Patent application number | Description | Published |
20100252303 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area. | 10-07-2010 |
20110284267 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board having a cavity is provided. The circuit board includes a first core layer, a second core layer, and a central dielectric layer. The first core layer includes a core dielectric layer and a core circuit layer, wherein the core circuit layer is disposed on the core dielectric layer. The second core layer is disposed on the first core layer. The central dielectric layer is disposed between the first core layer and the second core layer. The cavity runs through the second core layer and the central dielectric layer and exposes a portion of the core circuit layer. | 11-24-2011 |
20130212877 | MANUFACTURING METHOD OF CIRCUIT BOARD - A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed. | 08-22-2013 |
20130276969 | MANUFACTURING METHOD OF CIRCUIT BOARD - A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer. | 10-24-2013 |
Patent application number | Description | Published |
20110316420 | LED LIGHT SOURCE MODULE - A light emitting diode (LED) light source module includes a circuit substrate, a driving IC electrically coupled to the circuit substrate and having at least one input terminal and an output terminal, an LED coupled onto the circuit substrate and electrically coupled to an output terminal of the driving IC, and a packaging layer, having a transparent structure shaped by a colloidal solidification, such that the transparent structure is covered outside the driving IC and LED, and the LED light source module covers the driving IC and LED by the transparent structure of the packaging layer, and serves as a light source module of a lamp directly without the need of installing another driving IC to the lamp, and promotes its extensive use in LED lamps. | 12-29-2011 |
20120155085 | LED MODULE ASSEMBLING STRUCTURE - An LED module assembling structure includes an LED module, at least one connection seat and a conductive connection member. The LED module includes a circuit board and at least one light-emitting diode. The connection seat is soldered on the circuit board. The connection seat has two sidewalls defining a holding trough having an opening. The sidewalls are respectively formed with two corresponding recesses and two corresponding latch protrusion sections protruding from the sidewalls into the holding trough. The latch protrusion sections are positioned above the recesses near the opening. The conductive connection member is a bar-shaped conductor. At least one end of the conductive connection member is inserted in the holding trough of the connection seat and fixedly held between the recesses in the holding trough. Accordingly, multiple LED modules can be assembled and electrically connected with each other via the conductive connection member and the connection seats. | 06-21-2012 |
20120300468 | VARIABLE SHAPED LAMP SHADE OF LED LAMP - In a variable shaped lamp shade of an LED lamp, the lamp shade is made of a translucent material matched with an LED lamp strip and a lamp holder and includes at least one strip-shaped optical refraction unit having an external refractive surface, an internal refractive surface corresponding to the external refractive surface, and an assembling structure for matching the lamp holder. The external refractive surface or internal refractive surface is a curved surface without an inflection point and the curved surface has a constant or gradually changing curvature; and a non-curved surface is formed on the other side. The variable shaped lamp overcomes the problems of conventional LED lamp strips having a low illumination and a non-uniform illumination caused by a direct projection or an installation of a conventional lamp shade, and a low light utility caused by a too-large illumination range. | 11-29-2012 |
20120300470 | VARIABLE SHAPED LAMP SHADE OF LED LAMP - In a variable shaped lamp shade of an LED lamp, the lamp shade is made of a translucent material matched with an LED lamp strip and a lamp holder and includes at least one strip-shaped optical refraction unit having an external refractive surface, an internal refractive surface corresponding to the external refractive surface, and an assembling structure for matching the lamp holder. The external refractive surface or internal refractive surface is a curved surface without an inflection point and the curved surface has a constant or gradually changing curvature; and a non-curved surface is formed on the other side. The variable shaped lamp overcomes the problems of conventional LED lamp strips having a low illumination and a non-uniform illumination caused by a direct projection or an installation of a conventional lamp shade, and a low light utility caused by a too-large illumination range. | 11-29-2012 |
20130058087 | LED MODULE FIXING STRUCUTRE - An LED module fixing structure includes an LED module and a threaded column. The LED module includes a circuit substrate, LED particles and an electric wire. A screw hole is formed at the center of the circuit substrate, and a thread is formed around the threaded column, so that the threaded column is secured into the screw hole of the circuit substrate through the thread, or the LED module is installed in a lamp casing, and a screw hole is formed at the center of the lamp casing and provided for securing the threaded column into the screw hole of the lamp casing through the thread. The LED module fixing structure comes with a simple thread fixing structure, and the thread of the threaded column can be installed to another object such as a heat dissipating element to achieve the effects of lowering cost, facilitating installation, and enhancing heat dissipation. | 03-07-2013 |
20140159594 | LIGHT SOURCE DEVICE WITH LIGHT-EMITTING DIODE MODULE - A light source device with an LED module includes a load module. The load module includes a voltage-regulating unit and a constant current controlling unit parallel-connected between a first output end and a second output end of the voltage-regulating unit. An input end of the voltage-regulating unit is connected to a positive end of a voltage source. The voltage-regulating unit generates a stable voltage difference of less than 1.6V between the first and second output ends. The LED module receives a residual voltage equal to the result of subtracting from the output voltage of the voltage source the voltage difference consumed by the load module. The amount by which the residual voltage exceeds the operating voltage required for the entire LED string never exceeds safe voltage values. Even if a voltage source changes, the voltage-regulating unit can still generate a stable voltage difference and a stable current. | 06-12-2014 |
Patent application number | Description | Published |
20090324101 | METHOD FOR DESIGNING COMPUTATIONAL OPTICAL IMAGING SYSTEM - A method for designing computational optical imaging system, including a step for setting a target; a step for designing an optical module; and a step for designing an image restoration module; wherein by using the similarity and blur minimization of the optical module and the image restoration module to gather the optimization judgment standard, the step for designing an optical module and the step for designing an image restoration module operate individually synchronously or in sequence, and by a software product to design an optical imaging system so as to reduce the quantity and time of calculation and save repairing costs. | 12-31-2009 |
20100183235 | METHOD AND APPARATUS FOR DESIGNING RESTORATION FILTER, AND METHOD AND APPARATUS FOR RESTORING IMAGE USING THE RESTORATION FILTER - A method and an apparatus for designing an image restoration filter and a method and an apparatus for restoring an image by using the image restoration filter are provided. A test image is captured by an imaging system to obtain image information of the test image. The image restoration filter is then calculated according to original image information of the test image and the image information obtained by the imaging system through a numerical method, such that the obtained image information after being processed by the image restoration filter has a better similarity to the original image information. Thereafter, an image captured by the imaging system is processed by using the image restoration filter as a kernel, so as to resolve the problems of image blur and distortion caused by the optical path and the imaging system. | 07-22-2010 |
20100310165 | IMAGE RESTORATION METHOD AND APPARATUS - An image restoration method is disclosed. The method is used in an image restoration apparatus and configured to restore an image captured by an imaging system. The method includes capturing a scenery image by the imaging system and applying restoration processing to the scenery image using a plurality of restoration filters respectively corresponding to a plurality of depths, to generate a plurality of restored images respectively corresponding to the depths. | 12-09-2010 |
20100321788 | AUTO-FOCUSING LENS MODULE - An auto-focusing lens module includes an object lens, a liquid zooming unit, and an image lens group. The object lens and the liquid zooming unit receive an object image in front and condense the image into a first-stage output light. A zoom quantity is determined by an external control on the liquid zooming unit. The image lens group including a first and second lens receives the first-stage output light to transmit a second-stage output light. The first lens has a first and second surface, in which the second surface is farther than the first surface to the liquid zooming unit and has a convex curving surface protruding toward an image sensor. The second lens has a first and second surface, in which the first surface has a concave curving surface indenting toward the image sensor to adapt at least a portion of the convex curving surface of the first lens. | 12-23-2010 |
20110050980 | IMAGING SYSTEMS AND OPTICAL SYSTEMS WITH EXTENDED DEPTH OF FOCUS - An optical imaging system with extended depth of focus is provided. The optical imaging system includes an optical imaging module, an array type detector and an image restoration module. The optical imaging module has a specific longitudinal spherical aberration corresponding to the depth of focus. The array type detector is coupled to the optical imaging module to obtain a image via the specific longitudinal spherical aberration provided by the optical imaging module. The image restoration module is coupled to the array type detector, wherein the array type detector converts the obtained image to a digitalized image and the image restoration module receives the digitalized image and performs an image restoration operation to the digitalized image to form an image with extended depth of focus. | 03-03-2011 |
20110058258 | ZOOM CAMERA MODULE - A zooming camera module includes a first lens group, a second lens group, and a third lens group. The first lens group is implemented on an optical axis at a fixed position, and has a negative total optical power. The second lens group is implemented on the optical axis and can be moved back and forth along the optical axis, to achieve zooming and focusing. The second lens group has a positive total optical power, and includes a liquid lens unit and at least one lens with non-zero optical power, wherein the at least one lens and the liquid lens are separately or integrally configured. The third lens group is implemented on the optical axis at a fixed position, and has a non-zero total optical power. | 03-10-2011 |
20120181337 | BARCODE READING APPARATUS AND BARCODE READING METHOD - A barcode reading apparatus adapted to detect a barcode is provided. The barcode reading apparatus includes an imaging lens, an image sensor, and a barcode decoder. The imaging lens has a spherical aberration to extend a depth of field of the imaging lens. The imaging lens is configured to image the barcode onto the image sensor. The image sensor converts an image of the barcode into a barcode signal. The barcode decoder is configured to decode the barcode signal to obtain information represented by the barcode. A barcode reading method is also provided. | 07-19-2012 |
20130010263 | DISPLAY APPARATUS - A display apparatus including a plurality of image generating units is provided. Each of the image generating units includes an image source and a dioptric module. The image source provides an image beam. The dioptric module is disposed on a light path of the image beam and has dioptric power. The dioptric module forms an image floating in the air and corresponding to the image source, and the dioptric module is located between the image source and the image. The image generating units are arranged in an array, and the images formed by the image generating units are arranged in an array and combined to form an image frame. | 01-10-2013 |
20130120550 | EXTENDED DEPTH OF FIELD MICROSCOPE SYSTEM - An extended depth of field microscope system for phase object detection includes an imaging optical module and a phase/intensity converting module. The imaging optical module has an object lens group, in which an axial symmetric phase coding is added, to produce an axial symmetric spherical aberration. A point spread function (PSF) and an image with extended depth of field can be obtained with a predetermined level of similarity. The phase/intensity converting module converts the phase change of the light passing the phase object, into an image light with change of light intensity. | 05-16-2013 |
20130169595 | RANGING APPARATUS, RANGING METHOD, AND INTERACTIVE DISPLAY SYSTEM - A ranging apparatus including an image sensor, an imaging lens, and a processor is provided. The imaging lens is configured to image an object on the image sensor to produce an image signal having at least one image parameter, wherein the at least one image parameter changes with a change of an object distance of the object. The processor is configured to determine the change of the object distance according to a change of the at least one image parameter. A ranging method and an interactive display system are also provided. | 07-04-2013 |
20130172700 | OPTICAL DETECTION METHOD - An method for detection of β-amyloid in aqueous humor, lens, and retina of eye or the deposit of the combination of αβ-crystallin and β-amyloid in lens is provided. A light is emitted to a testing area in the eye. The light frequency is selected according to an absorption spectrum of the test substance, and the frequency is equal or close to a resonant excitation frequency of one of the electronic molecular energy levels of the substance, so as to excite the substance to generate resonance-enhanced Raman effect or pre-resonance Raman effect to form a detection spectrum. The concentration of the substance could be estimated by a peak intensity of the detection spectrum. | 07-04-2013 |
20130281858 | METHOD FOR INCREASING DEPTH OF FIELD AND ULTRASOUND IMAGING SYSTEM USING THE SAME - An ultrasound imaging system and methods thereof are provided. A method includes transmitting a plurality of energy signals coded by a first asymmetric phase element toward an object to be imaged, receiving a plurality of echo signals from the object to be imaged, respectively coding the received signals with a second asymmetric phase element, and reconstructing an image data set with an extended depth of field by decoding the received signals. The ultrasound imaging system includes a transmitter transmitting energy signals coded by a first asymmetric phase element toward an object to be imaged, and a receiver receiving echo signals from the object to be imaged, respectively coding the received signals with a second asymmetric phase element, and reconstructing an image data set with an extended depth of field by decoding the received signals. | 10-24-2013 |
Patent application number | Description | Published |
20080235432 | MEMORY SYSTEM HAVING HYBRID DENSITY MEMORY AND METHODS FOR WEAR-LEVELING MANAGEMENT AND FILE DISTRIBUTION MANAGEMENT THEREOF - The present invention discloses a memory system having a hybrid density memory. The memory system includes a plurality of storage spaces whereby the storage spaces have respective levels of endurance and each storage space has a plurality of blocks and pre-determined weighting factors corresponding to the levels of endurance of the storage spaces. After executing a command of erasing a specific block, the system records the erase in accordance with the weighting factor of the storage space to which the specific block belongs. Whereby, the erase counts of all the blocks of different storage spaces are able to reach respective levels of endurance as simultaneously as possible. | 09-25-2008 |
20080235433 | HYBRID DENSITY MEMORY STORAGE DEVICE AND CONTROL METHOD THEREOF - The present invention discloses a control method for a hybrid density memory storage device. The method arranges physical locations for a file system stored in the storage device. The storage device includes a high density storage space, a low density storage space and a hot list capable of recording a plurality of logical locations. The method includes the following steps: receiving a command; verifying whether the logical location of the command belongs to the logical locations recorded in the hot list; and according to the verification, assigning a physical location of the high density storage space or a physical location of the low density storage space as the physical location corresponding to the logical location of the command. | 09-25-2008 |
20080235468 | HYBRID DENSITY MEMORY STORAGE DEVICE - The present invention discloses a hybrid density memory storage device configured to store data responsive to a host and a file system thereof. The hybrid density memory storage device includes a non-volatile memory, a hot data buffer and a control unit. The non-volatile memory includes a high density storage space and a low density storage space. The control unit is coupled between the host, the non-volatile memory, and the hot data buffer. The control unit has a hot list used for recording a plurality of logical locations of hot data, and the control unit is capable of accessing data in/out the hot data buffer in accordance with the hot list. | 09-25-2008 |
20090282305 | STORAGE SYSTEM WITH DATA RECOVERY FUNCTION AND METHOD THEREOF - A storage system with a data recovery function and its method reduce errors in a storage medium to a recoverable range of a general ECC function by repeating a testing and recovery procedure for one or more times to assure the accuracy of reading data and enhance the data reliability effectively. The data recovery procedure includes the steps of providing test data by a test data generator of the storage system, writing the test data into a memory block where error data is found, finding an error bit by reading the test data, reducing the error to a recoverable range of the ECC technique by the recovery procedure. If the error bit cannot be found or reduced to a recoverable range of the ECC technique within an upper limit of the number of tests, the memory block is marked as bad. | 11-12-2009 |
20110246709 | MEMORY SYSTEM HAVING HYBRID DENSITY MEMORY AND METHODS FOR WEAR-LEVELING MANAGEMENT AND FILE DISTRIBUTION MANAGEMENT THEREOF - The present invention discloses a memory system having a hybrid density memory. The memory system includes a plurality of storage spaces whereby the storage spaces have respective levels of endurance and each storage space has a plurality of blocks and pre-determined weighting factors corresponding to the levels of endurance of the storage spaces. After executing a command of erasing a specific block, the system records the erase in accordance with the weighting factor of the storage space to which the specific block belongs. Whereby, the erase counts of all the blocks of different storage spaces are able to reach respective levels of endurance as simultaneously as possible. | 10-06-2011 |
Patent application number | Description | Published |
20090091041 | STACKED TYPE CHIP PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A stacked type chip package structure including a package structure, a corresponding substrate, and a number of second bumps is provided. The package structure includes a first chip, a second chip, a number of first bumps, and a first underfill. The first chip is disposed above the second chip. The first bumps are disposed between the first chip and the second chip for electrically connecting the first chip and the second chip. The first underfill is used to fill between the first chip and the second chip and encapsulates the first bumps. The package structure is disposed above the corresponding substrate in a reverse manner, such that the first chip is disposed between the second chip and the corresponding substrate. The second bumps are disposed between the second chip and the corresponding substrate, such that the second chip is electrically connected to the corresponding substrate through the second bumps. | 04-09-2009 |
20090102047 | Flip chip package structure and carrier thereof - A flip chip package structure including a chip, a carrier, and a plurality of bumps is provided. The chip has a bonding surface and a plurality of bump pads thereon. The carrier is disposed corresponding to the chip and includes a substrate and a plurality of pre-solders. The substrate has a carrying surface and a patterned trace layer thereon. The patterned trace layer has a plurality of traces, and each of the traces has an outward protruding bonding portion corresponding to the bump. The line width of the bonding portion is greater than that of the trace. The pre-solders are disposed on the bonding portions, respectively. The bumps are disposed between the bump pads and the corresponding pre-solders such that the chip is electrically connected to the carrier through the bumps. | 04-23-2009 |
20090127706 | CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF - A chip package structure and process are provided; the structure includes a substrate, a chip, a solder layer and at least a stud bump. The substrate has at least a contact pad, and the chip has an active surface where at least a bonding pad is disposed. The stud bump is disposed on the bonding pad of the chip or on the contact pad of the substrate, and the stud bump joints with the solder layer to fix the chip on the substrate. The stud bump is made of gold-silver alloy containing silver below 15% by weight. | 05-21-2009 |
20110121442 | PACKAGE STRUCTURE AND PACKAGE PROCESS - A package process includes following steps. A circuit mother board comprising a plurality of circuit boards is disposed on a carrier. Semiconductor devices are provided, wherein each of the semiconductor devices has a top surface and a bottom surface opposite thereto. Each of the semiconductor devices has conductive vias each having a first end surface and a second end surface exposed by the bottom surface of the semiconductor device. The semiconductor devices are connected to the corresponding circuit boards through their conductive vias with their bottom surface facing the circuit mother board. An insulating paste is formed between each of the semiconductor devices and its corresponding circuit board. A protection layer is formed on the circuit mother board to cover the semiconductor devices. Then, the protection layer and the semiconductor devices are thinned to expose the first end surface of each of the conductive vias. | 05-26-2011 |
20110285014 | PACKAGING STRUCTURE AND PACKAGE PROCESS - A package structure and a package process are proposed in using pillar bumps to connect an upper second chip and through silicon vias of a lower first chip, wherein a gap between the first chip and the second chip can be controlled by adjusting a height of the pillar bumps. In other words, the pillar bumps compensate the height difference between the first chip and a molding compound surrounding the first chip so as to ensure the bondibility between the pillar bumps and the corresponding through silicon vias and improve the process yield. Furthermore, the pillar bumps maintain the gap between the second chip and the molding compound for allowing an underfill being properly filled into the space between the first chip and the second chip. | 11-24-2011 |
20120205800 | PACKAGING STRUCTURE - A package structure and a package process are proposed in using pillar bumps to connect an upper second chip and through silicon vias of a lower first chip, wherein a gap between the first chip and the second chip can be controlled by adjusting a height of the pillar bumps. In other words, the pillar bumps compensate the height difference between the first chip and a molding compound surrounding the first chip so as to ensure the bondibility between the pillar bumps and the corresponding through silicon vias and improve the process yield. Furthermore, the pillar bumps maintain the gap between the second chip and the molding compound for allowing an underfill being properly filled into the space between the first chip and the second chip. | 08-16-2012 |
Patent application number | Description | Published |
20090236712 | IC PACKAGE HAVING REDUCED THICKNESS - An IC package having reduced thickness includes a lead frame, a chip, and a plurality of bonding wires. The lead frame includes a front side, a rear side, a plurality of pins located on the front side, and a hollow portion formed on the lead frame. The chip is larger than the rear side of the lead frame. The chip includes a plurality of electrodes and is adhered to the rear side of the lead frame. The electrodes correspond to the hollow portion. The bonding wires pass through the hollow portion to be connected with the pins and the electrodes. Accordingly, the IC package can effectively take good use of the space below the lead frame, reducing the height of the bonding wires and saving the packaging space above the lead frame, and reduce the thickness of the IC package without addition of the cost and equipment. | 09-24-2009 |
20090239339 | METHOD OF STACKING DIES FOR DIE STACK PACKAGE - A method of manufacturing a die stack package includes the steps of providing a wafer having a first surface and a second surface, said first surface having a plurality of cut ways thereon, the second surface being coated with adhesive of a predetermined thickness at a predetermined position thereof, removing parts of the adhesive by photo-lithography, each of the parts of the adhesive corresponds to the cut way and is wider than the cut way; cutting the wafer along the cut ways to make a plurality of dies, each of the dies having a part of the adhesive thereon; and stacking each of the dies, whose surface having the adhesive faces a lower-layer die, on the lower-layer die. Therefore, the method facilitates the stacking operation and saves the production cost. | 09-24-2009 |
Patent application number | Description | Published |
20090194908 | MOLD FOR INJECTION MOLDING AND AN INJECTION MOLDING DEVICE/METHOD WITH SURFACE QUALITY IMPROVEMENT ABILITY - A mold for injection molding and an injection molding device/method with surface quality improvement ability are disclosed, in which the injection molding device comprises: a mold including a first mold piece and a second mold piece; and a film feeder. In an exemplary embodiment, the second mold piece is configured with a suction unit in a manner that the film feeder is enabled to provide a film to the suction unit. | 08-06-2009 |
20100159061 | COAXIAL COOLING/HEATING COIL STRUCTURE AND THE MOLD CONFIGURED WITH THE SAME - The present invention relates to a coaxial cooling/heating coil structure and a mold configured with the same, in which the coaxial cooling/heating coil is comprised of: a frame, configured with a cooling channel having an inlet, provided for a cooling water to flow therein, and an outlet, provided for discharging the cooling water therefrom; and a heat-conducting coil, disposed inside the cooling channel. The coaxial cooling/heating structure is fitted to a mold to be used for enhancing the preheating efficiency of the mold while improving the time required for cooling the mold. | 06-24-2010 |
20100221373 | MOLD HEATING/COOLING STRUCTURE - A mold heating/cooling structure for a mold configured with a die base and an insert, comprising: a heat insulating layer, disposed surrounding a die impression of the die base for insulating the heat conduction between the die base and the insert; a magnetic powder layer, disposed against the heat insulating layer; a coil, being disposed on the magnetic powder layer in a manner that it is circling from the outside in toward the center of the magnetic powder layer; and a cooling plate, configured with a plurality of second fluid channels provided fro a fluid to flow therein. With the aforesaid structure, the insert can be heated directly by the coil the it is subject to a high-frequency current, and the heated coil as well as the insert can be cool down with high efficiency as soon as the fluid is fed into the second fluid channels. | 09-02-2010 |
20100255143 | GAS-ASSISTED MOLD SURFACE HEATING SYSTEM - A gas-assisted mold surface heating system is disclosed, which comprise: an air supply, for providing air with a flow rate larger than 300 L/min; a heater, for heating air to a temperature higher than 400° C.; a mold, configured with a mold cavity, an inlet and an outlet; and an air storage tank; wherein, the inlet is connected to the heater through a pipeline for allowing the air from the air supply to flow into the cavity after being heated by the heater and thus to be for heating up the surface of the mold cavity while the heated air is being enabled to flow out of the cavity through the outlet and into the air storage tank. With the aforesaid system, surface temperature of the mold cavity can be raised to a point higher than a glass transmission point in a short period of time. | 10-07-2010 |
20120021340 | FABRICATION METHOD FOR ENHANCING THE ELECTRICAL CONDUCTIVITY OF BIPOLAR PLATES - A fabrication method for enhancing the electrical conductivity of bipolar plates, adapted for laminating a three-layered structure that is constructed by sandwiching a bonding layer made of a conductive material between two bipolar plates made of a thermoplastic polymer composite, is disclosed, which comprises the steps of: using an induction coil to heat up the bonding layer; and exerting a pressure upon the two bipolar plates for laminating the bonding layer to the two bipolar plates. With the aforesaid method, not only the through-plane conductivity with regard to the two bipolar plates can be enhanced, but also the processing time is greatly reduced. | 01-26-2012 |
20120074132 | INDUCTION HEATING DEVICE AND METHOD FOR CONTROLLING THE SAME - An induction heating device and a method for controlling the same are disclosed, in which the induction heating device is composed of an induction coil and a magnetic conductive plate. The induction coil, being arranged for enabling the same to move relative to a target object, is used for heating the target object after being excited. The magnetic conductive plate is disposed at a specific position proximate to the induction coil that can be varied. According to the positioning of the magnetic conductive plate, the magnetic conductive plate can be used as a shield for blocking the magnetic field resulting from the excited induction coil when it is being positioned between the induction coil and the target object, and the magnetic conductive plate can be used for enhancing the magnetic field when it is being positioned at a side of the induction coil that is away from the target object. | 03-29-2012 |
Patent application number | Description | Published |
20110171440 | DECORATIVE FILM AND IN MODE DECORATION/FORMING PROCESS - A decorative film is provided. The decorative film comprises: a plastic substrate, comprising a surface, and a plurality of optical film layers, being formed by laminating optical film layers of at least two different materials onto the surface, wherein each of the optical film layers and another optical film layer are stretched in at least one direction to create a difference in refractive indices of no less than 0.1 between the optical film layers. | 07-14-2011 |
20120100353 | HIGH-SHIELDING REFLECTIVE FILM AND METHOD FOR MANUFACTURING THE SAME - Provided is a high-shielding reflective film, and its manufacturing method. This film is fabricated from an optical reflective film and a polarizer. The optical reflective film and the polarizer are combined by a means of a specific scheme. The optical reflective film is formed by stacking multiple layers of dielectric optical interference films with different materials. The optical reflective film particularly applies a principle of optical interference to reflect the most of the incident light, and allow some transmission. The polarizer is to absorb half of the incident light, and allow the other half to pass through. Since the characteristics of reflection between the reflective film and the polarizer are different, the reflectance difference therefor may increase. By which, the high-shielding reflective film achieves a one-way mirror with anti-peep effect since it substantially increases the reflectance difference among the incident lights from the various directions. | 04-26-2012 |
20120162960 | LIGHT-UNIFORMING ANTI-GLARING STRUCTURE AND LIGHT-EMITTING DEVICE - A light-uniforming anti-glaring structure includes a light-polarizing reflection unit and a light-polarizing position adjusting unit. The light-polarizing reflection unit includes a multilayer reflector composed of a plurality of inter-stacked polymer films. One of the inter-stacked polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, wherein NX is the index of refraction of light at X direction, NY is the index of refraction of light at Y direction, and NZ is the index of refraction of light at Z direction. The light-polarizing position adjusting unit is coupled with the light-polarizing reflection unit for adjusting the position of the light-polarizing reflection unit. | 06-28-2012 |
20120212689 | DISPLAY BACKLIGHT MODULE AND METHOD FOR THE SAME - Disclosed are a display backlight module and its manufacturing method. A multilayer reflector is particularly introduced into the display backlight module for a LCD display. The multilayer reflector is composed of a plurality of inter-stacked polymer films with various indexes of refraction. With introduction of interference principle, the multilayer reflector is designed to reflect or transmit the light with a specific wavelength range for acquiring a more uniform backlight. According to one of the embodiments, the display backlight module includes a backlight module, such as a direct-type or an edge-type light source. The module further includes the multilayer reflector and an optical-film module. This optical-film module optionally includes a brightness-enhancement film and a diffuser. | 08-23-2012 |
20130077165 | VEHICLE DISPLAY MIRROR AND METHOD OF MANUFACTURING THE SAME - A vehicle display mirror includes a light-polarizing reflection unit and an image display unit. The light-polarizing reflection unit includes at least one multilayer reflector composed of a plurality of inter-stacked polymer films, and at least one of the inter-stacked polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, wherein NX is the index of refraction of light at X direction, NY is the index of refraction of light at Y direction, and NZ is the index of refraction of light at Z direction. The image display unit includes at least one image display screen, and the multilayer reflector is disposed on the image display screen, thus the vehicle display mirror of the instant disclosure can be used as a rear-view mirror of the vehicle and provide a clear displayed screen for user in the vehicle. | 03-28-2013 |
20130107354 | MULTILAYER LIGHT-REFLECTING FILM AND METHOD FOR MANUFACTURING THE SAME | 05-02-2013 |
20130292871 | FEEDBLOCK MULTIPLIER WITH THICKNESS GRADIENT VARIATION, FEEDBLOCK SYSTEM, METHOD, AND RELATED MULTILAYER STRUCTURE - Disclosed are a feedblock multiplier with thickness gradient variation, a feedblock system, a method, and multilayer structure made by the method. The feedblock multiplier combines the functionalities of feedblock and multiplier conventionally used for producing the multilayer structure. The feedblock multiplier includes an input section for feeding fluid materials. A feedblock section is included for dividing the fluid delivered into multiple channels correspondingly. The fluids in the channels are segmented into two or more fluid segments by a segmenting section. The each fluid segment is delivered through corresponding channel-conversion section with thickness-gradient variation in the feedblock multiplier. Each channel-conversion section includes multiple channels with configurable positions. The fluids are then combined in a multiplier section for producing the multilayer structure with overlapped layers. The multilayer structure is outputted from an extruding section. | 11-07-2013 |
20130314788 | REFLECTIVE OPTICAL FILM AND METHOD OF MANUFACTURING THE SAME, AND IMAGE DISPLAY DEVICE - A reflective optical film includes a reflective light-polarizing unit including a multilayer reflective sheet composed of a plurality of polymer films stacked on top of one another. Each polymer film has a thickness, every two adjacent polymer films are two different materials, and the thicknesses of the polymer films are gradually decreased from two outmost sides of the multilayer reflective sheet to a middle of the multilayer reflective sheet. At least one of the polymer films is a birefringence material layer that conforms to the condition of NX≠NY≠NZ, where NX is the index of refraction of light at X direction of the multilayer reflective sheet, NY is the index of refraction of light at Y direction of the multilayer reflective sheet, and NZ is the index of refraction of light at Z direction of the multilayer reflective sheet. | 11-28-2013 |
20140111851 | APPARATUS MOUNTED WITH HEAT-INSULATION LIGHT-GUIDE FILM - The disclosure is related to an apparatus mounted with a heat-insulation light-guide film. The apparatus is a support with carriers capable of adjusting the received light quantity. The carrier is such as the slat of a shutter device and whose angle is adjustable. The heat-insulation light-guide film is exemplarily mounted on the slat, and which is made of a multilayer membrane and a surface textural layer in combination. The multilayer membrane includes multiple films and the adjacent layers are with different indexes of refraction. The materials and thicknesses of the membrane are configured to specify an optical band of light to be reflected. The surface textural layer is for guiding an incident light directed to the structure. The apparatus is as required to adjust the angle of the light hitting the film, and is applicable to a window for uses of heat-insulation, anti-glare, and illumination. | 04-24-2014 |
20140176859 | WIDE-COLOR GAMUT FILM, DISPLAY APPARATUS WITH THE WIDE-COLOR GAMUT FILM, AND METHOD FOR MANUFACTURING THE FILM - Disclosed are a wide-color gamut film and its applications. While the wide-color gamut film is manufactured, the method firstly confirms the type of the backlight. The film is designed to filter some specified frequency bands, especially the bands adjacent to the frequencies of red, green and blue lights. The parameters are referred to decide an overall thickness and an overall refractive index, and prepare a plurality of high-polymeric thin films. A wide-color gamut film is formed by assembling the thin films according to the configuration. The invention also relates to a display using the wide-color gamut film. The film is disposed between a panel module and a backlight module of the display. The film serves to reduce or filter out the light transmittance within the determined bands. The wide-color gamut film is provided for improving the crosstalk phenomenon among the frequency bands of the backlight. | 06-26-2014 |
Patent application number | Description | Published |
20080303966 | PIXEL STRUCTURE - A pixel structure including a substrate, a scan line, a data line, a first and a second switching device, a first and a second pixel electrode, a first and a second bended pixel electrode, a first and a second connecting conductive layer, and a first and a second common line is provided. The scan line and data line demarcate a first and a second areas on the substrate, and the scan line is located between the two areas. The first and second switching devices are electrically connected to the scan line and the data line and are also electrically connected to the first and second pixel electrodes on the first and second areas respectively. The first and second bended pixel electrodes on the second and first areas are electrically connected to the first and second pixel electrodes through the first and second connecting conductive layers on the scan line respectively. | 12-11-2008 |
20100141861 | PIXEL STRUCTURE AND REPAIR METHOD THEREOF - A pixel structure is provided. The pixel structure includes a scan line, a gate, a first dielectric layer, a channel layer, a source, a drain, a data line, a second dielectric layer, and a pixel electrode. The gate is electrically connected to the scan line and has a first notch. The first dielectric layer covers the scan line and the gate. The channel layer is disposed on the first dielectric layer over the gate and exposed by the first notch. The source and the drain are disposed on the channel layer. Part of the drain is located over the first notch. The data line is disposed on the first dielectric layer and electrically connected to the source. The second dielectric layer covers the source, the drain and the data line. The pixel electrode is disposed on the second dielectric layer and electrically connected to the drain. | 06-10-2010 |
Patent application number | Description | Published |
20120039223 | Method of Handling Power Headroom Reporting and Communication Device Thereof - A method of handling power headroom report, hereafter called PHR, reporting for a communication device configured with a plurality of uplink component carriers in a wireless communication system is disclosed. The method comprises generating PHRs for at least one uplink component carrier of the plurality of uplink component carriers, determining a format of a MAC control element of a MAC PDU generated by the communication device according to a number of the at least one uplink component carrier, and reporting the PHRs with the predetermined or dynamic format of the MAC control element. | 02-16-2012 |
20120044847 | Method of Applying Discontinuous Reception Operation and Related Communication Device - A method of applying DRX operation for a mobile device in a wireless communication system is disclosed. The mobile device is configured with a primary serving cell and at least one secondary serving cell, and the DRX operation is already applied to the activated serving cell (e.g. primary serving cell), but not applied to the deactivated serving cell. The method comprises receiving a control element, wherein the control element is used for activating the at least one secondary serving cell; and applying the DRX operation to the at least one secondary serving cell when this serving cell's activation/deactivation state has just been changed from deactivation to activation state according to the control element. | 02-23-2012 |
20130064195 | Method of Handling Random Access Procedure on Secondary Cell when Primary Cell Time Alignment Timer Expires - A method of handling a random access procedure for a mobile device in a wireless communication system is disclosed. The method comprises having an ongoing random access procedure on a secondary cell; and aborting the ongoing random access procedure on the secondary cell when a time alignment timer associated with a primary cell expires. | 03-14-2013 |
20130070700 | Method of Handling Random Access Procedure on Primary Cell When Random Access Procedure on Secondary Cell is Ongoing or about to Start - A method of handling a first random access procedure on a Primary Cell (PCell) for a mobile device when a second random access procedure on a Secondary Cell (SCell) is ongoing or is about to start is disclosed. The method comprises selectively initiating the first random access procedure on the PCell according to a result of the second random access procedure after the mobile device completes the second random access procedure on the SCell, wherein the first random access procedure is triggered by a pending scheduling request of the mobile device and the second random access procedure is triggered by need of synchronization on the SCell. | 03-21-2013 |
20140036817 | Method of Handling Random Access Channel Procedure and Related Communication Device - A method of handling random access channel (RACH) procedures for a network in a wireless communication system includes sending a first information request message to a user equipment of the wireless communication system for receiving a first RACH report of a first RACH procedure from the user equipment after detecting that the user equipment has completed the first RACH procedure successfully on a primary cell of the network. | 02-06-2014 |
Patent application number | Description | Published |
20100231500 | Method and LCD improving waving phenomenon - An LCD includes a display panel, a plurality of fluorescent lamps, an electric field sensor, and an inverter. The electric field sensor senses electric fields of the plurality of fluorescent lamps to generate a voltage. The inverter is electrically connected the plurality of fluorescent lamps, and generates a driving voltage to drive the plurality of fluorescent lamps. The inverter adjusts an operating frequency of the driving voltage according to the voltage. Thus, the waving phenomenon of the LCD is improved effectively. | 09-16-2010 |
20130113769 | DISPLAY CAPABLE OF IMPROVING FRAME QUALITY AND METHOD THEREOF - A display capable of improving frame quality includes a display panel, a timing controller, and a source driver. The timing controller is used for generating a scan start signal, and generating at least one control signal in a blanking time of the display panel according to polarity of a last datum before the blanking time and polarity of a first datum after the blanking time. The source driver is used for generating at least one datum synchronized with the at least one control signal according to the polarity of the last datum before the blanking time, a voltage of the first datum after the blanking time and the at least one control signal. The source driver does not change a last datum of the at least one datum after the at least one control signal in the blanking time. | 05-09-2013 |
20130222279 | TOUCH DISPLAY APPARATUS - A touch display apparatus including a display panel, a touch panel, a gate driver and a touch sensor is provided. The touch panel is disposed corresponding to the display panel. The gate driver is coupled to the display panel and the touch panel so as to sequentially output a plurality of scan signals to the display panel and sequentially output a plurality of driver signals to the touch panel. Here, the output time of the scan signals and the output time of the driver signals are not overlapped. The touch sensor is coupled to the touch panel and calculates a touch position according to a sensor signal outputted by the touch panel. | 08-29-2013 |
20140043253 | MULTI-TOUCH SCREENS DEVICE AND METHOD OF OPERATING A MULTI-TOUCH SCREENS DEVICE - A multi-touch screens device includes at least two touch panels, a microprocessor, and an operation system. The microprocessor is coupled to the at least two touch panels for providing driving signals of the at least two touch panels to the at least two touch panels, receiving sensing signals generated by the at least two touch panels, and generating operation signals corresponding to the at least two touch panels according to the sensing signals. The operation system is coupled to the microprocessor for executing corresponding operations on the at least two touch panels according to the operation signals corresponding to the at least two touch panels. | 02-13-2014 |
20140158513 | TOUCH PANEL - A touch panel connected with p signal channels of a chip is provided. The touch panel includes a substrate, electrode pairs, and signal lines. The electrode pairs are arranged in a matrix of q columns and r rows and each includes a first electrode connected to the h | 06-12-2014 |
Patent application number | Description | Published |
20090050470 | Method And Device For Enhancing Solderability - A method and a device for enhancing the solderability of a lead-free component are provided. The provided method is compatible with the conventional soldering process and is capable of improving the wetting ability of the solder so as to enhance the solderability and the ability of anti-oxidation thereof. Besides, it is also achievable for providing a recognizable lead-free device so as to prevent the process confusion. | 02-26-2009 |
20090121348 | CHIP STRUCTURE AND PROCESS THEREOF AND STACKED STRUCTURE OF CHIPS AND PROCESS THEREOF - A chip structure and a stacked structure composed of the chip structures are provided. The chip structure has a substrate and at least one compliant contact. Furthermore, the chip structure may further have a redistribution layer for redistributing pads originally disposed around the substrate in a specific arrangement. The substrate has a first surface and a second surface. The compliant contact is embedded into the substrate and protrudes outside the first surface and the second surface of the substrate. The compliant contact has a compliant bump and a conductive layer encapsulating the compliant bump. The conductive layer can be connected with the redistribution layer. Two chip structures can be connected with each other through their compliant contacts or through their compliant contacts or redistribution layers. | 05-14-2009 |
20090152741 | CHIP STRUCTURE AND FABRICATION PROCESS THEREOF AND FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF - A chip structure including a chip, a first dielectric layer and at least one first conductive layer is provided. The chip has an active surface, a backside and at least one bonding pad disposed on the active surface. The first dielectric layer is disposed on the active surface and has at least one first opening, wherein the first opening correspondingly exposes the bonding pad. The first conductive layer covers an inner wall of the first opening and the bonding pad so as to form a concave structure in the first opening. When the chip structure is bonded to a substrate, the solder bump of the substrate is inlaid into the concave structure of the chip. Moreover, a fabrication process of the chip structure, a flip chip package structure and a fabrication process thereof, a package structure of a light emitting/receiving device and a chip stacked structure are also provided. | 06-18-2009 |
20090210055 | ARTIFICIAL OPTIC NERVE NETWORK MODULE, ARTIFICIAL RETINA CHIP MODULE, AND METHOD FOR FABRICATING THE SAME - An artificial retina chip module including a signal processing chip, a first polymer bump layer, and a photodiode array chip is provided. The signal processing chip includes a plurality of first pad disposed on a surface thereof. The first polymer bump layer includes a plurality of polymer bumps insulated from one another. Each of the first polymer bumps is composed of a polymer material and a conductive layer coated on the polymer material. Each first polymer bump is embedded into the corresponding first pad and the signal processing chip, wherein one end of the first polymer bump protrudes from the first pad and the other end thereof protrudes from a back surface of the signal processing chip. The photodiode array chip is disposed at one side of the signal processing chip and is electrically connected to the signal processing chip through the first polymer bumps. | 08-20-2009 |
20100163292 | PACKAGE CARRIER - A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer. | 07-01-2010 |
20100207266 | CHIP PACKAGE STRUCTURE - A chip package structure including a substrate, a plurality of electrodes, a chip, and a plurality of bumps is provided. Each of the electrodes has a bottom portion and an annular element, wherein the bottom portion is disposed on the substrate, the annular element is disposed on the bottom portion, and the bottom portion and the annular element define a containing recess. The chip is disposed above the substrate and has an active surface facing the substrate and a plurality of pads disposed on the active surface. The bumps are respectively disposed on the pads and respectively inserted into the containing recesses. The melting point of the electrodes is higher than that of the bumps. A chip package method is also provided. | 08-19-2010 |
20110156253 | MICRO-BUMP STRUCTURE - A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the corresponding micro-bumps. | 06-30-2011 |
20110227190 | ELECTRONIC DEVICE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - The invention provides an electronic device package structure and method of fabrication thereof. The electronic device package structure includes a chip having an active surface and a bottom surface. A dielectric layer is disposed on the active surface of the chip. At least one trench is formed through the dielectric layer. A first protection layer covers the dielectric layer and sidewalls of the trench. A second protection layer covers the first protection layer, filling the trench. | 09-22-2011 |
20120125669 | PACKAGE CARRIER - A package carrier including a substrate, at least an under bump metallurgic (UBM) layer and at least a conductive bump is provided. The substrate has a conductive structure and at least a pad connected with the conductive structure. A region of the pad connected with the conductive structure is a signal source region. The UBM layer is disposed on the pad and includes a first conductive pattern and a second conductive pattern. A side wall of the second conductive pattern is directly connected to a side wall of the first conductive pattern, and the second conductive pattern is disposed close to the signal source region. The conductivity of the second conductive pattern is smaller than the conductivity of the first conductive pattern. The conductive bump is disposed on the UBM layer. | 05-24-2012 |
20130043599 | CHIP PACKAGE PROCESS AND CHIP PACKAGE STRUCTURE - Chip package processes and chip package structures are provided. The chip package structure includes a substrate, a chip, an insulating layer, a third patterned conductive layer and an electronic element. The substrate has a first patterned conductive layer. The chip is disposed on the substrate. A second patterned conductive layer of the chip is bonded to the first patterned conductive layer of the substrate. The chip has a first through hole. The insulating layer is disposed on the chip and filled into the first through hole. The insulating layer has a second through hole which passes through the first through hole. The third patterned conductive layer is disposed on the insulating layer and filled into the second through hole to electrically connect to the first patterned conductive layer. The electronic element is disposed on the third patterned conductive layer and electrically connects to the third patterned conductive layer. | 02-21-2013 |
20130168798 | CHIP PACKAGE STRUCTURE - A first back surface of a first chip faces toward a carrier. A first active surface of the first chip has first pads and a first insulting layer thereon. A second chip is disposed on the first chip and electrically connected to the carrier. A second active surface of the second chip faces toward the first active surface. The second active surface has second pads and a second insulting layer thereon. Bumps connect the first and second pads. First and second daisy chain circuits are respectively disposed on the first and second insulting layers. Hetero thermoelectric device pairs are disposed between the first and second chips and connected in series by the first and second daisy chain circuits, and constitute a circuit with an external device. First and second heat sinks are respectively disposed on a second surface of the carrier and a second back surface of the second chip. | 07-04-2013 |
20130168851 | BUMP STRUCTURE AND ELECTRONIC PACKAGING SOLDER JOINT STRUCTURE AND FABRICATING METHOD THEREOF - A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode. | 07-04-2013 |
20140097534 | DUAL-PHASE INTERMETALLIC INTERCONNECTION STRUCTURE AND METHOD OF FABRICATING THE SAME - Provided are a dual-phase intermetallic interconnection structure and a fabricating method thereof. The dual-phase intermetallic interconnection structure includes a first intermetallic compound, a second intermetallic compound, a first solder layer, and a second solder layer. The second intermetallic compound covers and surrounds the first intermetallic compound. The first intermetallic compound and the second intermetallic compound contain different high-melting point metal. The first solder layer and the second solder layer are disposed at the opposite sides of the second intermetallic compound, respectively. The first intermetallic compound is adapted to fill the micropore defects generated during the formation of the second intermetallic compound. | 04-10-2014 |
20140134459 | SOLDER, SOLDER JOINT STRUCTURE AND METHOD OF FORMING SOLDER JOINT STRUCTURE - A solder and a solder joint structure formed by the solder are provided. The solder includes a zinc-based material, a copper film, and a noble metal film. The copper film completely covers the surface of the zinc-based material. The noble metal film completely covers the copper film. The solder joint structure includes a zinc-based material and an intermetallic layer. The intermetallic layer consists of zinc and noble metal and completely covers the surface of the zinc-based material. | 05-15-2014 |
20140159212 | STACKED TYPE POWER DEVICE MODULE - The disclosure relates to a stacked type power device module. May use the vertical conductive layer for coupling the stacked devices, the electrical transmission path may be shortened. Hence, current crowding or contact damages by employing the conductive vias or wire bonding may be alleviated. | 06-12-2014 |
20140374629 | POWER MODULE FOR HIGH/LOW VOLTAGE INSULATION - A power module for high/low voltage insulation is provided. The power module includes a first substrate, a second substrate and an insulating substrate. The first substrate includes a first control circuit and a light source, wherein the first control circuit controls the light source to emit light. The second substrate includes a light-sensing part, a second control circuit and a power device. The light-sensing part receives the light of the light source of the first substrate to send a sensing information. The second control circuit correspondingly drives the power device in accordance with the sensing information. The insulating substrate is disposed between the first substrate and second substrate. | 12-25-2014 |
Patent application number | Description | Published |
20110045772 | TRIGGERING CONTROL DEVICE AND METHOD THEREOF - A triggering control device for enabling a data collection host assembled on it to execute a corresponding function action comprises a Bluetooth communication module, a control module, a power supply module and a housing containing the foregoing components. The Bluetooth communication module for communicating the triggering control device is controlled by the control module to drive the Bluetooth communication module to output a triggering signal, and the data collection host is enabled while receiving the triggering signal. Thereby, the triggering control device enables the data collection host to proceed a functional action by the Bluetooth communication module, so as to solve the contact fault or interference problem of the prior art. | 02-24-2011 |
20110046962 | VOICE TRIGGERING CONTROL DEVICE AND METHOD THEREOF - A voice triggering control device for enabling a data collection host which assembled on it comprises a processing unit, a speaker, a control module, a power supply module and a housing containing the elements disclosed above. The control device controls the processing unit to output a high-frequency audio signal which is corresponded to an act command Then, broadcasting a high-frequency audio through the speaker, wherein the high-frequency audio is generated by the high-frequency audio signal, and the data collection host is enabled to perform the act command while receiving and decoding the high-frequency audio. Thereby, making the triggering control device enabling the data collection host proceed a functional action by the high-frequency audio can solve the contact fault problem in the prior art. | 02-24-2011 |
20110125292 | STARTING DEVICE OF ELECTRONIC PRODUCT AND METHOD THEREOF - In a starting device of an electronic product and a method thereof, the starting device includes a detecting unit for detecting a motion state of an external device and generating a detecting signal by a motion state, a keyboard unit for generating a key signal, a memory unit for storing parameters, and a processing unit. While the detecting signal and the key signal correspond to a starting signal, the processing unit starts to output the corresponding starting signal which can enable the electronic product to execute a function action according to the parameters. Thereby, a function action command can be executed by a combination of the detecting signal and the key signal, and it is capable of simplifying the operation procedure and improving the work efficiency. | 05-26-2011 |
Patent application number | Description | Published |
20100216232 | MAMMAL DEDICATED CELL LINE - A mammal dedicated cell line is provided, which is a HepG2 hepatocellular carcinoma cell line (HepG2/NF-kB/Luc/sr39tk)1_18 obtained by co-transformation with NF-kB/Luc and NF-kB/sr39tk. Firstly, a successfully transformed pNF-kB/Luc HepG2 cell is obtained. Then, a dedicated cell line sensitive to TPA and MTX is generated by experimental screening Next, a plasmid construct carrying pNF-kB/sr39tk genome is introduced into the dedicated cell line by means of Superfect protocol. Finally, a HepG2 cell line co-expressing NF-kB/Luc and NF-kB/sr39tk is screened with G418 and ZEOCIN, and transformation result is confirmed by luminescence and radio activity. The (HepG2/NF-kB/Luc/sr39tk)1_18 obtained is suitable to screen drug for treating liver cancer and examine these cells by bioluminescence imaging and nuclear medicine imaging. | 08-26-2010 |
20110097263 | KIT FORMULATION FOR THE PREPARATION OF IMMUNOLIPOSOME DRUG IN COMBINED BIMODALITY RADIOCHEMOTHERAPY - A kit formulation for the preparation of immunoliposome drug in combined chemotherapy and radionuclide therapy is disclosed, which consists: (1) a vial A containing proteins; (2) a vial B containing Traut's reagent; (3) a vial C containing DSPC, Cholesterol, mPEG-DSPE, Mal-DSPE-PEG and chemotherapy drug; (4) a vial D containing BMEDA, gluconate acetate, SnCl | 04-28-2011 |
20120295349 | MAMMAL DEDICATED CELL LINE FROM HUMAN HEPATOCELLULAR CARCINOMA CELL - A mammal dedicated cell line is provided, which is a HepG2 hepatocellular carcinoma cell line (HepG2/NF-kB/Luc/sr39tk)1_18 obtained by co-transformation with NF-kB/Luc and NF-kB/sr39tk. Firstly, a successfully transformed pNF-kB/Luc HepG2 cell is obtained. Then, a dedicated cell line sensitive to TPA and MTX is generated by experimental screening Next, a plasmid construct carrying pNF-kB/sr39tk genome is introduced into the dedicated cell line by means of Superfect protocol. Finally, a HepG2 cell line co-expressing NF-kB/Luc and NF-kB/sr39tk is screened with G418 and ZEOCIN, and transformation result is confirmed by luminescence and radio activity. The (HepG2/NF-kB/Luc/sr39tk)1_18 obtained is suitable to screen drug for treating liver cancer and examine these cells by bioluminescence imaging and nuclear medicine imaging. | 11-22-2012 |
Patent application number | Description | Published |
20090170103 | OLIGONUCLEOTIDE SEQUENCES AND DNA CHIP FOR IDENTIFYING FILAMENTOUS MICROORGANISMS AND THE IDENTIFICATION METHOD THEREOF - A DNA chip for identifying filamentous microorganisms, including a substrate and a plurality of probes, wherein the probe includes SEQ ID No.1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, complementary sequences thereof, derivatives thereof or combinations thereof. The derivative is 5′ and/or 3′ end of the sequence SEQ ID No. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or 16 with at least one thymidine residue added or is 5′ and/or 3′ end of the sequence SEQ ID No. 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15 or 16 with one or two nucleotides added or deleted. | 07-02-2009 |
Patent application number | Description | Published |
20090068373 | Novel synergistic process and recipe for fabrication of a high integrity membrane electrode assembly of solid oxide fuel cell - A recipe and two sequential processes for fabrication of electrode substrates of solid oxide fuel cells (SOFCs) are described in this invention. The typical recipe consists of 50˜86 wt % electrolyte (8YSZ) or 50˜80 wt % anode electrode (NiO/8YSZ), 12˜22 wt % MEK (solvent 1), 5˜9 wt % EtOH (solvent 2), 1˜2 wt % TEA (dispersant), 0.5˜2 wt % DBP (plasticizer 1), 0.5˜2 wt % PEG (plasticizer 2), 3˜6 wt % PVB (binder), and 0.1˜10 wt % graphite (pore former). Two sequential processes include: 1. The process for preparation of the green tape slurry from materials of the recipe, 2. The synergistic process for fabrication of a high integrity membrane electrode assembly (MEA) of SOFC from the prepared electrode substrates. | 03-12-2009 |
20090151850 | Process for fabrication of a fully dense electrolyte layer embedded in membrane electrolyte assembly of solid oxide fuel cell - This invention describes the process for fabrication of a fully dense electrolyte layer (8YSZ/GDC/LSGM) embedded in a high performance membrane electrolyte assembly (MEA) (Unit Cell) of Solid Oxide Fuel Cell. An air-tight electrolyte layer (8YSZ/GDC/LSGM) is mainly prepared via tape casting technique and modified by thin film technologies, such as sputtering coating, spin coating, plasma spray/Coating etc., as well as combined with the sintering scheme and operation control. The gas permeability of electrolyte layer is less than 1×10 | 06-18-2009 |
20090166186 | Novel process for fabrication of a sputter deposited fully dense electrolyte layer embedded in a high performance membrane electrolyte assembly of solid oxide fuel cell - The innovation process describes the process and results for fabrication of a magnetron sputter deposited fully dense electrolyte layer (8YSZ/GDC/LSGM) embedded in a high performance membrane electrolyte assembly (MEA) (Unit Cell) of Solid Oxide Fuel Cell. A single cell with airtight electrolyte layer (8YSZ/GDC/LSGM) is prepared via thin film technique of magnetron sputter deposition, combined with SOFC-MEA processing methods (such as tape casting, lamination, vacuum hot pressing, screen printing, spin coating, and plasma spray coating) and sintering optimization conditions. The gas permeability of the electrolyte layer is below 1×10 | 07-02-2009 |
20090166907 | Innovation process for anode treatment of solid oxide fuel cell - membrane electrode assembly to upgrade power density in performance test - This invention describes the process for fabrication of a high conductivity and low resistance solid oxide fuel cell. An anode substrate is mainly prepared via tape casting technique and modified by abrasion and polish process. Electrolyte is fabricated onto the polished side by thin film technologies and can attach well in the cross section. Grinding surface of anode side about 10-30 μm after finish of MEA combination can get a high conductivity and low resistance unit cell and enhance cell performance effectively. | 07-02-2009 |
20090166908 | Innovation control process for specific porosity/gas permeability of electrode layers of SOFC-MEA through combination of sintering and pore former scheme and technology - An innovation scheme and technology used for controlling porosity/gas permeability of electrode layers of SOFC-MEA through combination of pore former and sintering manipulations. The porosity of electrode layer is 0-35 vol. %, and the gas permeability of electrode layer is 1×10 | 07-02-2009 |
20100018036 | Formulation of nano-scale electrolyte suspensions and its application process for fabrication of solid oxide fuel cell-membrane electrode assembly (SOFC-MEA) - This invention describes the recipe and preparation process of nano-scale electrolyte suspension and its application via a spin coating process for fabrication of airtight/fully dense electrolyte layers composed in solid oxide fuel cell-membrane electrode assembly with high performance characteristics. The recipe of nano-scale electrolyte suspension includes 10˜50 wt % nano-scale electrolyte powder, 0.01˜1 wt % poly acrylic acid (PAA as dispersant), 0.1˜5 wt % poly vinyl alcohol (PVA as binder), 0.005˜1 wt % octanol as defoamer, and deionized water as solvent. Solid oxide fuel cell fabricated via this recipe and process exhibits that the open-circuit voltage (OCV) is over 1 Volt, and maximum power density is 335 mW/cm | 01-28-2010 |
20110130267 | Process to Produce Fine Ceramic Powder through a Chemical Reactor with Powder Collection Device - The present invention is related to producing fine nano or submicron-scale precision ceramic powder by applying an innovative chemical reactor with powder collection to the glycine-nitrate combustion process (GNC-P). The unique feature lies in the utilization of a simple-operating process to massively produce nano or submicron-scale ceramic oxide powder with multiple metal components. The present invention not only provides very high powder collection efficiency and production yield as well as safety but also satisfies requirements of industrial safety and environmental safety, and lowers production cost. | 06-02-2011 |
20110221450 | MEASUREMENT PROCESS FOR DETERMINATION OF THE OPTIMUM CONTACT PRESSURE AMONG COMPONENTS OF A SOLID OXIDE FUEL CELL STACK IN THE PACKAGING PROCESS AND ITS MEASUREMENT APPARATUS - The present invention provides a measurement process for determination of the optimum contact pressure among components of a solid oxide fuel cell stack in the packaging process in order that the reduction in performance caused by the packaging process can be reduced. The present invention also provides a measurement apparatus which can carry the measurement process out. | 09-15-2011 |
20120115067 | PROCESS AND APPARATUS OF CO2 ENERGY SOURCE ADOPTED IN SOLID OXIDE FUEL CELL - CO2 ENERGY CONVERSION CYCLE - A process and apparatus of “Solid Oxide Fuel Cell (SOFC)-CO | 05-10-2012 |
20130230791 | Current collection apparatus and method of processing for a solid oxide fuel cell thereof - A current collection apparatus and its method of processing for a solid oxide fuel cell, which mainly includes using screen printing process to print conductive adhesive onto the surface of the electrode of solid oxide fuel cell (SOFC), forming a current collection layer with drying process, using an appropriate amount of conductive adhesive to paste a conductive wire onto the current collection layer, forming an adhesion layer through drying, fixing the conductive wire on the electrode surface with an appropriate amount of ceramic adhesive, and forming a fixing layer after baking. A good connection is hence made between metal conductive wire and electrode through current collection layer, not only the interface impedance between electrode and current collection layer can be reduced effectively, but also the output power density of the SOFC unit cell can be enhanced, and stable as well as long term power output can be provided. | 09-05-2013 |
Patent application number | Description | Published |
20090167564 | PARKING GUIDANCE DEVICE AND METHOD THEREOF - A parking guidance device storing the information of length and width of a car is disclosed, which comprises: a central controller, a distance detector electrically connecting to said central controller for detecting the distances from obstacles, an image detector electrically connecting to said central controller for detecting the shape of a parking space, a two-axis rotating detector electrically connecting to said central controller for detecting the direction of said car, a human-machine operation interface electrically connecting to said central controller for inputting signals, and a car controller area network bus interface electrically connecting to said central controller for controlling wheel, engine and braking system, wherein said central controller integrates the information of distances and shape of said parking space, compares the same to the information of length and width of said car to gain a parking track, and makes the moving track of said car correspond with said parking track by controlling wheel, engine and braking system through the car controller area network bus interface. | 07-02-2009 |
20100085427 | IMAGE-BASED VEHICLE MANEUVERING ASSISTANT METHOD AND SYSTEM - An image-based vehicle maneuvering assistant method and system are provided in the present invention, in which images captured by a single image sensing device is processed to determine the changes with respect time by a controller having capability of image processing and identification and distance estimation in image space for providing a complete assisting image-information while the carrier is maneuvering. By means of the presented method of the presented invention, the system is capable of generating track of the carrier, view point transformation, and identifying the characteristic object in the image so as to performing the distance estimation. The present invention may be utilized and applied in different kinds of carrier type to solve the problem of guiding of carrier maneuvering, and assist the carrier lane changing, parking assistance and blind spot detection. | 04-08-2010 |
20120249791 | ADAPTIVE SURROUNDING VIEW MONITORING APPARATUS AND METHOD THEREOF - An adaptive surrounding view monitoring apparatus and a method thereof are disclosed, in which the apparatus uses a steerable camera set to take horizontal images while sending the horizontal images to a control unit where they are combined into an image of 180-degree or 360-degree surrounding view. It is noted that the surrounding view image maybe an image of front surrounding view, an image of rear surrounding view or an image of ambient surrounding view relating to a vehicle, and using that, visual blind spot of a driver driving the vehicle can be eliminated and the field of vision is widened, and thereby, the probability of accident occurring is reduced. | 10-04-2012 |
20130120576 | IMAGE-BASED VEHICLE MANEUVERING ASSISTANT METHOD AND SYSTEM - An image-based vehicle maneuvering assistant method and system are provided in the present invention, in which images captured by a single image sensing device is processed to determine the changes with respect time by a controller having capability of image processing and identification and distance estimation in image space for providing a complete assisting image-information while the carrier is maneuvering. By means of the presented method of the presented invention, the system is capable of generating track of the carrier, view point transformation, and identifying the characteristic object in the image so as to performing the distance estimation. The present invention may be utilized and applied in different kinds of carrier type to solve the problem of guiding of carrier maneuvering, and assist the carrier lane changing, parking assistance and blind spot detection. | 05-16-2013 |
Patent application number | Description | Published |
20100311351 | TRANSMITTING DEVICE AND METHOD FOR DETERMINING TARGET PREDISTORTION SETTING VALUE - The present invention provides a transmitting device and a method for determining a target predistortion setting value. The transmitting device comprises: a setting value control unit, a predistortion unit, a transmitting circuit, a receiving circuit, and a determining unit. The present invention can predistort signals before a power amplifier in a transmitting device by a method of determining a target predistortion setting value (i.e. an optimal predistortion setting value) from a plurality of candidate predistortion setting values. In this way, signals outputted by the power amplifier in the transmitting device can be adjusted to an optimal state, so as to solve the distortion problem of the outputted signals of the power amplifier. | 12-09-2010 |
20100311360 | TRANSMITTER, METHOD FOR LOWERING SIGNAL DISTORTION, AND METHOD FOR GENERATING PREDISTORTION PARAMETERS UTILIZED TO LOWER SIGNAL DISTORTION - A transmitter includes a predistortion calculation unit, a transmitting circuit, a receiving circuit, an adjusting unit and a parameter generating and storing unit. The predistortion calculation unit is utilized for pre-distorting an input signal to generate a predistorted input signal according to a specific predistortion parameter. The transmitting circuit is utilized for processing the predistorted input signal to generate an output signal. The receiving circuit is utilized for receiving the output signal to generate a received signal. The adjusting unit is utilized for adjusting the received signal to generate an adjusted signal, where the adjusted signal is substantially equal to the input signal. The parameter generating and storing unit is utilized for generating the specific predistortion parameter, and updating at least one stored predistortion parameter according to the input signal and the adjusted signal. | 12-09-2010 |
20120230451 | DC OFFSET ESTIMATION DEVICE AND DC OFFSET ESTIMATION METHOD - A direct current (DC) offset estimation device includes a determining circuit and an estimation circuit. The determining circuit is arranged for comparing a plurality of bits of an access code in a packet with a first predetermined value, respectively, and accordingly generating a determining result. The estimation circuit is coupled to the determining circuit, for estimating a DC offset according to the determining result. | 09-13-2012 |
20130215999 | METHOD FOR COMPENSATING MISMATCH OF IN-PHASE SIGNAL AND QUADRATURE SIGNAL OF TRANSMITTER/RECEIVER - A method for compensating mismatches of an in-phase signal and a quadrature signal of a transmitter/receiver is provided. The method includes: receiving a plurality of test signals to generate two groups of factors, respectively, where each group of factors is applied to two multipliers utilized for compensating a gain mismatch and a phase mismatch of the in-phase signal and the quadrature signal of the transmitter/receiver; then calculating a delay mismatch of the in-phase signal and the quadrature signal according to the two groups of factors. | 08-22-2013 |
20140016690 | Method of Reducing Signal Imbalance in Wireless Communication System - Multiplier coefficients are updated according to minimal power value of mixed signals in a wireless communication system. While using updated multiplier parameters, signal imbalance caused by a local oscillator or mismatch between analog elements of the wireless communication system can be reduced, so that the wireless communication system can be immune from noises. | 01-16-2014 |
20140018029 | Method of Compensating Signal Imbalance of Wireless Communication System - Filter coefficients are generated by testing a wireless communication system using single-tone signals. While using the filter coefficients in a filter module, signal imbalance caused by a local oscillator or analog elements in a wireless communication system can be eliminated, so as to prevent the wireless communication system from being affected by the noises. | 01-16-2014 |
20140307765 | WIRELESS TRANSMISSION SYSTEM, AND METHOD FOR DETERMINING DEFAULT GAIN OF WIRELESS TRANSMISSION SYSTEM - A method for determining a default gain of a wireless transmission system is provided. The wireless transmission system includes a signal transmission path and a signal feedback path coupled to the signal transmission path. The signal transmission path includes a power amplification circuit and a gain stage having a plurality of transmission gains. The method includes the following step: setting a gain of the gain stage as a specific transmission gain of the transmission gains; transmitting a plurality of test signals through the signal transmission path in sequence to generate a plurality of amplified test signals, wherein at least a portion of powers of the test signals correspond to the transmission gains, respectively; receiving the amplified test signals through the signal feedback path in sequence, and accordingly obtaining corresponding signal gains; and determining a default gain of the gain stage according to the signal gains. | 10-16-2014 |
20150015328 | PRE-DISTORTION METHOD AND ASSOCIATED APPARATUS AND NON-TRANSITORY MACHINE READABLE MEDIUM - A pre-distortion method includes: receiving an input data; and obtaining a pre-distorted output by inputting the input data into a pre-distortion function, wherein the pre-distortion function is determined according to a power amplifier. A pre-distortion apparatus includes a receiver and a pre-distortion unit. The receiver is utilized for receiving an input data. The pre-distortion unit is utilized for obtaining a pre-distorted output by inputting the input data into a pre-distortion function, wherein the pre-distortion function is determined according to a following power amplifier. A non-transitory machine readable medium stores a program code executed for performing steps of the proposed pre-distortion method. | 01-15-2015 |
20150054585 | PRE-DISTORTION METHOD, ASSOCIATED APPARATUS AND NON-TRANSITORY MACHINE READABLE MEDIUM - A pre-distortion method includes: receiving an input data; and obtaining a pre-distortion output by inputting the input data into a pre-distortion function, wherein the pre-distortion function is determined according to a following power amplifier; and multiplying a reciprocal of a pre-distortion ratio of the output of the power amplifier to the input data by the output of the power amplifier. A pre-distortion apparatus includes a receiver, a pre-distortion unit and a gain compensating unit. The receiver is utilized for receiving an input data. The pre-distortion unit is utilized for obtaining a pre-distortion output by inputting the input data into a pre-distortion function, wherein the pre-distortion function is determined according to a following power amplifier. The gain compensating unit is utilized for multiplying a reciprocal of a pre-distortion ratio of the output of the power amplifier to the input data by the output of the power amplifier. | 02-26-2015 |