module and the LED driving component are welded on the electrically conductive layer to establish an electrical connection therebetween. The packaged body is integrally formed as one body on the first surface to cover the LED die module and the LED driving component. The LED die module is packaged in the packaged body. Thus, the two electrodes are configured to electrically connect to an external power source for directly turning on the LED die module. | 02-19-2015 |
20150084072 | LED PACKAGE STRUCTURES FOR PREVENTING LATERAL LIGHT LEAKAGE AND METHOD OF MANUFACTURING THE SAME - An LED package structure for preventing lateral light leakage includes a substrate unit, a light-emitting unit, a light-transmitting unit and a light-shielding unit. The substrate unit includes a circuit substrate. The light-emitting unit includes at least one LED chip disposed on the circuit substrate and electrically connected to the circuit substrate. The light-transmitting unit includes a light-transmitting gel body disposed on the circuit substrate for enclosing the LED chip. The light-transmitting gel body has a first light-transmitting portion disposed on the circuit substrate for enclosing the LED chip and at least one second light-transmitting portion projected upwardly from the first light-transmitting portion and corresponding to the LED chip, and the second light-transmitting portion has a light output surface. The light-shielding unit includes a light-shielding gel body disposed on the circuit substrate for exposing the light output surface of the second light-transmitting portion. | 03-26-2015 |
20150146425 | LED BASE MODULE AND LED LIGHTING DEVICE - An LED base module includes a substrate and several driving units disposed on the substrate. Each driving unit includes a circuit layer, a separating wall, an LED driving component, a packaging member, and two electrodes. The circuit layer, the separating wall, and the electrodes are disposed on the substrate. A portion of the substrate corresponding to each driving unit is provided with an LED area and an electronic component area defined by the separating wall. The LED driving component is disposed on a portion of the circuit layer arranged in the electronic component area. The packaging member is formed on the electronic component area to entirely cover the LED driving component. A portion of the circuit layer arranged in the LED bonding area is used to bond to an LED chip, and the separating wall is configured to separate the LED chip and the LED driving component. | 05-28-2015 |
Chih-Ming Wu, New Taipei City TW
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20150181088 | IP CAMERA APPARATUS - An IP camera apparatus is provided. The IP camera apparatus includes a base module, a power module, a lens module, and a plurality of first functional modules. The base module is formed in a housing having a first docking side. The base module includes a control unit and a plurality of connecting ports is disposed on the first docking side. The power module is detachably mounted to the base module. The lens module is connected to the base module. The plurality of first functional modules is detachably and interchangeably mounted to the plurality of connecting ports on the first docking side of the housing. Each first functional module is formed into a first unified block. | 06-25-2015 |
20150301432 | CAMERA DEVICE - A camera device includes two independent housings and a connecting component. Each of the housing includes an encircled portion and an engaging portion. The encircled portion is disposed on an edge of the each housing, and an opening is formed on an encircled area of the encircled portion. The engaging portion is disposed on an outer surface of the encircled portion. The two encircled portions contact against each other to connect the two openings. The connecting component is movably disposed on the first encircled portion and the second encircled portion to assemble the first housing with the second housing. A second engaging portion of the connecting component is disposed on a side of the connecting component to engage with the first engaging portion. A second contacting portion of the connecting component is disposed on the other side of the connecting component to contact against the first contacting portion. | 10-22-2015 |
Chih-Ming Yang, Fongshan City TW
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20100156572 | CARRIER FOR TRANSMITTING HIGH FREQUENCY SIGNAL AND CARRIER LAYOUT METHOD THEREOF - A carrier for transmitting a high frequency signal and a carrier layout method thereof are provided. The carrier includes a substrate, conducting wires and reference planes both formed on the substrate. The carrier layout method includes defining impedance and thickness of the carrier according to the high frequency signal and defining layout parameters according to the impedance and the thickness. The layout parameters include a conducting layer formed on the conducting wires, a coplanar waveguide formed between the reference planes and the conducting wires, roughness portions formed on the conducting wires, recessed portions formed on the conducting wires, and the substrate being a high loss tangent substrate. The layout is performed according to the layout parameters defined thereabove, so as to increase loss of the high frequency signal in transmission. | 06-24-2010 |
Chih-Ming Yang, Hsinchu TW
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20090278908 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a traverse assembly frame, a spindle motor PCB and an insulating base. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating base is coupled with the frame for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 11-12-2009 |
20110219388 | Slim Optical Disc Drive - The present invention discloses a slim optical disc drive comprising a case with an upper cover and a lower cover, a disc tray for loading and unloading an optical disc, a first circuit board disposed on the lower cover, a second circuit board disposed on the disc tray, and a flexible flat cable for connecting the first circuit board and the second circuit board. The flexible flat cable comprises a fixed portion and a movable portion, and a patch is adhered to the movable portion of the flexible flat cable. The patch has a first end and a second end, and the width of the first end is larger than that of the second end. | 09-08-2011 |
20110254910 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a metallic plate, a spoke detecting device and a spindle motor PCB. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is supported on the metallic plate and having a notch such that a receptacle is defined by sidewalls of the notch and a surface of the metallic plate. The spoke detecting device is received in the receptacle such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 10-20-2011 |
20110258651 | LIGHTSCRIBE OPTICAL DISC DRIVE - An optical disc drive for marking a label side of a lightscribe disc is provided. The optical disc drive includes a spoke detecting device, a spindle motor PCB and an insulating pad. The spoke detecting device is used for detecting spoke patterns on the lightscribe disc. The spindle motor PCB is communicated with the spoke detecting device through a flexible cable. The insulating pad is coupled with the spindle motor PCB for supporting the spoke detecting device such that the spoke detecting device is separated from the lightscribe disc by a specified gap. | 10-20-2011 |
20130185741 | SLIM-TYPE OPTICAL DISC DRIVE - A slim-type optical disc drive includes a casing and a tray. A first circuit board is disposed within the casing. A second circuit board is disposed on the tray. A spring switch is disposed on the second circuit board. A first end of the spring switch is fixed on the second circuit board. A resistor is connected between the first end of the spring switch and a first power source. A second end of the spring switch is extended outside the second circuit board. In a tray-out status, the second end of the spring switch is not contacted with any object, so that a first status signal is generated. In a tray-in status, the second end of the spring switch is contacted with a conducting zone of a second power source, so that a second status signal is generated. | 07-18-2013 |
Chih-Ming Yang, Shenzhen CN
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20150208061 | THREE-DIMENSIONAL DISPLAY DEVICE - The present disclosure proposes a three-dimensional imaging device. The device includes a liquid crystal display for displaying elemental images and a lens array, and light emitted from the liquid crystal display is transmitted through the lens array, wherein, a first device capable of affecting the polarization state of the light and a phase retardation unit are arranged between the liquid crystal display and the lens array, and the light from the liquid crystal display successively passes through the first device and the phase retardation unit and then enters the lens array. The device according to the present disclosure has the advantage that the viewer can receive complete images with a resolution through the twisted nematic liquid crystal cell with high refresh rate. | 07-23-2015 |
20150253597 | METHOD FOR PRODUCING 2D/3D SWITCHABLE INTEGRAL IMAGING LIQUID CRYSTAL CELL, AND LIQUID CRYSTAL CELL - The present disclosure discloses a method for producing a 2D/3D switchable integral imaging liquid crystal cell, and a liquid crystal cell, the method comprising the following steps: 1) coating a UV adhesive layer on a lower substrate; 2) imprinting grooves on the UV adhesive layer by using an array and then UV-curing the UV adhesive layer; 3) coating a lower transparent conductive film on the cured UV adhesive layer, and planarizing the grooves; and 4) forming a liquid crystal cell with the lower substrate and an upper substrate which is coated with an upper transparent conductive film on a lower surface thereof. 2D and 3D displays are switchable in the liquid crystal cell obtained by the method of the present disclosure, thereby achieving comparable displays of 2D and 3D images through simple and convenient operations. | 09-10-2015 |
Chih-Ming Yang, Taipei City TW
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20120054976 | CONNECTING ASSEMBLY FOR WINDSHIELD WIPER - A connecting assembly ( | 03-08-2012 |
20120079669 | FIXING BASE FOR A WINDSHIELD WIPER - A fixing base ( | 04-05-2012 |
20120311808 | WINDSHIELD WIPER WITH EVEN PRESSING FORCE - A windshield wiper ( | 12-13-2012 |
20120317740 | WINDSHIELD WIPER ASSEMBLING STRUCTURE FOR PREVENTING LOOSE ATTACHMENT OF DRIVEN WIPER ARM - A windshield wiper assembling structure for preventing loose attachment of a driven wiper arm assembles the driven wiper arm having a hook arm on a windshield wiper fixing stage. The windshield wiper assembling structure includes an assembling stage and a positioning stage. The assembling stage has a through groove, an elastic blocking slice, and a first fastening groove which is formed at one side edge of the elastic blocking slice. The first fastening groove fastens on the windshield wiper fixing stage. The assembling stage has a containing groove on a top surface thereof to accommodate the hook arm. The positioning stage has a cover cap and a positioning arm which is extended from the cover cap. The positioning arm has a second fastening groove corresponding to the first fastening groove. The second fastening groove fastens on the windshield wiper fixing stage and corresponding to the first fastening groove. | 12-20-2012 |
20130007976 | WINDSHIELD WIPER COMBINING ASSEMBLY OF COMBINING DRIVEN WIPER ARM - A windshield wiper combining assembly assembles a driven wiper arm having a through shaft on a windshield wiper fixing stage. The windshield wiper combining assembly includes an assembling stage and a retaining stage. The assembling stage engages on the windshield wiper fixing stage. The assembling stage has a first fastening arm, a containing groove formed at one side edge of the assembling stage to contain the through shaft, and an engaging groove arranged at one side edge of the containing groove. The retaining stage has a cover cap and a block which projects on an end surface of the cover cap. The retaining stage is combined on the assembling stage by fastening the first fastening arm. The block is plunged into the engaging groove and the cover cap is pressed on the containing groove to prevent loose attachment of the through shaft. | 01-10-2013 |
20140189974 | AUTOMOBILE WIPER FLATLY ATTACHABLE ON GLASS SURFACE - An automobile wiper includes a fixed frame, a swing arm, a first pressing wing, a swing casing, a second pressing wing and a wiper blade. The fixed frame includes a fixed base and a fixed arm installed at the bottom of the fixed base, and the swing arm is pivotally coupled to a side of the fixed arm, and the first pressing wing is combined with an end of the swing arm, and the swing casing is coupled to the other end of the swing arm, and the second pressing wing is pivotally coupled to the swing casing, and the wiper blade is combined with the bottom of the first pressing wing and the second pressing wing, and the wiper blade is pressed by the first pressing wing and the second pressing wing and attached flatly onto a glass surface. | 07-10-2014 |
20140215747 | GENERAL WIPER CONNECTING APPARATUS - A general wiper connecting apparatus ( | 08-07-2014 |
Chih-Ming Yang, Banqiao City TW
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20100050361 | Windshield wiper connector - A windshield wiper connecting device for connecting a windshield wiper to a wiper driving arm includes: a first connecting element having a bottom plate, a plurality of first buckling pieces and two abutting portions, the first buckling pieces being bent and fixedly buckled to the windshield wiper; a second connecting element having a semi-cylindrical shaft base, two locking portions, four wings and four hooks, the hooks being locked and connected to the side walls of the abutting portions; and a mask covering the outside of the first connecting element and the second connecting element, the mask being connected to the wiper driving arm, wherein the shaft base of the second connecting element is provided on the bottom plate of the first connecting element, the shaft base of the second connecting element and the wings of the second connecting elements abut the abutting portions of the first connecting element. | 03-04-2010 |
20100236008 | Windshield wiper - A windshield wiper includes a flexible support with fasteners and positioning holes, a connecting piece fixedly connected to the flexible support, a warping piece that has a positioning portion which extends to form an elastic portion with locking pieces, a positioning piece, and a windshield wiper blade with the fasteners fastened to its two ends. The middle portion and the end portion of the flexible support have different curvatures. The positioning portion has a through-hole and abuts the flexible support. The positioning piece passes through the through-hole and the positioning hole to be fastened to the flexible support. The locking piece is fastened to the windshield wiper blade. Therefore, the windshield wiper blade is prevented from shaking due to an external force, by being attached to the windshield tightly through the warping piece and the positioning piece. Thus, its effect of wiping away rain is increased. | 09-23-2010 |
Chih-Ming Yang, Danyang City CN
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20150096141 | WINDSHIELD WIPER WITH EVEN PRESSING FORCE - A windshield wiper ( | 04-09-2015 |
Chih-Ming Yen, Hsin-Tien City TW
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20090290352 | HIGH POWERED LIGHT EMITING DIODE LINEAR LIGHTING WITH ENHANCED UNIFORMITY AND ILLUMINATION - A light emitting diode linear light which is high powered and has enhanced uniformity and illumination and is safe to humans, environmentally friendly, and possesses an extremely long lifetime is disclosed. The LED lighting comprises a polygonal light pipe, a light reflector panel, two LED packages, two LED PCBs, a plurality of heatsinks, a plurality of heat pipe assemblies, a protective housing, a back cover, and a diffuser cover. The polygonal light pipe comprises a transparent or semitransparent material. A patterned surface on the light emitting surface of the light pipe diffuses the emitted light. A patterned surface on the surface of the light pipe opposite the light emitting surface reflects light. The plurality of heat pipe assemblies comprise heatsinks and heat pipes. The heat pipes are hollow pipes that are filled with a liquid such as water or coolant and cooperate with the heatsinks to dissipate heat. | 11-26-2009 |
20100002461 | LIGHT GUIDE BAR WITH PATTERNED SURFACE TO ENHANCE LIGHT UNIFORMITY AND INTENSITY - A light guide bar with a patterned surface for a flicker free light source comprising a light emitting diode (LED) light source disposed on each end of the light guide bar is disclosed. A light diffusing pattern is disposed on a light emitting surface. The light diffusing pattern comprises a plurality of notches that are smallest closest to the LED light sources and largest in the center of the light guide bar. A light reflecting pattern is disposed on a light reflecting surface opposite the light diffusing pattern on the light emitting surface. Light emitted by the LED light sources enters the light guide bar through the ends. The light travels through the light guide bar at various angles and is reflected by the light reflecting pattern on the light reflecting surface. The reflected light is then emitted through the light diffusing pattern on the light emitting surface. | 01-07-2010 |
20100124063 | MINITURIZED LINEAR LIGHT SOURCE SUB-MODULE FOR VARIOUS FORMAT MAIN MODULES - A miniaturized linear light source sub-module comprising a symmetrical lens array, a light guide bar with dual reflecting surfaces, at least one light emitting diode light source, and a sub-module housing is disclosed. The symmetrical lens array comprises two identical covers, two identical lens sections, and a middle holder. Each lens section comprises a plurality of lenses disposed on the top and bottom of the lens section. The dual reflecting surface light guide comprises a light emitting surface, a v-shaped light reflecting surface, an asymmetrical saw-toothed light reflecting surface, an apex cut-off surface, and a bottom cut-off surface. At least one light emitting diode light source is connected to an end of the dual reflecting surface light guide. The sub-module housing holds the lens array assembly, the dual reflecting surface light guide, and the at least one light emitting diode light source to form the miniaturized linear light source sub-module. | 05-20-2010 |
Chih-Ming Yi, Los Altos, CA US
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20130179494 | Collaborative, contextual enterprise networking systems and methods - Described is an enterprise-based, contextual network system and method to keep employees connected with one another, as well as to external resources. Current media offers a great way to stay in touch with others but is not cohesive and contextual for businesses or generally productive for businesses. The enterprise media disclosed in this application presents a way for businesses to keep all of their employees and outside resources connected, but in a professional and efficient manner for the workplace. This enterprise media adapts to its users to create an interface that will help the user complete work, connect with others, and use various applications all in one place. | 07-11-2013 |
20150142876 | COLLABORATIVE, CONTEXTUAL ENTERPRISE NETWORKING SYSTEMS AND METHODS - Described is an enterprise-based, contextual network system and method to keep employees connected with one another, as well as to external resources. Current media offers a great way to stay in touch with others but is not cohesive and contextual for businesses or generally productive for businesses. The enterprise media disclosed in this application presents a way for businesses to keep all of their employees and outside resources connected, but in a professional and efficient manner for the workplace. This enterprise media adapts to its users to create an interface that will help the user complete work, connect with others, and use various applications all in one place. | 05-21-2015 |
Chih-Ming Yu, New Taipei City TW
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20120205206 | Hydraulic Buffer Device - A hydraulic buffer device includes a first chamber, a second chamber, and a buffering space disposed under the first and second chambers, an air bladder disposed in the buffering space, an oil chamber disposed above the first and second chambers and divided by a piston into upper and lower chamber portions, and an annular passage disposed around the oil chamber. When the piston is moved downwardly within the oil chamber, the hydraulic oil flows from the lower chamber portion into the buffering space via the first chamber to contract the air bladder so that, upon expansion of the air bladder, air pressure in the air bladder pushes the hydraulic oil to flow from the buffering space into the upper chamber portion via the second chamber and the annular passage. | 08-16-2012 |
Chih-Ming Yu, Hsinchu County 302 TW
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20150252986 | LAMP STRUCTURE - A lamp structure according to the present disclosure includes an electrical base, a tube, a cover covering the tube, at least one solid-state light source positioned within the tube, a thermal conductive material filled in the tube, two electrodes electrically connected to the solid-state light source, and two supporting members. The supporting members stand at the electrical base to hang the tube to be positioned within the cover. | 09-10-2015 |