Patent application number | Description | Published |
20130182368 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T | 07-18-2013 |
20130182369 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T | 07-18-2013 |
20130250478 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a dielectric composition, including: a base powder including Ba | 09-26-2013 |
20130280158 | METHOD OF PRODUCING COPPER PRECURSOR AND COPPER PRECURSOR PRODUCED BY USING THE SAME - There is provided a method of producing a copper precursor and a copper precursor produced by using the same. The method of producing a copper precursor includes: preparing an aqueous solution including a copper salt or a hydrate thereof; preparing a mixture by mixing urea (CO(NH | 10-24-2013 |
20130294006 | CONDUCTIVE RESIN COMPOSITION, MULTILAYER CERAMIC CAPACITOR HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners. | 11-07-2013 |
20140022692 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied. | 01-23-2014 |
20140022698 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There is provided a laminated ceramic electronic component, including a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein when a value of 1% is set to be D1, a value of 50% is set to be D50, and a value of 99% is set to be D99 in a cumulative distribution of dielectric grains by an average particle diameter thereof within the dielectric layer, 2≦D99/D50≦3 and 2≦D50/D1≦3 are satisfied. A high-capacity laminated ceramic electronic component may be implemented with improved adhesion between the dielectric layer and the internal electrode, and improved withstand voltage characteristics and excellent reliability may be implemented. | 01-23-2014 |
20140116766 | MULTILAYERED CHIP ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There is provided a multilayered chip electronic component including: a ceramic body including internal electrodes and dielectric layers; external electrodes covering both end surfaces of the ceramic body in a length direction; first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body; non-conductive layers formed on outer side surfaces of the first plating layers; and second plating layers formed on regions of the first plating layers except for the non-conductive layers. | 05-01-2014 |
20140185183 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - There is provided a multilayer ceramic capacitor, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; a first external electrode electrically connected to the first internal electrodes; and a second external electrode electrically connected to the second internal electrodes, wherein the dielectric layer includes 40 to 99 wt % of barium titanate (BaTiO | 07-03-2014 |
20140233148 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t08-21-2014 | |
20140233149 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by T | 08-21-2014 |
20140268485 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40, and 2≦c≦25 are satisfied. | 09-18-2014 |
20140268492 | BARIUM CALCIUM TIN TITANATE POWDER, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR - There is provided a dielectric composition containing barium calcium tin titanate powder composed of (Ba | 09-18-2014 |
20150027765 | NICKEL POWDER FOR INTERNAL ELECTRODES, MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME, AND CIRCUIT BOARD HAVING ELECTRONIC COMPONENT MOUNTED THEREON - There is provided a nickel powder for internal electrodes satisfying the following equation: 0.8≦b*D*ρ/6≦1.0 wherein a specific surface area of the nickel powder is defined as b, an average particle size of the nickel powder is defined as D, and a density of the nickel powder is defined as ρ. | 01-29-2015 |