Chi-Te
Chi-Te Chin, Zhongli City TW
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20140014304 | METHOD OF MANUFACTURING HEAT-DISSIPATING DEVICE WITHOUT INJECTION TUBE AND OBJECT MANUFACTURED BY THE METHOD - A method of manufacturing a heat-dissipating device without injection tube and an object manufactured by the method. The method includes the steps of: a) providing an upper casing and a lower casing, wherein a receiving space is defined between the upper casing and the lower casing; b) positioning a capillary and a brace in the receiving space, welding the upper casing and the lower casing in a manner to seal a seam therebetween hermetically, and reserving a crevice; c) sintering; d) injecting a liquid working medium from the crevice into the receiving space; and e) putting the combination of the upper casing and the lower casing into which the liquid working medium has been injected in step d) in a vacuum environment and welding the crevice quickly to seal the crevice hermetically. An exposed heat-dissipating device without injection tube effective in dissipating heat is manufactured by the method. | 01-16-2014 |
Chi-Te Huang, Taoyuan County TW
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20140076773 | FRONT OPENING UNIFIED POD HAVING INLET AND OUTLET - The present invention relates to a front opening unified pod (FOUP) having three inlets and one outlet. Thereby, the mixing region for the moisture, oxygen, and the filled gas can be increased and the removing efficiency of the moisture and oxygen in the FOUP is enhanced, improving the purging efficiency of the FOUP and shortening the time required for filling gas. In addition, the humidity in the FOUP can be reduced effectively so that the internal environment of the FOUP can reach rapidly the condition suitable for semiconductor fabrication. Hence, the subsequent semiconductor processes can be performed and the preparation time for the processes can be shortened. | 03-20-2014 |
20140083902 | PACKAGE STRUCTURE FOR SUBSTRATE STORAGE CONTAINER - A package structure used to load substrate storage containers for convenience of transportation is revealed. The package structure includes a package box and at least one buffer pad. The buffer pad is disposed in the package box and used for loading a substrate storage container. The density of the buffer pad is smaller than 70 kg/m | 03-27-2014 |
20140238896 | SUBSTRATE CONTAINER HAVING LIMIT STRUCTURE - A substrate container having a limit structure includes a box, at least one limit structure and a door. The limit structure is disposed on a side wall of the box and has a plurality of limit grooves. Each limit groove has a first inclined surface and a second inclined surface. The angle of inclination of the second inclined plane relative to a horizontal plane corresponds to a coefficient of friction between materials of the substrate and the limit structure to lower the friction between the substrate and the second inclined plane of the limit groove, so that the substrate can ascend along the second inclined plane to get into the limit groove for the door to be closed smoothly. Through the limit structure to position the substrate, the present invention can prevent the substrate from shaking in the substrate container. | 08-28-2014 |
Chi-Te Lee, Taipei TW
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20140118372 | DISPLAY APPARATUS, DRIVING CHIP SET, AND OPERATING METHOD THEREOF - A driving chip set includes a master chip and at least one slave chip. In the master chip, a master receiving terminal receives a data signal through a first data transmission interface; a processing unit generates a first partial data signal and a second partial data signal according to the data signal; a master buffer registers the first partial data signal; a master output terminal outputs the second partial data signal through a second data transmission interface. In the slave chip, a slave receiving terminal receives the second partial data signal through the second data transmission interface and it is registered by a slave buffer. The processing unit controls a master driver and a slave driver to output the first partial data signal and second partial data signal to a display panel. The display panel displays an image according to the first partial data signal and second partial data signal. | 05-01-2014 |
Chi-Te Lin, Taichung City TW
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20120098796 | OPTICAL TOUCH MODULE AND DATA LOADING METHOD THEREOF - An optical touch module and a data loading method thereof are provided. The optical touch module includes a first system-on-chip (SoC), a second SoC and a storage element. The first and the second SoCs are electrically connected to each other and disposed around a touch region of a substrate. The first and the second SoCs each include an image sensor for sensing an image of the touch region. The storage element is electrically connected to the first SoC. The first SoC reads first data and second data stored in the storage element and transmits the second data to the second SoC. The first and the second SoCs respectively process the image of the touch region according to the first data and the second data. | 04-26-2012 |
Chi-Te Lin, Hsinchu County TW
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20140184939 | TOUCH STRUCTURE - A touch structure is provided. The touch structure includes a first sensing electrode, a second sensing electrode, a first dummy pattern and a second dummy pattern. The first sensing electrode and the second sensing electrode are arranged in a staggered manner and electrically insulated from each other. The first dummy pattern is adjacent to the first sensing electrode and has a first pattern acute angle. The second dummy pattern is adjacent to the second sensing electrode and has a second pattern acute angle. The first dummy pattern and the second dummy pattern are separated from each other. The first pattern acute angle and the second pattern acute angle are faced toward the same overlapped portion between the first sensing electrode and the second sensing electrode substantially. | 07-03-2014 |