Patent application number | Description | Published |
20100321841 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - Disclosed herein are embodiments of electrostatic discharge (ESD) protection circuits. In certain embodiments an ESD protection circuit may include two series resistor-capacitor (RC) circuits. One series RC circuit may have a short time constant and may selectively activate a current shunt between two power rails in response to an ESD event. Accordingly, the ESD circuit may be able to respond to fast ramping ESD events. The other series RC circuit has a longer time constant, and maintains the current shunt in an active state for a sufficient amount of time to allow the ESD event to be completely discharged. | 12-23-2010 |
20120212260 | Dynamic Feedback-Controlled Output Driver with Minimum Slew Rate Variation from Process, Temperature and Supply - In examples, apparatus and methods are provided that mitigate buffer slew rate variations due to variations in output capacitive loading, a fabrication process, a voltage, and/or a temperature (PVT). An exemplary embodiment includes an inverting buffer having an input and an output, as well as an active resistance series-coupled with a capacitor between the input and the output. The resistance of the active resistance varies based on a variation in a fabrication process, a voltage, and/or temperature. The active resistance can be a passgate. In another example, a CMOS inverter's output is coupled to the input of the inverting buffer, and two series-coupled inverting buffers are coupled between the input of the CMOS inverter and the output of the inverting buffer. | 08-23-2012 |
20130181751 | SLEW-RATE LIMITED OUTPUT DRIVER WITH OUTPUT-LOAD SENSING FEEDBACK LOOP - Output driver feedback circuitry is configured to sense an amount of output capacitance of an output pad and to adjust the strength of the output driver accordingly. The feedback circuitry adjusts the output driver within a single cycle. A chain of delay reference signals is generated by representative capacitive loads that replicate a range of actual output loads. Adjustments to the output driver are based on a comparison of the delay reference signals with output of the output driver. | 07-18-2013 |
20130181759 | ON-CHIP COARSE DELAY CALIBRATION - Process, voltage and temperature corners of an on-chip device under calibration are obtained by comparing the outputs of different on-chip components such as active on-chip components and passive-on chip components in response to an input. A first on-chip delay line including a number of active devices, which generate an array of outputs D[ ]) at different stages of the delay. A second on-chip delay line generates a single output (CLK). A DFF array samples the array of outputs (D[ ]) with the single output clock CLK. The different delay variations in different process and temperature corners cause different outputs from the DFF array. The different outputs from the DFF array provide information about the process and temperature corner that can be for rapid calibration of the on-chip device under calibration within one cycle of the CLK. | 07-18-2013 |
20130187692 | TRANSITION TIME LOCK LOOP WITH REFERENCE ON REQUEST - Output driver feedback circuitry limits output slew rates across a wide range of output loads. A transition time lock loop architecture of the feedback circuitry compares a transition time pulse with a reference pulse to adjusts transition time of an output signal for various process-voltage-temperature (PVT) process corners, output voltage domains and output capacitances. Reference pulse generation circuitry provides a reference pulse in phase with the transition time pulse for each rise and fall of the output signal. | 07-25-2013 |
20140091860 | SYSTEM AND METHOD OF IMPLEMENTING INPUT/OUTPUT DRIVERS WITH LOW VOLTAGE DEVICES - An input/output (I/O) driver is disclosed that employs a compensation circuit to limit the voltages across devices of the driver from exceeding a defined threshold to allow lower voltage devices to implement the operation of the driver. In particular, the driver employs a pull-up circuit including first and second switching devices coupled between a first voltage rail and an output of the driver. The driver employs a pull-down circuit including third and fourth switching devices coupled between the output and a second voltage rail. The I/O driver employs a compensation circuit configured to apply a compensation voltage to the node between the first and second switching devices and to the node between the third and fourth switching devices at the appropriate times to maintain the respective voltages across the second and third switching devices at or below a defined threshold, such as a reliability limit, during the operation of the driver. | 04-03-2014 |
20140098448 | ELECTROSTATIC PROTECTION FOR STACKED MULTI-CHIP INTEGRATED CIRCUITS - One feature pertains to a multi-chip module that comprises at least a first integrated circuit (IC) die and a second IC die. The second IC die has an input/output (I/O) node electrically coupled to the first IC die by a through substrate via. The second die's active surface also includes a fuse that is electrically coupled to the I/O node and adapted to protect the second IC die from damage caused by an electrostatic discharge (ESD). In particular, the fuse protects the second IC die from ESD that may be generated as a result of electrically coupling the first die to the second die during the manufacturing of the multi-chip module. Upon coupling the first die to the second die, the fuse may bypass the ESD current generated by the ESD to ground. After packaging of the multi-chip module is complete, the fuse may be blown open. | 04-10-2014 |
20140327105 | ELECTROSTATIC DISCHARGE DIODE - A method includes thinning a back-side of a substrate to expose a portion of a first via that is formed in the substrate. The method also includes forming a first diode at the back-side of the substrate. The first diode is coupled to the first via. | 11-06-2014 |
20150042401 | PASSING HIGH VOLTAGE INPUTS USING A CONTROLLED FLOATING PASS GATE - An input receiver includes a first pass transistor coupled between an input pad and an internal receiver node. The first pass transistor includes a controlled floating gate capacitively coupled to the input pad. A source follower transistor couples between the internal receiver node and a power supply. A gate for the source follower transistor couples to the input pad. | 02-12-2015 |