Chih-Kuang
Chih-Kuang Chang, Taipei Hsien TW
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20100226587 | SYSTEM AND METHOD FOR BINARIZING A GRAY-SCALE IMAGE IN AN ELECTRONIC DEVICE - An electronic device includes an image processing system to binarize a gray-scale image to generate a corresponding binary image in the electronic device. Binarization of the gray-scale image by the image processing system includes generation of a binarization array to store binarization threshold values that each corresponds to a pixel of the gray-scale image, and binarization of the gray-scale image according to all binarization threshold values stored in the binarization array. | 09-09-2010 |
Chih-Kuang Chang, Hemei Township TW
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20110278387 | Cord Winding Device for Window Covering - A cord winding device for a window covering includes a casing, a reel rotatably mounted on the casing, a torsion spring biased between the casing and the reel, a limit ring secured on the casing and abutting the reel to limit the reel between the casing and the limit ring, and a pull cord attached a bottom of the casing. Thus, the lift cord of the window covering is wound around and stored in the reel of the cord winding device so that the lift cord is rolled up to a higher position to prevent the children from being tangled with the lift cord so as to protect the safety of the children. | 11-17-2011 |
Chih-Kuang Chang, Tu-Cheng,taipei Hsien TW
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20100169041 | SYSTEM AND METHOD FOR DISPLAYING ILLUSTRATIVE INFORMATION OF MEASURED DATA - A method for dynamically displaying illustrative information of measured data of a manufactured part, obtained by a coordinate measuring machine, defines measured characteristics of the measured data. Graphical aides are created. Each of the defined measured characteristics is related to one of the graphical aides. If one of the defined measured characteristics is to be illustrated, the related graphical aide is retrieved and displayed. | 07-01-2010 |
Chih-Kuang Chen, Hsin-Chu TW
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20090058876 | DYNAMIC COLOR GAMUT OF LED BACKLIGHT - A backlight unit usable in an LCD for dynamically expanding color gamut of the LCD. In one embodiment, the backlight unit has a plurality of light emitting elements, and a control unit electrically coupled with the plurality of light emitting elements for controlling intensity of light emitting from each of the plurality of light emitting elements in response to a frame of image data applied to the plurality of pixels, wherein the control unit is configured such that when the frame of image data applied to the plurality of pixels is in a red color, a green color, or a blue color, the intensity of light from the red color, the green color, or the blue color emitting from each of the plurality of light emitting elements is adjusted to its corresponding maximal value so as to expand the red, the green, or the blue area of the color gamut of the LCD panel accordingly. | 03-05-2009 |
20090128741 | LCD Device, Backlight Module Thereof with Partition Wall and Method for Manufacturing the Same - A backlight module, a liquid crystal display using the backlight module, and a manufacturing method thereof are provided. The backlight module includes a bottom plate, a plurality of light source sets and at least one partition wall. A plurality of lighting areas is formed on the bottom plate and light source sets are disposed on the lighting areas, respectively. The partition wall is disposed on the bottom plate and between each two adjacent lighting areas to fully or partially block/reflect the light emitted from the lighting areas. The partition wall includes a first light-penetrable wall and a light reflective layer formed on a wall surface of first light-penetrable wall. The light reflective layer is erected on the bottom plate through the support provided by the first light-penetrable wall and its wall surface. | 05-21-2009 |
Chih-Kuang Chen, Taipei City TW
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20090149564 | TRANSPARENT FLEXIBLE FILM AND FABRICATION METHOD THEREOF - A transparent flexible film is provided, formed by curing a composition, comprising: about 40-75 parts by weight of a clay; about 15-45 parts by weight of a water-soluble polymer; about 1-10 parts by weight of a mono-functional acrylic oligomer of formula (I), wherein n | 06-11-2009 |
20090279176 | ANTIGLARE FILM AND MANUFACTURING METHOD THEREOF - The invention provides an antiglare film. A resin layer is disposed on a substrate. Micro-aggregates are distributed in an interior and over a surface of the resin layer. Each of the micro aggregates has a size of 0.1-3 μm and is formed by aggregating aggregated nano-particles. The micro-aggregates distributing over the surface result in a surface roughness of the resin layer. The weight ratio of the resin layer to the micro-aggregates is 1:0.1-0.7. | 11-12-2009 |
20130022610 | METHODS OF DECREASING GLYCOSYLATED HEMOGLOBIN IN PATIENTS WITH DYSLIPIDEMIA - Methods for treating abnormal glycosylated hemoglobin (HbA1c) levels in a patient in need thereof, wherein the provided methods comprise administering to a patient in need a therapeutically effective amount of an Interleukin-1β modulator. Also, the invention provides compositions comprising at least one lipid modifying agent and an IL-1β modulator. | 01-24-2013 |
Chih-Kuang Chen, Hsinchu TW
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20090185371 | Backlight Module Unit and Backlight Module - A backlight module unit and a backlight module are provided. The backlight module unit includes a first light source, a second light source, and an optical barrier. A light source interval is defined between the first light source and the second light source, while a barrier interval is defined between the optical barrier and the second light source. Because the barrier interval is substantially shorter than a half of the light source interval, the backlight module unit mixes the light evenly, and prevents the dark bands from forming due to the disposition of the optical barrier. Thereby, the backlight module that comprises the plural aforesaid backlight units will have no dark bands, mix light evenly, and be thin overall. | 07-23-2009 |
Chih-Kuang Chen, Taipei TW
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20090167993 | METHOD FOR FORMING OPTICAL COMPENSATING FILMS, OPTICAL COMPENSATING FILMS FORMED THEREBY, STRUCTURE OF OPTICAL COMPENSATING FILMS, AND POLARIZING PLATES - The invention provides a method for forming optical compensating films, including: (a) providing a suspension containing clay; (b) adding a mono-functional acrylic oligomer of formula (I) in the suspension, wherein n | 07-02-2009 |
20120232044 | METHODS AND COMPOSITIONS FOR TREATING HYPERURICEMIA AND METABOLIC DISORDERS ASSOCIATED WITH HYPERURICEMIA - Methods and compositions for treating and/or preventing hyperuricemia or metabolic disorders associated with hyperuricemia comprising administering to a patient in need a therapeutically effective amount of diacerein, rhein, or a pharmaceutically acceptable salt, an analog, a prodrug, or an active metabolite thereof. | 09-13-2012 |
Chih-Kuang Chiang, Taipei City 114 TW
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20140268071 | DISPLAY DEVICE HAVING A DOUBLE IMAGE DISPLAY FUNCTION - A display device having a double image display function includes a base unit, a support unit, a first image display unit, a second image display unit and an image projecting unit. The base unit includes a base body. The support unit includes a support structure disposed on the base body. The first image display unit includes at least one image display screen movably disposed on the support structure for displaying a first predetermined image. The second image display unit includes at least one projection plate movably disposed on the base body. The image projecting unit includes an image projecting module movably disposed on the image display screen. An image light beam generated by the image projecting module is projected onto the projection plate to display a second predetermined image on the projection plate. Thus, the same or different displaying images can be respectively shown on different viewing planes. | 09-18-2014 |
Chih-Kuang Chuang, New Taipei City TW
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20120293938 | HINGE DEVICE AND KEYBOARD DOCK AND PORTABLE ELECTRONIC DEVICE HAVING THE SAME - A hinge device and a keyboard dock and a portable electronic device having the same are provided. The hinge device includes a body, a torsion generating part, a rotating part and a second wedging unit. The torsion generating part is pivotally connected to the body and has a first wedging unit. The rotating part is pivotally connected to the body. The second wedging unit is assembled to the rotating part and moved along with the rotating part. The first wedging unit and the second wedging unit are wedged together or separated from each other while the rotating part rotates relative to the body along a first axis. The body can rotate along a second axis relative to the torsion generating part while the first wedging unit and the second wedging unit are separated from each other. The first axis is vertical to the second axis. | 11-22-2012 |
20130187525 | DUAL-AXIS HINGE AND PORTABLE DEVICE WITH THE SAME - A dual-axis hinge is mounted between a cover and a base of a portable device and has a connecting bracket, an upper rotating bracket, a lower rotating bracket, an upper active gear, a lower active gear and a transmission gear assembly. The connecting bracket is mounted between the upper and lower rotating brackets. The upper and lower active gears are connected respectively to the upper and lower rotating brackets. The transmission gear assembly is connected between the upper and lower active gears to adjust a velocity ratio of the upper and lower active gears. Therefore, the cover and the base align with each other without a drop whether or not the upper and lower active gears are the same in teeth number or whether or not the included angles between the upper and lower rotating brackets with the connecting bracket are the same. | 07-25-2013 |
Chih-Kuang Hsu, Zhonghe City TW
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20100245894 | DIRECT-SCAN-TO-PRINT SCANNER AND RELATED METHOD - A scanning device capable of directly sending scanned images to a printing device to be printed and a related method are proposed. An image information is obtained by scanning with an image sensor module, and then stored in a storage device. When a print client detects a print request, a storing server delivers the image information to the printing device through a picture transfer protocol. Accordingly, the image information is to be printed upon a direct link between the printing device and the scanning device without needing a computer serving as a bridge. | 09-30-2010 |
Chih-Kuang Hu, Tai-Chung City TW
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20120095163 | Polymerization method for acrylic latex without emulisifier - The present invention provides a polymerization method for acrylic latex without emulsifier, in which a reaction system is formed from 40˜60 wt % of pure water and 2˜9 wt % of carboxylic acid monomers with carbon-carbon double bond polymerizable functional groups (A), and 40˜50 wt % of methyl methacrylate or acrylate monomers (B), and 0.2˜2.0 wt % of inorganic alkaline solution is first used to adjust the pH value of the reaction system to within a pH range of 9.0˜13.0, then 0.2˜1.0 wt % of peroxide sulfates are used as initiators, and emulsification polymerization is carried out. At the end of the reaction, organic amine compounds are used to adjust the pH value of the obtained aqueous resin latex to within the pH range 7.0˜9.5. Particle diameters of the manufactured aqueous resin latex are approximately 100˜30 nm, uniformly distributed and have excellent outward appearance. Moreover, acid value is low at 3.5˜6.5 mgKOH/g, and Its specific gravity is approximately 1.07, slightly greater than that of water; storage stability is excellent, with good permeability that facilitates construction. Moreover, water resisting property as a dry film coating is good, tensile strength is excellent, and provides superior abrasion performance. | 04-19-2012 |
Chih-Kuang Kao, Chupei City TW
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20110101529 | BARRIER LAYER FOR COPPER INTERCONNECT - A copper interconnect includes a copper layer formed in a dielectric layer. A glue layer is formed between the copper layer and the dielectric layer. A barrier layer is formed at the boundary between the glue layer and the dielectric layer. The barrier layer is a metal oxide. | 05-05-2011 |
Chih-Kuang Kao, Chu-Pei City TW
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20140106562 | Barrier Layer for Copper Interconnect - A copper interconnect includes a copper layer formed in a dielectric layer. A glue layer is formed between the copper layer and the dielectric layer. A barrier layer is formed at the boundary between the glue layer and the dielectric layer. The barrier layer is a metal oxide. | 04-17-2014 |
Chih-Kuang Lin, New Taipei City TW
Chih-Kuang Lin, Dublin IE
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20160007288 | OPPORTUNISTIC INFORMATION FORWARDING USING WIRELESS TERMINALS IN THE INTERNET-OF-THINGS - A capability for opportunistic forwarding of information using a wireless terminal is presented. An energy limited node includes a wake-up circuit configured to detect a wake-up signal from a wireless terminal where the wake-up signal includes a modulated waveform signal, and a communication module configured to switch, based on a control signal generated by the wake-up circuit, from a sleep mode in which the communication module is not operable to communicate with the wireless terminal to an active mode in which the communication module is operable to communicate with the wireless terminal. A wireless terminal includes a first wireless communication interface configured for communication with a device using a wireless communication protocol, a second wireless communication interface configured for wireless communication with a wireless access node of a wireless network, and a processor configured to support opportunistic forwarding of information between the device and the wireless access node of the wireless network. | 01-07-2016 |
Chih-Kuang Lin, Taoyuan County TW
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20120132035 | LITHIUM-BASED ALLOY AND METHOD OF PRODUCING THE SAME - A lithium (Li)-based alloy and a preparation method thereof are disclosed, in which the lithium metal is wrapped by a metal foil with a higher melting point, followed by subjecting to multi-stage thermal treatment to cast alloy, thereby obtaining the Li-based alloy with high purity-Li. | 05-31-2012 |
20120132545 | HYDROGEN STORAGE DEVICE - A hydrogen storage device includes a hydrogen storage can, at least one first partition, and at least one second partition. The hydrogen storage can defines a major axis. The at least one first partition is used to partition the space in the hydrogen storage can into at least one compartment. The at least one second partition includes a plurality of sub-compartments. The sub-compartments are arranged linearly in at least one row perpendicular to the major axis. | 05-31-2012 |
20120193512 | SUN TRACKING METHOD AND SUN TRACKING SYSTEM - A sun tracking method is disclosed. The method can track the position of sun continuously, without the need to install an optical sensor, to calculate a sun-tracking solar orbit function, and to calibrate the mechanical structure periodically. The method comprises the steps outlined below. (A) A motor of an attitude control device is driven for changing attitude of a photovoltaic cell device to sense and record a short-circuit current by a short-circuit current measuring device directly or in cooperation with the switching behavior of a switch power unit of a maximum power tracking control device, or to sense and to record an output power by a power measuring device. (B) A maximum value of the short-circuit current or the output power is calculated. (C) The motor-driving device is driven for modulating the photovoltaic cell device to an attitude corresponding to the maximum value of the short-circuit current or the output power. | 08-02-2012 |
Chih-Kuang Tai, Taichung City TW
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20140322471 | Phosphor-Containing Composite Material Having Two Exposed Adhesive Surfaces and Optical Article Including the Same - A phosphor-containing composite material comprises: an optical excitable film including a releasable adhesive matrix and a phosphor dispersed in the releasable adhesive matrix, the optical excitable film having first and second exposed adhesive surfaces; and a transparent first releasable protection layer having a first surface bonded peelably to the first exposed adhesive surface of the optical excitable film. The optical excitable film is one single layer. A second surface of the first releasable protection layer is free from attachment of any adhesive material. | 10-30-2014 |
Chih-Kuang Wu, Hsinchu City TW
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20110080755 | Power Supply with Synchronized Clocks and Related DC-DC Converter - A power supply with synchronized clocks includes a transformer for transforming an AC input voltage into a DC input voltage, a delay unit for delaying phase of a standard clock signal to generate a plurality of synchronization clock signals, a major DC-DC converter for adjusting voltage level and phase of the DC input voltage according to one of the plurality of synchronization clock signals to generate a major output voltage, and a plurality of parallel DC-DC converters each for adjusting voltage level and phase of the major output voltage according to one of the plurality of synchronization clock signals to generate a minor output voltage. | 04-07-2011 |
Chih-Kuang Yang, Hsinchu-City TW
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20080314629 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 12-25-2008 |
20100027869 | Optical Carriage Structure of Inspection Apparatus and its Inspection Method - An optical carriage structure of the inspection apparatus and its inspection method are disclosed herein. A plurality of CCD arrays configured at different heights in the optical carriage are utilized, so as a plurality of individual images can be simultaneously captured in one scanning step to obtain a preferred inspection image for image comparison; therefore, precise inspection can be effectively achieved. Furthermore, those CCD arrays are configured at different heights and have enlarged focusing ranges, and the depth of field is thus enhanced. | 02-04-2010 |
20110124154 | HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF - A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer. | 05-26-2011 |
20110124155 | HYBRID STRUCTURE OF MULTI-LAYER SUBSTRATES AND MANUFACTURE METHOD THEREOF - A hybrid structure of multi-layer substrates comprises a first multi-layer substrate and a second multi-layer substrate. The first multi-layer substrate stacks up first metal layers, first dielectric layers alternately and has VIAs. A border district of a first metal layer connects with a border district of the corresponding first dielectric layer. The border districts are separated from adjacent first metal layers and adjacent first dielectric layers. The second multi-layer substrate stacks up second metal layers and second dielectric layers alternately. A border district of a second metal layer connects with a border district of the corresponding second dielectric layer. The border districts are separated from adjacent second metal layers and adjacent second dielectric layers. The VIAs are located at the border districts of the first dielectric layers and each VIA has electric conductor therein to connect one first metal layer with one second metal layer. | 05-26-2011 |
20110198782 | MULTI-LAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed are a multi-layer substrate and a manufacturing method of the multi-layer substrate. By employing a carrier to alternately form dielectric layers and metal structure layers thereon. Each dielectric layer adheres with the adjacent dielectric layer to embed the metal structure layers in the dielectric layers corresponding thereto. Comparing with prior arts, which have to use prepregs when hot pressing and adhering different layers of different materials, the present invention takes fewer processes, thus, fewer kinds of materials without using prepregs. Therefore, the present invention can promote the entire quality and yield of manufacturing the multi-layer substrate to satisfy mechanical characteristic matching of the multi-layer substrate and to reduce cost of the whole manufacturing process. Significantly, the multi-layer substrate having thin dielectric layers according to the present invention can satisfy the concern of impedance matching therefore, and can reduce crosstalk influence to keep good signal integrity therein. | 08-18-2011 |
20120270158 | MANUFACTURING METHOD OF METAL STRUCTURE OF FLEXIBLE MULTI-LAYER SUBSTRATE - Disclosed is a metal structure of a multi-layer substrate, comprising a first metal layer and a dielectric layer. The first metal layer has an embedded base and a main body positioned on the embedded base. The base area of the embedded base is larger than the base area of the main body. After the dielectric layer covers the main body and the embedded base, the dielectric layer is opened at the specific position of the first metal layer for connecting the first metal layer with a second metal layer above the dielectric layer. When the metal structure is employed as a pad or a metal line of the flexible multi-layer substrate according to the present invention, the metal structure cannot easily be delaminated or separated from the contacted dielectric layer. Therefore, a higher reliability for the flexible multi-layer substrate can be achieved. A manufacturing method thereof is also provided. | 10-25-2012 |
Chih-Kuang Yang, Hsinchu TW
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20140167244 | CHIP THERMAL DISSIPATION STRUCTURE - Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board. | 06-19-2014 |
20140167255 | PACKAGE STRUCTURE AND PACKAGE METHOD - Disclosed are a package structure and a package method. The package structure comprises an IC bare die, having bare die pads formed on a surface; a flexible packaging substrate, having first pads formed on a first surface and second pads formed on a second surface; and a plurality of bumps, previously formed on the first surface of the flexible packaging substrate. The bumps have different heights, and correspond to the first pads and contact the bare die pads respectively. Pressing or heating is implemented to package the IC bare die. The package structure further comprises a printed circuit board, having a plurality of contact pads. The second pads of the flexible packaging substrate respectively contact with the contact pads via solders. Connection is implemented by pressing or heating. Extremely low stress is generated to the packaging substrate and the printed circuit board. | 06-19-2014 |
20140167803 | TESTING DEVICE AND TESTING METHOD THEREOF - Disclosed are a testing device and a testing method thereof. The testing device includes a frame, a flexible multi-layer substrate and at least one electrical testing point. The frame is positioned corresponding to a chip. At least one electrical connecting point is formed on a surface of the chip. The flexible multi-layer substrate is fixed in the frame. The electrical testing point is corresponding to the electrical connecting point and formed on an upper surface of the flexible multi-layer substrate for contacting the electrical connecting point and performing an electrical test to the chip. Furthermore, the electrical connecting point or the electrical testing point is a bump. | 06-19-2014 |
20140312490 | ELECTRICAL SYSTEM AND CORE MODULE THEREOF - Disclosed is a core module, comprising: a package substrate, having a plurality of pads; a first component, connected to the pads of the package substrate corresponding to the first component with a plurality of first joint parts; a second component, connected to the pads of the package substrate corresponding to the first component with a plurality of second joint parts; and a third component, connected to the pads of the package substrate corresponding to the third component with a plurality of third joint parts, wherein the first component is positioned above the second component relative to the lower package substrate, and the first component, the second component and the third component are all electrically connected via the package substrate, and a main molding material is molding the first component, the second component and the third component. | 10-23-2014 |
20140328147 | WRISTWATCH STRUCTURE, ELECTRONIC CROWN FOR WRISTWATCH, AND WRISTWATCH HAVING DISPLAY - The present invention provides a wristwatch structure, an electronic crown for wristwatch, and a wristwatch having a display. The wristwatch structure comprises an electric driving component; an electronic core having a plurality of two-dimensional joints; and an electronic crown comprising a rotating portion and a fixed detecting portion, the detecting portion detecting electronic signals according to a rotation of the rotating portion; wherein the detecting portion of the electronic crown exports the electronic signals to the electronic core via one of the joints, and the electric driving component is electrically connected to one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening product development cycle. Also, the present invention is suitable for developing a product with appearance similar to a mechanical watch. | 11-06-2014 |
20140328148 | WRISTWATCH STRUCTURE, ELECTRONIC CORE FOR WRISTWATCH, AND METHOD FOR MANUFACTURING WRISTWATCH - The present invention provides a wristwatch structure, an electronic core for a wristwatch, and a method for manufacturing the wristwatch. The wristwatch structure comprises: a dial; an indicator designed with the dial; an electric driving component connected to the indicator, for driving the indicator and actuating it; and an electronic core having an integrated circuit unit packaged therein, the electronic core also having a plurality of two-dimensional joints distributed on an external surface thereof, wherein the electric driving component is electrically connected to the integrated circuit unit of the electronic core via one set of joints among the two-dimensional joints. The present invention can improve compatibility for various designs, thereby shortening the product development cycle. | 11-06-2014 |
20150205361 | TIME ADJUSTING METHOD AND SYSTEM FOR WRISTWATCH - The present invention provides a time adjusting method and system for a time piece (such as a wristwatch), which utilizes a motion sensor disposed on the wristwatch to detect a hand gesture made by a user in the front of the wristwatch. In such a manner, adjusting the position of an indicator on the wristwatch is realized, and thereby carrying out the time adjustment. | 07-23-2015 |
20150243577 | CHIP THERMAL DISSIPATION STRUCTURE - Disclosed is a chip thermal dissipation structure, employed in an electronic device comprising a first chip having a first chip face and a first chip back, comprising chip molding material, covering a lateral of the first chip; a first case, contacting the first chip back; a packaging substrate, connecting with the first chip face via first bumps; and a print circuit board, having a first surface and a second surface and connecting with the packaging substrate via solders. The chip thermal dissipation structure further comprises a second case, contacting the second surface. The thermal energy generated by the first chip is conducted toward the first case via the first chip back and toward the second case via the first chip face, the first bumps, the packaging substrate, the solders and the print circuit board. | 08-27-2015 |
20150323906 | TIMEPIECE AND POWER SAVING METHOD THEREOF - Disclosed are a timepiece and a power saving method of a timepiece. The timepiece includes a display, a setting module, a sensor and a controller. The display is utilized for displaying a time pattern. The setting module is utilized for setting a normal display mode and a first power saving mode. The sensor is utilized for sensing an operation of a user for transmitting a signal. The controller is utilized for switching the display between the normal display mode and the first power saving mode according to the setting of the setting module and the signal of the sensor. The display changes the time pattern when the timepiece is switched between the normal display mode and the first power saving mode. The present invention can decrease the power consumption for extending the usage time of the timepiece. | 11-12-2015 |
20150360447 | BARRIER STRUCTURE - A barrier structure is disclosed. The barrier structure is utilized for covering at least a part of an object for protecting the object from gas and water in an external environment and includes a first condensed matter layer and a second condensed matter layer. The first condensed matter layer has a first surface and a second surface. The first surface directly contacts the external environment. The first condensed matter layer is penetrable by at least one type of gas. The second condensed matter layer contacts the second surface. An interface is formed between the second surface of the first condensed matter layer and the second condensed matter layer. The barrier structure has ductility, flexibility, and bendability to cover the object, protect the object from the external environment, and provide the required barrier characteristic against the water or the gas. | 12-17-2015 |
20150361249 | BARRIER STRUCTURE - A barrier structure is disclosed. The barrier structure is utilized for covering at least a part of an object for protecting the object from gas and water in an external environment and includes a solid layer and a liquid layer. The solid layer has a first surface and a second surface. The first surface directly contacts the external environment. The solid layer is penetrable by at least one type of gas. The liquid layer contacts the second surface. An interface is formed between the second surface of the solid layer and the liquid layer. The barrier structure has ductility, flexibility, and bendability to cover the object, protect the object from the external environment, and provide the required barrier characteristic against the water or the gas. | 12-17-2015 |
Chih-Kuang Yeh, Tao-Yuan TW
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20100080759 | Method for Forming Nano-bubble - The present invention discloses a method for forming a nano-bubble. The forming method is different from the oil-water emulsion reaction in the prior art. The method comprises: taking an inorganic particle as a nucleus and performing a polymer coating process to coat at least one first polymer on the surface of the nucleus to form an organic/inorganic composite particle; then removing the nucleus of the organic/inorganic composite particle by way of the dissolution of a first solvent to form an impregnated nano-particle; performing a freeze-drying process to remove the first solvent to have the impregnated nano-particle form a hollow nano-particle; and finally dissolving the hollow nano-particle in a second solvent to form the nano-bubble. | 04-01-2010 |
Chih-Kuang Yu, Hsinchu TW
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20150093844 | DICING-FREE LED FABRICATION - Provided is a method of fabricating a light-emitting diode (LED) device. A wafer is provided. The wafer has a sapphire substrate and a semiconductor layer formed on the sapphire substrate. The semiconductor layer contains a plurality of un-separated LED dies. A photo-sensitive layer is formed over the semiconductor layer. A photolithography process is performed to pattern the photo-sensitive layer into a plurality of patterned portions. The patterned portions are separated by a plurality of openings that are each substantially aligned with one of the LED dies. A metal material is formed in each of the openings. The wafer is radiated in a localized manner such that only portions of the wafer that are substantially aligned with the openings are radiated. The sapphire substrate is removed along with un-radiated portions of the semiconductor layer, thereby separating the plurality of LED dies into individual LED dies. | 04-02-2015 |