Chia-Ming
Chia-Ming Chan, Miao-Li TW
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20080212015 | Method for manufacturing liquid crystal display panel - An exemplary method for manufacturing a liquid crystal display (LCD) panel ( | 09-04-2008 |
20080252838 | Liquid crystal panel having patterned sealant and fabricating method thereof - An exemplary liquid crystal panel ( | 10-16-2008 |
Chia-Ming Chen, Hsinchu TW
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20080297707 | LIQUID CRYSTAL DISPLAY PANEL, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD THEREOF - A method of manufacturing a liquid crystal display panel is provided. A photo-alignment layer and a patterned pixel electrode are formed on a first and a second substrates respectively. A liquid crystal layer is formed between the photo-alignment layer and the patterned pixel electrode. The patterned pixel electrode includes intersected electrodes having a first directional portion and a second directional portion intersected therewith, and stripe electrodes having slits therebetween connect at least one of the first directional portion and the second directional portion. When an electric field between the first and the second substrates is substantially zero, the liquid crystal molecules near the photo-alignment layer have a pre-tilt angle while those on another side are substantially perpendicular to the second substrate. As the liquid crystal layer is driven, the liquid crystal molecules of the liquid crystal layer are substantially arranged along an extending direction of the slits. | 12-04-2008 |
20080297708 | LIQUID CRYSTAL DISPLAY PANEL, ELECTRONIC APPARATUS, AND MANUFACTURING METHOD THEREOF - A method for manufacturing a liquid crystal display panel is provided. A photo-alignment layer is formed on a first substrate. Patterned pixel electrodes including intersected electrodes and stripe electrodes are formed on a second substrate. A liquid crystal layer is formed between the photo-alignment layer and the patterned pixel electrodes. Each intersected electrode has a first directional portion and a second directional portion interlacing thereto. The stripe electrodes with silts connect the first and/or the second directional portions. When an electric field between the first and the second substrates is substantially zero, liquid crystal molecules near the photo-alignment layer are arranged at a pre-tilt angle, while those disposed at another side near the second substrate are substantially perpendicular to the second substrate. As the liquid crystal layer is driven, the liquid crystal molecules of the liquid crystal layer are substantially arranged along an extending direction of the slits. | 12-04-2008 |
Chia-Ming Chen, Wugu City TW
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20110299705 | AUDIO SIGNAL ADJUSTING SYSTEM AND METHOD - An audio signal adjusting method is disclosed, which comprises steps of: determining an environment noise level; calculating a ratio between an environment noise level and an output audio signal level to form a measuring value; comparing the measuring value with a predetermined threshold as an audio comfort value; and determining whether or not to adjust an audio signal parameter according to the comparison result. If the comparison result is incorrect, then the audio signal parameter is adjusted, and the output audio signal should be outputted according to the adjusted audio signal parameter. The audio signal adjusting method can satisfy the different user needs on different environment types. | 12-08-2011 |
Chia-Ming Chen, Taipei County TW
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20080218175 | Open-Circuit Testing System and Method - The invention discloses a testing system and method suitable for determining the connection state of an electronic component in an electronic device assembly. In an embodiment, the testing system comprises a signal sensing unit configured to provide a sensed signal induced by capacitive coupling in response to the output of a testing signal passing through a tested pin, a signal processor unit configured to filter and over-sample the sensed signal to obtain a digital signal, and an analyzer unit configured to compute the digital signal for determining a connection state of the test pin. | 09-11-2008 |
20090089635 | Electronic Device Testing System and Method - The invention provides a testing system and method suitable for determining whether a pin-out of an electrical component is properly connected to a PCB. The testing system includes a testing signal source, a signal detector, a signal processor, an analysis unit and an integrated circuit having boundary-scan test function to provide testing signals to the device under test (DUT) whose signal traces are passing through inner layer of PCB in order to detect whether the sensed signal is an error signal. | 04-02-2009 |
Chia-Ming Chen, Hsin-Chu TW
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20150212399 | TEMPERATURE DETECTOR AND PROJECTOR USING THE TEMPERATURE DETECTOR - A temperature detector and a projector using the temperature detector are provided. The temperature detector is configured to judge the operating temperature of the lamp in the projector. The temperature detector includes a charging/discharging circuit and a temperature judgment unit. The charging/discharging circuit receives a system voltage and provides a temperature voltage. The temperature judgment unit receives the temperature voltage and judges whether or not the operating temperature of the lamp falls in a first temperature range according to the temperature voltage so as to correspondingly output a temperature judgment signal. The scheme of using the temperature detector can determine a heat-dissipation time required by the lamp to advance the accomplishment rate of re-lighting and avoid affecting the lifetime of the lamp due to frequent lighting operation. | 07-30-2015 |
Chia-Ming Cheng, Shulin City TW
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20120113587 | DUAL CPU AND HEAT DISSIPATING STRUCTURE THEREOF - A dual CPU and its heat dissipating structure are applied to a heat dissipating module installed on a dual-CPU computer device, and CPUs are arranged alternately with each other on a motherboard, and the heat dissipating modules are installed at positions of the CPUs, such that the alternately arranged heat dissipating modules can prevent interferences by external cold air, and a heat source produced by the CPUs can be conducted and dissipated to the outside to prevent the heat source form remaining at the surrounding of the CPUs and related components installed on the motherboard to achieve an excellent heat dissipating efficiency. | 05-10-2012 |
Chia-Ming Cheng, Xinzhuang City TW
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20100289092 | POWER MOSFET PACKAGE - A power MOSFET package includes a semiconductor substrate having opposite first and second surfaces, having a first conductivity type, and forming a drain region, a doped region extending downward from the first surface and having a second conductivity type, a source region in the doped region and having the first conductivity type, a gate overlying or buried under the first surface, wherein a gate dielectric layer is between the gate and the semiconductor substrate, a first conducting structure overlying the semiconductor substrate, having a first terminal, and electrically connecting the drain region, a second conducting structure overlying the semiconductor substrate, having a second terminal, and electrically connecting the source region, a third conducting structure overlying the semiconductor substrate, having a third terminal, and electrically connecting the gate, wherein the first, the second, and the third terminals are substantially coplanar, and a protection layer between the semiconductor substrate and the terminals. | 11-18-2010 |
20110079892 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package includes a substrate having a pad region, a device region, and a remained scribe region located at a periphery of the substrate; a signal and an EMI ground pads disposed on the pad region; a first and a second openings penetrating into the substrate to expose the signal and the EMI ground pads, respectively; a first and a second conducting layers located in the first and the second openings and electrically connecting the signal and the EMI ground pads, respectively, wherein the first conducting layer and the signal pad are separated from a periphery of the remained scribe region, and wherein a portion of the second conducting layer and/or the EMI ground pad extend(s) to a periphery of the remained scribe region; and a third conducting layer surrounding the periphery of the remained scribe region to electrically connect the second conducting layer and/or the EMI ground pad. | 04-07-2011 |
20110127666 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - An embodiment of the present invention relates to a chip package and fabrication method thereof, which includes a chip protection layer or an additional etching stop layer to cover conducting pads to prevent dicing residue from damaging or scratching the conducting pads. According to another embodiment, a chip protection layer, an additional etching stop layer formed thereon, or a metal etching stop layer level with conducting pads or combinations thereof may be used when etching an intermetal dielectric layer at a structural etching region and a silicon substrate to form an opening for subsequent semiconductor manufacturing processes. | 06-02-2011 |
20110127681 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer. | 06-02-2011 |
20110248310 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes a substrate having an upper surface and a lower surface and having at least a side surface, and at least a trench extending from the upper surface towards the lower surface and extending from the side surface towards an inner portion of the substrate, wherein a width of the trench near the upper surface is not equal to a width of the trench near the lower surface, and at least an insulating layer located on a sidewall of the trench, and at least a conducting pattern located on the insulating layer, wherein the side surface is separated from the conducting pattern in the trench by a predetermined distance such that a portion of the insulating layer is exposed, and at least a conducting region electrically connected to the conducting pattern. | 10-13-2011 |
20130316499 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer. | 11-28-2013 |
Chia-Ming Cheng, New Taipei City TW
Patent application number | Description | Published |
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20110227210 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package, which includes: a substrate having an upper surface and a lower surface; a passivation layer located overlying the upper surface of the substrate; a plurality of conducting pad structures disposed overlying the upper surface of the substrate, wherein at least portions of upper surfaces of the conducting pad structures are exposed; a plurality of openings extending from the upper surface towards the lower surface of the substrate; and a plurality of movable bulks located between the openings and connected with the substrate, respectively, wherein each of the movable bulks is electrically connected to one of the conducting pad structures. | 09-22-2011 |
20120292744 | CHIP PACKAGE, METHOD FOR FORMING THE SAME, AND PACKAGE WAFER - An embodiment of the invention provides a chip package which includes: a substrate, wherein the substrate is diced from a wafer; a device region formed in the substrate; a conducting layer disposed on the substrate and electrically connected to the device region; an insulating layer disposed between the substrate and the conducting layer; and a material layer formed on the insulating layer, wherein the material layer has a recognition mark, and the recognition mark shows position information of the substrate in the wafer before the substrate is diced from the wafer. | 11-22-2012 |
20130119556 | CHIP PACKAGE - A chip package includes: a substrate having a first surface, a second surface, and a side surface connecting the first and the second surfaces; a dielectric layer located on the first surface; conducting pads comprising a first and a second conducting pads located in the dielectric layer; openings extending from the second surface towards the first surface and correspondingly exposing the conducting pads, wherein a first opening of the openings and a second opening of the openings next to the first opening respectively expose the first and the second conducting pads and extend along a direction intersecting the side surface of the substrate to respectively extend beyond the first and the second conducting pads; and a first and a second wire layers located on the second surface and extending into the first the second openings to electrically contact with the first and the second conducting pads, respectively. | 05-16-2013 |
20130193520 | POWER MOSFET PACKAGE - A power MOSFET package includes a semiconductor substrate having opposite first and second surfaces, having a first conductivity type, and forming a drain region, a doped region extending downward from the first surface and having a second conductivity type, a source region in the doped region and having the first conductivity type, a gate overlying or buried under the first surface, wherein a gate dielectric layer is between the gate and the semiconductor substrate, a first conducting structure overlying the semiconductor substrate, having a first terminal, and electrically connecting the drain region, a second conducting structure overlying the semiconductor substrate, having a second terminal, and electrically connecting the source region, a third conducting structure overlying the semiconductor substrate, having a third terminal, and electrically connecting the gate, wherein the first, the second, and the third terminals are substantially coplanar, and a protection layer between the semiconductor substrate and the terminals. | 08-01-2013 |
20130196470 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - A chip package includes a substrate having a pad region, a device region, and a remained scribe region located at a periphery of the substrate; a signal and an EMI ground pads disposed on the pad region; a first and a second openings penetrating into the substrate to expose the signal and the EMI ground pads, respectively; a first and a second conducting layers located in the first and the second openings and electrically connecting the signal and the EMI ground pads, respectively, wherein the first conducting layer and the signal pad are separated from a periphery of the remained scribe region, and wherein a portion of the second conducting layer and/or the EMI ground pad extend(s) to a periphery of the remained scribe region; and a third conducting layer surrounding the periphery of the remained scribe region to electrically connect the second conducting layer and/or the EMI ground pad. | 08-01-2013 |
20130316494 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package, which includes: a substrate having an upper surface and a lower surface; a passivation layer located overlying the upper surface of the substrate; a plurality of conducting pad structures disposed overlying the upper surface of the substrate, wherein at least portions of upper surfaces of the conducting pad structures are exposed; a plurality of openings extending from the upper surface towards the lower surface of the substrate; and a plurality of movable bulks located between the openings and connected with the substrate, respectively, wherein each of the movable bulks is electrically connected to one of the conducting pad structures. | 11-28-2013 |
20140113412 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - An embodiment of the present invention relates to a chip package and fabrication method thereof, which includes a chip protection layer or an additional etching stop layer to cover conducting pads to prevent dicing residue from damaging or scratching the conducting pads. According to another embodiment, a chip protection layer, an additional etching stop layer formed thereon, or a metal etching stop layer level with conducting pads or combinations thereof may be used when etching an intermetal dielectric layer at a structural etching region and a silicon substrate to form an opening for subsequent semiconductor manufacturing processes. | 04-24-2014 |
20140264785 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle. | 09-18-2014 |
20140312482 | WAFER LEVEL ARRAY OF CHIPS AND METHOD THEREOF - A wafer level array of chips is provided. The wafer level array of chips comprises a semiconductor wafer, and a least one extending-line protection. The semiconductor wafer has at least two chips, which are arranged adjacent to each other, and a carrier layer. Each chip has an upper surface and a lower surface, and comprises at least one device. The device is disposed upon the upper surface, covered by the carrier layer. The extending-line protection is disposed under the carrier layer and between those two chips. The thickness of the extending-line protection is less than that of the chip. Wherein the extending-line protection has at least one extending-line therein. In addition, a chip package fabricated by the wafer level array of chips, and a method thereof are also provided. | 10-23-2014 |
20140327152 | CHIP PACKAGE - A chip package includes: a substrate having a first surface, a second surface, and a side surface connecting the first and the second surfaces; a dielectric layer located on the first surface; conducting pads comprising a first and a second conducting pads located in the dielectric layer; openings extending from the second surface towards the first surface and correspondingly exposing the conducting pads, wherein a first opening of the openings and a second opening of the openings next to the first opening respectively expose the first and the second conducting pads and extend along a direction intersecting the side surface of the substrate to respectively extend beyond the first and the second conducting pads; and a first and a second wire layers located on the second surface and extending into the first the second openings to electrically contact with the first and the second conducting pads, respectively. | 11-06-2014 |
20140332985 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - A chip package and a fabrication method thereof are provided according to an embodiment of the invention. The chip package includes a semiconductor substrate containing a chip and having a device area and a peripheral bonding pad area. A plurality of conductive pads is disposed at the peripheral bonding pad area and a passivation layer is formed over the semiconductor substrate to expose the conductive pads. An insulating protective layer is formed on the passivation layer at the device area. A packaging layer is disposed over the insulating protective layer to expose the conductive pads and the passivation layer at the peripheral bonding pad area. The method includes forming an insulating protective layer to cover a plurality of conductive pads during a cutting process and removing the insulating protective layer on the conductive pads through an opening of a packaging layer. | 11-13-2014 |
20150097299 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A method for forming a chip package is provided. A first substrate is provided. A second substrate is attached on the first substrate, wherein the second substrate has a plurality of rectangular chip regions separated by a scribed-line region. A portion of the second substrate corresponding to the scribed-line region is removed to form a plurality of chips on the first substrate, wherein at least one bridge portion is formed between adjacent chips. A chip package formed by the method is also provided. | 04-09-2015 |
20150228536 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. | 08-13-2015 |
20150228557 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess. A method for forming the chip package is also provided. | 08-13-2015 |
20150255499 | CHIP PACKAGE AND METHOD OF FABRICATING THE SAME - A chip package includes a semiconductor chip, insulation layer, redistribution layer and packaging layer and is formed with a cavity. The semiconductor chip has an electronic component and a conductive pad. The conductive pad and the electronic component are disposed on an upper surface of the semiconductor chip and electrically connected. The cavity opens from a lower surface of the semiconductor chip and tapers toward the upper surface to expose the conductive pad. The insulation layer coats the lower surface and a portion of the cavity. The insulation layer is formed with a gap to expose the conductive pad. The redistribution layer coats the lower surface and a portion of the cavity and is electrically connected to the conductive pad through the gap. The packaging layer coats the lower surface and a portion of the cavity. | 09-10-2015 |
20150270236 | CHIP PACKAGE AND METHOD THEREOF - The present invention provides a chip package that includes a semiconductor chip, at least one recess, a plurality of first redistribution metal lines, and at least one protrusion. The semiconductor chip has a plurality of conductive pads disposed on an upper surface of the semiconductor chip. The recess extends from the upper surface to a lower surface of the semiconductor chip, and is arranged on the side of the semiconductor chip. The first redistribution metal lines are disposed on the upper surface, electrically connected to the conductive pad individually, and extended into the recesses separately. The protrusion is disposed in the recess and located between the adjacent first redistribution metal lines. | 09-24-2015 |
20160141254 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle. | 05-19-2016 |
Chia-Ming Chiang, Bade City TW
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20120092308 | DISPLAY PANEL - A display panel comprises a display area having a plurality of pixel units for displaying images; a driving circuit for driving the pixel units and being arranged outside the display area; a plurality of signal lines having unequal resistances, and being electrically connected between the display area and the driving circuit for transmitting signals; and a plurality of layer jumpers for compensating the resistances of the signal lines and being disposed on the signal lines so that each of the signal lines having a compensated resistance, wherein the layer jumpers are utilized for making the compensated resistances of the respective signal lines to match each other. The display panel is capable of improving image display quality and providing a higher efficiency of resistance compensation for a unit of layout space. | 04-19-2012 |
Chia-Ming Ho, Banciao City TW
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20090007035 | Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits - A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC. | 01-01-2009 |
20110023003 | Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits - A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC. | 01-27-2011 |
20120260225 | Accurate Parasitic Capacitance Extraction for Ultra Large Scale Integrated Circuits - A system and method for extracting the parasitic contact/via capacitance in an integrated circuit are provided. Parasitic extraction using this system can lead to an improved accuracy on contact/via parasitic capacitance extraction by taking into account of the actual contact/via shape and size variation. The common feature of the various embodiments includes the step of generating a technology file, in which the contact/via capacitance in the capacitance table is derived from an effective contact/via width table. Each element of the effective contact/via width table is calibrated to have a parasitic capacitance matching to that of an actual contact/via configuration occurring in an IC. | 10-11-2012 |
Chia-Ming Hsieh, Miao-Li County TW
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20120008189 | DISPLAY ELEMENT, DISPLAY APPARATUS AND FABRICATING METHOD OF THE DISPLAY ELEMENT - A display element, a display apparatus and a fabricating method of a display element are provided. The display apparatus includes a first substrate, a second substrate and a display medium layer. The display medium layer is disposed between a first electrode layer of the first substrate and a second electrode layer of the second substrate. The display medium layer has a plurality of display elements. Each display element includes a colorized capsule, a fluid and a plurality of particles. The fluid and the particles are disposed in the colorized capsule, and the particles are charged. The fabricating method of a display element is coloring a capsule of a display element with dye to form a colorized capsule. | 01-12-2012 |
Chia-Ming Hsieh, Tainan City TW
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20120274626 | Stereoscopic Image Generating Apparatus and Method - A depth map generating device. A first depth information extractor extracts a first depth information from a main two dimensional (2D) image according to a first algorithm and generates a first depth map corresponding to the main 2D image. A second depth information extractor extracts a second depth information from a sub 2D image according to a second algorithm and generates a second depth map corresponding to the sub 2D image. A mixer mixes the first depth map and the second depth map according to adjustable weighting factors to generate a mixed depth map. The mixed depth map is utilized for converting the main 2D image to a set of three dimensional (3D) images. | 11-01-2012 |
Chia-Ming Hsieh, Keelung City TW
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20130265272 | TOUCH DISPLAY PANEL - A touch display panel including a substrate, a touch unit, a display unit, a circuit film and a flexible circuit board is provided. The substrate has a display region and a peripheral region surrounding the display region. The touch unit is disposed on the substrate and located in the display region. The display unit is disposed on the touch unit and located in the display region of the substrate. The circuit film is disposed on the substrate and located in the peripheral region, wherein the circuit film is electrically connected to the touch unit, and the circuit film has a plurality of key patterns. The flexible circuit board is electrically connected to the touch unit and the circuit film. | 10-10-2013 |
20130295274 | METHOD FOR MANUFACTURING COLOR FILTER SUBSTRATE - A method for manufacturing a color film substrate including the following steps is provided. A substrate is provided. A first conductive black matrix extending along a first direction is formed on the substrate. A color film layer is formed on the substrate, and the normal projections of the color film layer and of the first conductive black matrix on the substrate are not overlapping. A plurality of insulating spacers is formed on the first conductive black matrix, and the height of the insulating spacers is greater than the thickness of the color film layer. A second conductive black matrix extending along a second direction and covering the insulating spacers is formed on the substrate. A passivation layer is formed for covering the first conductive black matrix, the color film layer, the insulating spacers and the second conductive black matrix. A transparent conductive layer is formed on the passivation layer. | 11-07-2013 |
Chia-Ming Hsu, Kaohsiung City TW
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20150340932 | GRAVITY-ASSISTED ROTATING DRIVING APPARATUS - A gravity-assisted rotating driving apparatus is connected with a horizontal rotating shaft and includes a frame, a pendulum unit, at least one electromagnetic unit, and at least one sensor switch unit. The frame is mounted on the rotating shaft and has an inner space formed inside the frame. The pendulum unit is located in the inner space of the frame and is rotatably mounted on the rotating shaft to form a rotation path. The at least one electromagnetic unit is disposed in the inner space and is arranged along the rotation path. The at least one sensor switch unit is mounted in the frame and is disposed in the inner space. When the pendulum unit passes the adjacent sensor switch unit, the corresponding sensor switch unit controls the corresponding electromagnetic unit to start or stop generating magnetic force and to rotate the pendulum unit. | 11-26-2015 |
20150349620 | HORIZONTALLY ROTATING DRIVING APPARATUS - A horizontally rotating driving apparatus is connected with a longitudinal rotating shaft and includes a frame, a rotating unit, multiple electromagnetic units and multiple sensor switch units. The frame is mounted on the rotating shaft and has an inner space formed inside the frame. The rotating unit is located in the inner space of the frame and is horizontally and rotatably mounted on the rotating shaft to form a rotation path. The electromagnetic units are disposed in the inner space of the frame and are arranged along the rotation path of the rotating unit. The sensor switch units are mounted in the frame and are disposed in the inner space of the frame at identical intervals. When one of the magnetic portions passes the sensor switch units, the sensor switch units sequentially control the electromagnetic units to start or to stop generating magnetic force and rotate the rotating unit. | 12-03-2015 |
Chia-Ming Hsu, Taipei City TW
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20140270218 | WIRELESS ELECTRONIC STETHOSCOPE - A wireless electronic stethoscope device is disclosed. The wireless electronic stethoscope device includes a pen-shaped main body; a sensor module for data collection; a processor module to coordinate operation of electronic stethoscope modules; a wireless communication module to transmit and receive digital and analog data; a power module including a battery for storing energy; a control module to communicate information and receive operational commands. | 09-18-2014 |
Chia-Ming Hsu, Hsinchu TW
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20120185639 | ELECTRONIC DEVICE, MEMORY CONTROLLING METHOD THEREOF AND ASSOCIATED COMPUTER-READABLE STORAGE MEDIUM - An electronic device including a NAND flash memory, an auxiliary memory, and a controller is provided. A code for detecting a read command sequence of the NAND flash memory is stored in the auxiliary memory. During a boot procedure of the electronic device, the controller reads the code from the auxiliary memory and executes the code to obtain the read command sequence of the NAND flash memory, so as to access content stored in the NAND flash memory according to the read command sequence. | 07-19-2012 |
Chia-Ming Hsu, Tu-Cheng TW
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20130133914 | HOUSING OF ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - A housing of electronic device includes a metallic substrate, a copper layer formed on the metallic substrate, and a heat dissipation layer formed on the copper layer. A method for manufacturing the housing is also provided. | 05-30-2013 |
Chia-Ming Hsu, Taoyuan Hsinen TW
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20090269196 | FAN AND AIRFLOW GUIDING STRUCTURE THEREOF - A fan includes an airflow guiding structure, an impeller and a guiding ring. The outer radius of the airflow guiding structure increases gradually from the top of the airflow guiding structure to the bottom of the airflow guiding structure. The airflow guiding structure includes a plurality of fins and a first space for accommodating a circuit device. The impeller is disposed on the airflow guiding structure and has a hub and several blades. The guiding ring connects to the airflow guiding structure via at least one connecting element. A predetermined distance is arranged between the inner surface of the guiding ring and the outer edges of the blades. An inlet is formed at the top of the guiding ring, and an outlet is formed between the bottom of the guiding ring and the outer surface of a sidewall of the airflow guiding structure. When the impeller rotates, the airflow enters the fan from the inlet and flows along the outer surface of the sidewall of the airflow guiding structure, then the airflow exits the fan through the outlet. The direction of the airflow passing through the outlet is different from the direction of the airflow passing through the inlet. | 10-29-2009 |
Chia-Ming Hu, New Taipei City TW
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20120192033 | STORAGE APPARATUS, METHOD FOR ACCESSING DATA AND FOR MANAGING MEMORY BLOCK - A method for managing a memory block is provided. In this method, a plurality of block tables having different storing priorities is provided. In addition, the number of error correction bits in the memory block is checked. Thereby, in the present invention, data can be stored into the memory block in a block table according to the number of error correction bits in the memory block so that the sequence in which the memory block is used for storing data is determined. | 07-26-2012 |
20120224336 | REMOVABLE DEVICE AND METHOD FOR ESTABLISHING ESD PROTECTION THEREON - For a removable device such as a USB pen drive, two components are relatively moveable with each other by sliding, rotating, or rolling over. When a second component moves with respect to a first component, the clearance between the two components ensures durability of the removable device. As the second component moves to and is configured at an extended position, a first biasing element on the first component abuts and pushed a second biasing element on the second component so that ground nodes of the second component contact with a conductive section of the first component. The ground path way is then established for ESD protection. As the second component moves out of the extend position, the connection between the ground nodes and the conductive section no longer exists and the clearance between the two components exists again. | 09-06-2012 |
20150327300 | VEHICLE-MOUNTED DEVICE, METHOD AND ARTICLE OF MANUFACTURE FOR CONTROLLING THE SAME - A vehicle-mounted device, a method and an article of manufacture for controlling the same are provided. The method for controlling the vehicle-mounted device storing at least one first parameter value therein includes steps as follows. At least one second parameter value is provided to a mobile device; the mobile device and the vehicle-mounted device are communicatively connected; a determination is made as to whether a difference exists between the first parameter value and the second parameter value; by replacing the first parameter value in the vehicle-mounted device with the second parameter value when the difference exists, the vehicle-mounted device is set according to the second parameter value such that the vehicle-mounted device operates according to the second parameter value. | 11-12-2015 |
20160103670 | FIRMWARE UPDATING METHOD AND ELECTRONIC APPARATUS USING THE SAME - The disclosure discloses a firmware updating method for updating a main firmware component of an electronic apparatus electrically connected with a removable memory device. The method includes: (a) performing a firmware updating procedure to copy a firmware updating component from the removable memory device to the electronic apparatus, and to update the main firmware component by using the firmware updating component in the removable memory device; (b) deleting the firmware updating component and then rebooting the electronic device if the firmware updating procedure is successfully finished, or directly rebooting the electronic device if the firmware updating procedure is unsuccessfully finished; (c) determining whether the firmware updating component exists in the removable memory device after rebooting the electronic apparatus; and (d) sequentially performing the steps (a) to (c) again if the firmware updating component exists in the removable memory device in the step (c). | 04-14-2016 |
Chia-Ming Huang, Yilan County TW
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20110122160 | COLOR CALIBRATOR OF DISPLAY DEVICE - A color calibrator of a display apparatus is disclosed. The color calibrator includes a color estimator for receiving a plurality of digital counts of initial colors of an image signal. The color estimator includes a first operator, a gray value electrical-optical converter, a mixed-color electrical-optical converter, an initial color electrical-optical converter, a plurality of linear transformers and a weighting operator. The gray value electrical-optical converter, the mixed-color electrical-optical converter and the initial color electrical-optical converter convert a gray value digital count, a mixed color digital count and an initial color digital count for generating a plurality conversion outputs according to a plurality of gray conversion curves, a plurality of mixed color conversion curves and a plurality of initial color converting curve. The weighting operator receives the conversion outputs and a plurality of weighting values to generate an analysis output signal. | 05-26-2011 |
Chia-Ming Huang, Taipei City TW
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20110181976 | POWER-SAVING METHOD AND OPERATING SYSTEM FOR THE SAME - A power-saving method adapted in a hard disk in a computer system having a CPU and a memory module is provided. The power-saving method comprises the following steps. A data-to-be-written is transferred from the memory module through the CPU to the hard disk filter. A determining module is provided to determine whether a data access frequency of the computer system exceeds a threshold value. When the data access frequency exceeds the threshold value, the determining module further determines whether a request-queuing time exceeds an idle-mode activation time. When the request-queuing time exceeds the idle-mode activation time interval, the data-to-be-written is stored in a temporary storage location by the hard disk filter. When a condition of the computer system is satisfied, the data-to-be-written is written to the hard disk to extend the duration of an idle-mode of the hard disk. A power-saving operating system is disclosed herein as well. | 07-28-2011 |
20140195583 | MULTIMEDIA PLAYBACK APPARATUS AND MULTIMEDIA FILE PREFETCHING METHOD - A multimedia playback apparatus and a multimedia file prefetching method are provided. In the method, a first multimedia file is downloaded and played first. Next, at least one playlist is read, and at least one second multimedia file sorted after the first multimedia file in the at least one playlist is searched. Then, the at least one second multimedia file is prefetched. | 07-10-2014 |
Chia-Ming Huang, New Taipei City TW
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20140280467 | METHOD OF MANAGING PORT DHCP SERVER PROTOCOL ADDRESSES - A method of managing port DHCP server protocol addresses is provided, applicable to switch hub. The port DHCP server connects to at least a port and includes port IP address allocation table. When the port try to connect, port DHCP is given priority to receive DHCP discovery message broadcast from port and respond to client. The client can use the default IP address provided by port DHCP server, instead of waiting for floating IP address provided by other DHCP server. When the hardware connected to port is replaced or reset, the hardware automatically obtains default IP address of port. When the port is connected to more than one device with IP, the method allows first device to obtain default IP address of port and other devices automatically obtains floating IP address provided by other DHCP server to shorten waiting time and provide convenient management of each port connection. | 09-18-2014 |
Chia-Ming Hung, Taipei TW
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20150112455 | CONTROL DEVICE WITH AUTOMATIC ADJUSTMENT - A control device with automatic adjustment includes: a GPS module, for receiving a GPS satellite information; and a microcontroller unit, coupled to the GPS module. The microcontroller unit updates a control setting value based on the GPS satellite information from the GPS module, and the microcontroller unit controls a controlled device based on the control setting value. | 04-23-2015 |
20150311168 | STRUCTURE AND METHOD OF PROVIDING A RE-DISTRIBUTION LAYER (RDL) AND A THROUGH-SILICON VIA (TSV) - A method of providing a redistribution layer (RDL) and a through-silicon via (TSV) for a semiconductor package is disclosed. The method comprises preparing a wafer for bonding to a semiconductor package. The wafer comprises a low resistance substrate containing a RDL and a TSV for making an input/output (I/O) connection point of the semiconductor package available at another location. The RDL comprises a conduction path through the low resistance substrate that is bounded on two sides by an isolation trench. The TSV is bounded by the isolation trench and the RDL. Preparing the wafer for bonding may comprise preparing the isolation trench that bounds the conduction path for the RDL through the low resistance substrate and bounds a vertical conduction path in a pillar for the TSV in the low resistance substrate, filling the isolation trench with isolation trench material, and preparing a wafer bonding surface. | 10-29-2015 |
Chia-Ming Kuo, Tainan City TW
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20160142056 | LEVEL SHIFTER OF DRIVING CIRCUIT - A level shifter applied to a driving circuit of a display is disclosed. The level shifter at least includes a first stage of level shifting unit, a second stage of level shifting unit, and two third stage of level shifting units belonging to different power domains and used to perform boost conversion of voltage signals in different power domains. The first stage of level shifting unit includes eight transistors. The second stage of level shifting unit includes four transistors. The two third stage of level shifting units both include six transistors and two output terminals. The level shifter of the driving circuit in this invention makes the output terminals of the two third stage of level shifting units belonging to different power domains to synchronously output the voltage-shifted voltage signals. | 05-19-2016 |
Chia-Ming Lee, Toucheng Town TW
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20080296601 | Light-Emitting Diode Incorporating an Array of Light Extracting Spots - A light-emitting diode includes an optical layer formed in an array of substantially equidistant light extracting spots integrated to its multi-layered structure. The array of light extracting spots includes a distribution of juxtaposed hexagon patterns. The layer thickness of the light extracting spots is less than 800 Å. | 12-04-2008 |
20110006307 | Group III-Nitride Semiconductor Schottky Diode and Its Fabrication Method - A group III-nitride semiconductor Schottky diode comprises a conducting substrate having a first surface, a stack of multiple layers including a buffer layer and a semiconductor layer sequentially formed on the first surface, wherein the semiconductor layer comprises a group III nitride compound, a first electrode on the semiconductor layer, and a second electrode formed in contact with the first surface at a position adjacent to the stack of multiple layers. In other embodiments, the application also describes a method of fabricating the group III-nitride semiconductor Schottky diode. | 01-13-2011 |
Chia-Ming Liang, Taoyuan Shien TW
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20150071646 | RACK SERVER - Provided herein is a rack server including a rack, a plurality of system boards and a fan plate. The system boards are disposed within the rack, and each system board has a first wireless transceiver. The fan plate is also disposed within the rack, and the fan plate has a plurality of second transceivers, and the second transceivers are wirelessly connected to the first transceivers, respectively. | 03-12-2015 |
Chia-Ming Lin, Taipei TW
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20110216007 | KEYBOARDS AND METHODS THEREOF - An integrated keyboard includes a touch pad and a dynamic keyboard embedded in an area of the touch pad. The touch pad, which may provide a transparent surface to allow the keyboard to be visible, provides motion tracking in areas around the periphery of the keyboard and may be configured into many operating modes. For example, virtual touchable buttons may be configured in the periphery of the keyboard. The keyboard may be provided as a dynamic keyboard with various layouts. A keyboard protector may be provided for each layout, with printed symbols for the keys under the layout. The integrated keyboard may also include a mini-projector to allow projection of a large image on a surface and a virtual Human Interface Device (HID) system to facilitate data input. With the input capabilities of the touch pad and the keyboard, the projector may be controlled in many additional ways not available in conventional projectors that are controlled by a few buttons. The virtual HID may provide motion tracking. The integrated keyboard may interface with a master/slave device, such as a slate type device. A customized case tightly integrates the integrated keyboard with the master/slave device. | 09-08-2011 |
20120011293 | Intelligent Platform - An intelligent platform integrates with an intelligent portable device or intelligent core to provide a dynamic computer that may serve as any of: a pad, a tablet computing device, a netbook computer, and a notebook computer. The operations of the integrated device are determined by the connected intelligent core's CPU architecture and its installed operating system. The intelligent platform includes a housing and a core slot located behind a display for accommodating the intelligent core. A core connector is provided on an inner wall of the core slot for interconnecting with a compatible connector of the inserted intelligent core. A control unit continually communicates with the intelligent core through signals carried by the connector, refreshes image received from the intelligent core on its touch-sensitive display, and sends touch-input commands from the touchable panel of the touch-sensitive display to the intelligent core. The battery on intelligent platform provides backup power to the intelligent core. | 01-12-2012 |
20120268399 | DUAL DISPLAYS COMPUTING DEVICE - A dynamic dual displays system is coupled with a computing device to provide at least two display panels for single user or multiple user applications. In one embodiment, two display panels are provided in a back-to-back configuration connected by a hinge to allow rotation motion of the display panels relative to each other. Depending on the relative positions of the display panels and the computing device, the combined system provides a hybrid device that may dynamically serve as a notebook or a tablet computer. The multiple display panels may present the same or different contents simultaneously, depending on application. In a multi-user application, the display panels may be presented to different users, one of which accepts input data through a touch-sensitive surface on the corresponding display panel. | 10-25-2012 |
20140257591 | MODULAR COMPUTER AND THERMAL MANAGEMENT - An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets. | 09-11-2014 |
Chia-Ming Lin, Taipei City TW
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20130289423 | BLOOD PRESSURE GAUGE HAVING MEMS MICROPHONE - A blood pressure gauge comprises a cuff, a gas pump, a pressure relief valve, a pressure sensor, a gas conduit, a MEMS microphone and a controller. The cuff has a gas bag. The gas pump is used for inflating and pressurizing the gas bag. The pressure relief valve is used for deflating and depressurizing the gas bag. The pressure sensor is used for detecting the pressure of the gas bag. The gas conduit connects the gas bag, the gas pump, the pressure relief valve and the pressure sensor to form a gas loop. The gas loop delivers gas among the gas bag, the gas pump, the pressure relief valve and the pressure sensor. The MEMS microphone is disposed at a specified location of the gas loop for detecting the Korotkoff sounds transmitted from the passing gas. The controller is used for monitoring and controlling the gas pump, the pressure relief valve, the pressure sensor and the MEMS microphone. | 10-31-2013 |
Chia-Ming Lin, Science Park TW
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20150286027 | OPTICAL LENS BARREL AND OPTICAL LENS MODULE HAVING THE SAME - An optical lens module includes a barrel holder, an optical lens barrel, a first thread, a second thread and a plurality of engaging protrusions. The first thread is formed on one of the barrel holder and the optical lens barrel. The second thread is formed on the other one of the barrel holder and the optical lens barrel. The engaging protrusions extend from the root of the first thread for contact with the crest of the second thread. Each of the engaging protrusions has an end surface disposed between the crest and the root of the first thread. A clearance is formed between the crest of the first thread and the root of the second thread and between the root of the first thread and the crest of the second thread. | 10-08-2015 |
Chia-Ming Liu, Hsinchu TW
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20140069613 | COOLING APPARATUS HAVING A COOLING CONDUIT - A cooling apparatus is disclosed. The cooling apparatus includes a carrier and a flat-plate type cooling conduit. The flat-plate type cooling conduit is made of a high thermal conductive material and disposed on or in the carrier. The flat-plate type cooling conduit includes a conduit portion and a flat plate portion. The conduit portion has a conducting hole for conducting a coolant, and the flat plate portion is adhered to the carrier for allowing the coolant to perform heat exchange through a large contact area between the flat plate portion and the carrier. In addition, a cooling source gel can be used to perform heat exchange with the coolant in the conducting hole in order to improve the heat exchange efficiency of the cooling apparatus, and to effectively reduce the temperature of the carrier. | 03-13-2014 |
Chia-Ming Liu, Dou-Lio City, Yun-Lin County TW
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20150061483 | CABINET DRAWER ASSEMBLY HAVING A DRAWER LOCKING DEVICE - A drawer assembly is disposed in a storage cabinet. The cabinet includes an upright drawer supporting plate. The drawer assembly includes a drawer and a drawer locking device. The drawer locking device includes a retaining unit and a handle unit. The retaining unit includes a stop member connected fixedly to the drawer supporting plate, and a swing arm. An arm body of the swing arm has a hooked free end that is hooked onto the stop member so as to prevent forward movement of the drawer relative to the drawer supporting plate. The handle unit is operable to rotate and remove the hooked free end of the swing arm from the stop member. | 03-05-2015 |
Chia-Ming Liu, Dou-Lio City TW
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20140102434 | STOVE - A stove for smoking and roasting food includes a stove unit having a top surface, a supporting frame disposed behind the stove unit, a cover unit disposed above the top surface, a guiding unit, and a cantilever unit. The cover unit has two joint connection portions on opposite sides thereof. The guiding unit has a pair of guiding elements disposed on the supporting frame and a pair of sliding elements disposed on the cover unit. The guiding elements cooperate with the sliding elements to guide and retain the cover unit during up-and-down movement thereof in a vertical direction. The cantilever unit interconnects the cover unit and the supporting frame for driving the cover unit to move with respective to the top surface. | 04-17-2014 |
Chia-Ming Liu, Redmond, WA US
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20130001709 | SYSTEMS AND METHODS FOR VERTICALLY STACKING A SENSOR ON AN INTEGRATED CIRCUIT CHIP - A sensing unit package with reduced size and improved thermal sensing capabilities. An exemplary package includes a printed circuit board with a plurality of electrical traces, an application-specific integrated circuit (Analog ASIC) chip, and a micromachined sensor formed on a microelectromechanical system (MEMS) die. The Analog ASIC chip is electrically and mechanically attached to the printed circuit board. The MEMS die is in direct electrical communication with only a portion of the electrical traces of the printed circuit board and is mechanically and thermally attached directly to the Analog ASIC chip. A thermally conducting compound is located between the MEMS die and the Analog ASIC chip. One or more solder balls electrically attach the Analog ASIC chip to the printed circuit board and one or more solder traces electrically attach the MEMS die to the printed circuit board. | 01-03-2013 |
Chia-Ming Liu, Puli TW
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20130169296 | IMPEDANCE ANALYZER - An impedance analyzer includes: a control voltage generating unit for generating a control voltage that has a predetermined amplitude value; a measuring unit operable to provide an output current, which has an amplitude value corresponding to that of the control voltage, for flowing through first and second body portions of a biological target, and to generate a measurement voltage that has an amplitude value corresponding to a difference between voltages at the first and second body portions attributed to flow of the output current therethrough; and a calculating module operable to determine an electrical impedance between the first and second body portions according to a predetermined adjustment value and the amplitude value of the measurement voltage. | 07-04-2013 |
Chia-Ming Sung, Zhubei City TW
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20150076542 | LIGHT EMITTING MODULE - The present disclosure provides a light emitting module, which includes a base board, a light emitting diode chip, a transparent thermoplastic layer, and fluorescent glue. The base board includes a die-bonding zone. The light emitting diode chip is bonded on the die-bonding zone. The light emitting diode chip includes an upper surface, a lower surface opposite to the upper surface, and a plurality of side surfaces adjoined between the upper surface and lower surfaces. A transparent thermoplastic layer encloses at least one portion of the light emitting diode chip. The fluorescent glue disposed over to cover the base board, the light emitting diode chip, and the transparent thermoplastic layer. | 03-19-2015 |
Chia-Ming Sung, Hsinchu County TW
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20140217440 | LIGHT-EMITTING MODULE AND MANUFACTURING METHOD THEREOF - A light-emitting module includes a first conductive lead frame, a second conductive lead frame physically separated from the first conductive lead frame, a protective plastic layer, a reflective plastic layer, and a light-emitting die. The protective plastic layer surrounds the first and second conductive lead frames, and an accommodating space s defined by the protective plastic layer, and the first and second conductive lead frames. Inner surfaces of the first and second conductive lead frames are exposed through the accommodating space. The accommodating space further includes a die-mounting region. The reflective plastic layer is formed on the inner surfaces within the accommodating space. The light-emitting die is located on the die-mounting region and is electrically connected to the first and second conductive lead frames. The light-emitting die protrudes from the reflective plastic layer. | 08-07-2014 |
20150069450 | LIGHT EMITTING MODULE - The present disclosure provides a light emitting module including a substrate, a light emitting diode, a first adhesive glue, and a second adhesive glue. The substrate has a first electrode and a second electrode. The light emitting diode is disposed on the substrate and has a third electrode and a fourth electrode. The first adhesive glue is located between the first electrode and the second electrode so as to enable the first electrode to be electrically connected to the second electrode. The second adhesive glue is located between the third electrode and the fourth electrode, so as to enable the third electrode to be electrically connected to the fourth electrode. The first adhesive glue includes a first conductive body and a first insulation body surrounding the first conductive body. The second adhesive glue includes a second conductive body and a second insulation body surrounding the second conductive body. | 03-12-2015 |
Chia-Ming Tai, New Taipei City TW
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20140377961 | THIN FILM DEPOSITION APPARATUS WITH MULTI CHAMBER DESIGN AND FILM DEPOSITION METHODS - A multi chamber thin film deposition apparatus and a method for depositing films, is provided. Each chamber includes a three dimensional gas delivery system including process gases being delivered downwardly toward the substrate and laterally toward the substrate. A pumping system includes an exhaust port in each chamber that is centrally positioned underneath the substrate being processed and therefore the gas flow around all portions of the edge of the substrate are equally spaced from the exhaust port thereby creating a uniform gas flow profile which results in film thickness uniformity of films deposited on both the front and back surfaces of the substrate. The deposited films demonstrate uniform thickness on the front and back of the substrate and extend inwardly to a uniform distance on the periphery of the backside of the substrate. | 12-25-2014 |
20150027489 | MECHANISMS FOR CLEANING WAFER AND SCRUBBER - Embodiments of mechanisms for cleaning a wafer are provided. A method for cleaning a wafer includes cleaning a wafer by using a wafer scrubber and cleaning the wafer scrubber in a scrubber cleaning module. An agitated cleaning liquid is applied on the wafer scrubber to clean the wafer scrubber. The method also includes cleaning the wafer or a second wafer by the wafer scrubber after the wafer scrubber is cleaned by the agitated cleaning liquid. | 01-29-2015 |
Chia-Ming Tsai, Taipei TW
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20100112326 | COMPOUND MATERIAL MEMBER AND THE MANUFACTURING METHOD THEREOF - A composite material member including a rubber element and a composite fiber element is manufactured by integrally combining rubber and composite fiber. A method for manufacturing the composite material member is also provided. In this method, the composite fiber element whether being thermosetting or not is disposed in a first mold of a mold. The composite fiber element is a structure of at least one fiber layer wrapped with resin. The first mold and a second mold of the mold are then closed. Finally, the cavity is filled with rubber. Different forming environments are provided according to whether the composite fiber element is thermosetting or not to form and fix the rubber element on the resin of the composite fiber element. | 05-06-2010 |
20140084770 | DOOR ASSEMBLY - A door assembly for use with a computing device that includes a housing that defines an opening to an interior of the housing is disclosed herein. An example of door assembly includes a cover positionable over the opening in a secure closed position to help prohibit access to the interior of the housing and away from the opening in an open position allow access to the interior of the housing. The example door assembly also includes a flange assembly connected to the cover and coupled to the housing to translate within a cavity in the housing and create a hinge about which the cover moves from the closed position to the open position. The door assembly further includes an opening mechanism to release the cover from the secure closed position to the open position. Other examples of a door assembly are also disclosed herein. | 03-27-2014 |
Chia-Ming Tsai, Tainan City TW
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20140172293 | MAP MATCHING DEVICE, SYSTEM AND METHOD - A map matching device for a positioning device includes an inertial detect module, measuring a moving signal generated from the positioning device, a movement estimation module, estimating location information of the positioning device according to the moving signal, a map data storage module, storing a plurality of types of map feature information of an environment where the positioning device is located, and a matching module, matching the location information with the plurality of types of map feature information for performing map matching processes, and providing a positioning coordinate. | 06-19-2014 |
Chia-Ming Tsai, Hsinchu City TW
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20140132323 | LATCH APPARATUS AND APPLICATIONS THEREOF - A latch apparatus and applications thereof are provided. The latch apparatus consists of a latch circuit and a switchable DC block unit. The switchable DC block unit is coupled to the latch circuit, and configured to: isolate a cross-coupling path in the latch circuit and store a voltage difference before the latch apparatus performs the latching operation; and when the latch apparatus performs the latching operation, provide the stored voltage varying with time to increase the overdrive voltage of at least one transistor in the latch circuit (increase the transistor transconductance), so that the latch apparatus maintains high speed operation at low supply voltage. | 05-15-2014 |
20150061730 | LATCH AND OPERATION METHOD THEREOF AND COMPARATOR - A latch, an operation method of the latch, and a comparator using the latch are disclosed. The latch includes first and second cross-coupled pairs and first and second transistor pairs. First terminals of the first and second current paths of the first cross-coupled pair are respectively coupled to first terminals of the first and second transistors of the first transistor pair. First terminals of the third and fourth current paths of the second cross-coupled pair are respectively coupled to first terminals of the third and fourth transistors of the second transistor pair. Control terminals of the third and fourth transistors are respectively coupled to the first and second current paths. Control terminals of the first and second transistors are respectively coupled to the third and fourth current paths. | 03-05-2015 |
Chia-Ming Tsai, Yung-He City TW
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20090009005 | Control method for parallel redundant power system - A method for controlling the power system is presented. The power system is composed of at least one inverter for supplying AC power to a load through a bus, a phase lock system to synchronize all output voltages of the inverters and a current sharing circuit to properly distribute the load current among all inverters. Each inverter is controlled by an unbalanced power to limit the increase of its cross current. Moreover, the information related to DC bus voltage is further applied to control the inverters, whereby the cross current is mitigated and entire power system is operated steadily. | 01-08-2009 |
Chia-Ming Tsai, Taipei City TW
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20100143648 | FIBER-REINFORCED POLYMERIC CASING AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a fiber-reinforced polymeric casing and a method for manufacturing the same. According to this invention, the casing includes a multi-layer structure, an intermedium film, and a structural part. The multi-layer structure is formed by shaping and stacking up a plurality of layers of fiber-reinforced polymeric mats. The intermedium film is disposed on a surface of the multi-layer structure. The structural part includes a polymer and is one-step molded on the intermedium film together with the multi-layer structure. | 06-10-2010 |
20100143650 | CASING AND METHOD FOR MANUFACTURING THE SAME - This invention discloses a casing and a method for manufacturing the same. The casing includes a fiber-reinforced thermosetting polymeric mat and a fiber-reinforced thermoplastic polymeric mat. The fiber-reinforced thermosetting polymeric mat is molded to have a predetermined shape with a curved inner surface. The fiber-reinforced thermoplastic polymeric mat is molded on the inner surface of the fiber-reinforced thermosetting polymeric mat and agrees with the curved inner surface. | 06-10-2010 |
20100236020 | HINGE DEVICE - A hinge device includes a bearing seat, a spherical joint, a plurality of positioning pins, and a retaining ring. The bearing seat has a containing recess. The spherical joint is rotatably disposed in the containing recess, and the surface of the spherical joint has a plurality of positioning holes. The positioning pins are disposed at the bearing seat and capable of sliding toward or away from the spherical joint. The positioning pins correspond to parts of the positioning holes respectively when the spherical joint rotates to a specific position relative to the bearing seat. The retaining ring is disposed at an opening of the containing recess of the bearing seat and surrounds the positioning pins, the retaining ring is against the positioning pins to allow the positioning pins to be fastened in the corresponding positioning holes when the spherical joint rotates to the specific position relative to the bearing seat. | 09-23-2010 |
20130168897 | METHOD FOR MANUFACTURING FIBER-REINFORCED POLYMERIC CASING - This invention discloses a method for manufacturing a fiber-reinforced polymeric casing. According to this invention, the method includes the steps of shaping and stacking up a plurality of layers of fiber-reinforced polymeric mats to build a multi-layer structure, disposing an intermedium film on a surface of the multi-layer structure, and performing an one-step molding process to form a structural part including a polymer on the intermedium film and the multi-layer structure. | 07-04-2013 |
20150195937 | ELECTRONIC DEVICE INCLUDING RETRACTABLE BOLT MEMBER - In one implementation, an electronic device comprises a first housing portion including a wall and a detent member on the interior of the wall and a second housing portion to attach to the first housing portion to form an enclosure. A retractable bolt member mounted in the second housing portion can engage the detent member in a first position and can disengage the detent member in a second position. The bolt member can be resiliently biased to the first position and at least part of the bolt member has magnetic properties that force the bolt member to be repelled to the second position if a magnetic field is applied outside the wall adjacent the detent to interact with the bolt member, so that the first housing portion can be detached from the second housing portion. | 07-09-2015 |
20150220108 | LATCH FOR A COMPUTER CASE - A latch is disclosed. The latch has a hook that rotates to engage with a case for a computer. The hook has one side fabricated from a ferrous material. The hook is unlatched by placing a magnet near the ferrous material thereby causing the hook to rotate and disengage with the top case. | 08-06-2015 |
Chia-Ming Tsai, Hsinchu County TW
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20150287605 | METHOD FOR FORMING GATE DIELECTRIC LAYER - A method for forming a semiconductor device is provided. The method includes providing a semiconductor substrate. The method includes forming a buffer layer over the semiconductor substrate. The buffer layer is in an amorphous state. The method includes nitriding the buffer layer into a nitride buffer layer. The method includes forming a gate dielectric layer over the nitride buffer layer. The method includes performing a thermal annealing process to convert the gate dielectric layer into a crystalline gate dielectric layer. The method includes forming a gate electrode over the crystalline gate dielectric layer. | 10-08-2015 |
Chia-Ming Tsai, New Taipei City TW
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20160124750 | Power-On Method and Related Server Device - A power-on method for a server device includes generating a stand-by power to a server module of the server device when a blade enable signal is asserted; asserting, by the server module, a power-on signal to a storage module of the server device; performing, by the storage module, a first boot-on process when the storage module receives the asserted power-on signal; transmitting, by the storage module, an asserted ready signal to the server module when the first boot-on process finishes; and performing, by the server module, a second boot-on process via a normal power when the server module receives the asserted ready signal. | 05-05-2016 |
Chia-Ming Wang, Shenkeng Township TW
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20090014972 | Computer cart - A computer cart includes a chassis, which is formed of a first chassis member and a second chassis member that are coupled to each other and movable relative to each other to adjust the width of the chassis, a locking mechanism for locking the first chassis member and the second chassis member, a first retaining panel affixed to the first chassis member in vertical for supporting a computer on the chassis, and a second retaining panel affixed to the second chassis member in vertical for supporting a computer on the chassis. | 01-15-2009 |
20090127418 | Computer dock station - A computer dock station includes a bracket covered with a cover member and having a fence at one side and upright pivot pins on the inside, and a locking mechanism, which includes a motive member, two follower members pivoted to the two opposite ends of the motive member and respectively coupled with the respective sliding slot to the upright pivot pins, two clamps respectively mounted on the follower members outside the bracket, and a screw rod threaded through the motive member and pivoted to the bracket and rotatable to move the motive member and to further turn the follower members about the respective upright pivot pins for adjusting the position of the clamps. | 05-21-2009 |
20090276976 | Hinge assembly - A hinge assembly includes a first swinging member, a second swinging member that has a barrel at one end, a pivot pin inserted through the barrel to pivotally secure the second swinging member to a proximal end of the first swinging member, a guide member, which has a first end inserted through an oblique guide slot on the barrel and pivotally coupled to the pivot pin and a second end provided with a transversely extending screw hole, and an adjustment screw transversely inserted through the proximal end of the first swinging member and threaded into the screw hole of the guide member for allowing rotation by a user to bias the second swinging member relative to the first swinging member. | 11-12-2009 |
Chia-Ming Wang, Taipei City TW
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20160058649 | REHABILITATION DEVICE WITH PACE PATTERN PROJECTING FUNCTION AND SEAT STRUCTURE AND CONTROL METHOD THEREOF - A rehabilitation device with pace pattern projecting function and seat structure and a control method thereof are provided. The rehabilitation device includes a body with a moving module, a projection device, a first sensor and a control system. The projection device projects pace patterns on a walking plane. The first sensor detects a walking situation of a user on the walking plane. Based on the walking situation detected by the first sensor, the control system adjusts a distance between the rehabilitation device and the user by controlling the moving module and adjusts a position of the pace patterns on the walking plane by controlling the projection device. Moreover, a movable seat mechanism is also disposed on the rear of the rehabilitation device. The user can sit down on the movable seat mechanism and towards the front of the rehabilitation device to rest moderately. | 03-03-2016 |
Chia-Ming Wu, Taipei City TW
Patent application number | Description | Published |
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20100032915 | MOTOR VEHICLE AND RICKSHAW AND TILTING MECHANISM THEREOF - A motor vehicle is provided. The motor vehicle comprises a vehicle body, a front wheel, a rear wheel and a tilting mechanism. The front wheel, the rear wheel and the tilting mechanism are disposed on the vehicle body. The tilting mechanism comprises a first compensation unit, a first arm, a first wheel, a second compensation unit, a second arm, a second wheel, at least one pipe and a fluid. The first arm is connected to the first compensation unit, and the first wheel. The second arm is connected to the second compensation unit, and the second wheel. The pipe connects the first compensation unit to the second compensation unit. The fluid flows in the first compensation unit, the second compensation unit and the pipe, wherein when the motor vehicle tilts, an extension length of the first compensation unit equals to a compression length of the second compensation unit. | 02-11-2010 |
20130137270 | METHOD FOR FORMING CONTACT HOLE - A method for forming contact holes includes following steps. A substrate including a dense region and an isolation region is provided. A material layer is formed on the substrate. Sacrificed patterns are formed on the material layer in the dense region, wherein there is a first opening between the two adjacent sacrificed patterns. A spacer is formed on each of two sides of each of the sacrificed patterns, wherein the spacers are separated from each other. The sacrificed patterns are removed to form a second opening between two adjacent spacers. A planar layer is formed to fill up the second openings. A first slit is formed in the planar layer, wherein the first slit exposes a portion of the material layer under the second openings. The portion of the material layer exposed by the first slit is removed to form third openings in the material layer. | 05-30-2013 |
20130166840 | DYNAMIC HARD DISK MAPPING METHOD AND SERVER USING THE SAME - A dynamic hard disk mapping method and a server using the same are disclosed. The server includes a first motherboard, a second motherboard, a first disk group corresponding to the first motherboard, and a second disk group corresponding to the second motherboard. In the dynamic hard disk mapping method, at first, a disk redistributing instruction is received and stored. Thereafter, a reset instruction is received and performed. Then, the number of hard disks of the first disk group and the number of hard disks of the second disk group are summed up to obtain a total hard disk number N, wherein N is a positive integer greater than zero. Thereafter, the disk redistributing instruction is read, and a redistribution computation is performed in accordance with the disk redistributing instruction to obtain a third disk group corresponding to the first motherboard and a fourth disk group corresponding to the second motherboard. | 06-27-2013 |
20150137204 | MEMORY CIRCUIT STRUCTURE AND SEMICONDUCTOR PROCESS FOR MANUFACTURING THE SAME - A semiconductor process for manufacturing particular patterns includes the steps of forming a target layer and evenly-spaced core bodies on a substrate, conformally forming a hard mask layer, forming a first photoresist covering a predetermined region on the hard mask layer wherein the predetermined region encompasses at least two core bodies, performing a first etch process to remove a portion of the hard mask layer outside the predetermined region and expose a number of core bodies, removing the exposed core bodies, forming a second photoresist at least encompassing all the recesses in the predetermined region, and performing a second etch process to pattern the target layer. | 05-21-2015 |
20160043032 | MEMORY CIRCUIT STRUCTURE AND SEMICONDUCTOR PROCESS FOR MANUFACTURING THE SAME - A memory circuit structure includes a substrate, a plurality of word lines disposed and evenly-spaced on the substrate, wherein the width of said word lines is F, and a select gate adjacent to the word lines, wherein the width of the select gate is (7+4n)F, and n is zero or positive integer. | 02-11-2016 |
20160111343 | METHOD OF FABRICATING FLASH MEMORY - A method of fabricating a flash memory includes providing a fin structure. The fin structure includes a floating gate material, an oxide layer and a semiconductive layer. An insulating layer is disposed at two sides of the fin structure. Then, a dielectric layer conformally covers the floating gate material and insulating layer. Later, a patterned first mask layer, a patterned second mask layer, and a control gate are stacked on the dielectric layer from bottom to top. The control gate crosses at least one fin structure. Next, at least one isotropic etching step is performed to entirely remove the exposed dielectric layer. | 04-21-2016 |
Chia-Ming Wu, New Taipei City TW
Patent application number | Description | Published |
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20130340490 | LOCK HAVING SIMPLIFIED STRUCTURE - A lock includes a movable unit and a lock core structure including a restriction unit and a lock core. The restriction unit has a passage penetrating therethrough to form a first opening and a second opening on two opposite sides of the restriction unit. An extension wall is formed in the passage to face the second opening. The lock core is disposed in the passage to couple with the restriction unit and is selectively movable relative to the restriction unit in an axial direction. The lock core has an end face facing the extension wall and an extension portion disposed on one side of the lock core close to the first opening and selectively protruding outside the first opening. The movable unit selectively contacts the lock core and is able to reciprocally rotate, wherein rotation of the movable unit is linked to axial movement of the lock core. | 12-26-2013 |
20140026625 | LOCK FOR ELECTRONIC DEVICE - A lock for an electronic device having a lock hole includes a lock core, a fastener, and an adapter, wherein the lock core is operable and rotatable about a first axis; the fastener is connected to the lock core and is shifted away from the first axis. The adapter is connected to the lock core and the fastener. The rotation of the lock core about the first axis drives the adapter to drive the fastener to rotate about a second axis, When the lock core is locked, the locked lock core restricts the fastener from rotating, when the lock core is unlocked, the fastener is operable to rotate. | 01-30-2014 |
20140069153 | BURGLARPROOF DEVICE FOR ELECTRONIC DEVICE - A burglarproof device for electronic device including a fastener, a control unit, and a lock core is provided. The fastener includes a plurality of lever arms surrounding a virtual axis. The control unit moves relative to the fastener and drives ends of the lever arms to move toward each other when approaching the fastener; the ends of the lever arms move away from each other when the control unit leaves the fastener. The lock core in an unlocked status permits the movement of the control unit relative to the fastener while the lock core in a locked status restricts the control unit from moving relative to the fastener. | 03-13-2014 |
Chia-Ming Yeh, New Taipei TW
Patent application number | Description | Published |
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20130322030 | PRINTED CIRCUIT BOARD - A printed circuit board includes a power supply, a plurality of loads, a copper sheet, and a plurality of metal sheets mounted onto the copper sheet. The copper sheet is electronically connected between the power supply and the loads. The power supply outputs a plurality of currents to the loads via a plurality of current traces passing through the copper sheet, the plurality of metal sheets are located along the plurality of current traces. | 12-05-2013 |
20140211376 | SOLID CAPACITOR - A solid capacitor includes a body, a strip-shaped positive connection terminal and a strip-shaped negative connection terminal extending from the body comprising. Length directions of the positive connection terminal and the negative connection terminal are substantially parallel with each other while width directions of the positive connection terminal and the negative connection terminal are substantially perpendicular to each other. | 07-31-2014 |
20150069984 | BUCK CONVERTER WITH OVERSHOOT PROTECTION - A buck converter includes a pulse width modulation unit, a first switch, a second switch, an inductance, and a sensor near the inductance. The pulse width modulation unit controls the first switch and the second switch power to allow or disallow electrical conduction. The sensor senses the state of the inductance in respect of a sound event, a vibration event, and a drop in current level. When the inductance is saturated and gives rise to one or more of the foregoing events, the sensor sends a signal to the pulse width modulation unit, which controls the first switch to cut off power and the second switch to allow conduction, allowing the inductance to release all its electrical energy. | 03-12-2015 |
20150192605 | FIXING DEVICE FOR PROBE - A fixing device includes a clamping portion and a plurality of suction cups mounted on a bottom surface of the clamping portion. The clamping portion defines a through hole extending through a top surface and the bottom surface of the clamping portion. A plurality of clamping pieces extends from an inner surface bounding the through hole toward the axis of the through hole to clamp the probe extending through the through hole. The suction cups are arranged around the through hole. | 07-09-2015 |