Patent application number | Description | Published |
20080217793 | METHOD AND DEVICE INCLUDING REWORKABLE ALPHA PARTICLE BARRIER AND CORROSION BARRIER - A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate. | 09-11-2008 |
20090145973 | STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION APPLICATIONS - A tamper resistant, integrated circuit (IC) module includes a ceramic-based chip carrier; one or more integrated circuit chips attached to a top surface of the chip carrier; a ceramic-based cap structure attached to the top surface of the chip carrier, and covering the one or more integrated circuit chips; and a conductive grid structure embedded within the chip carrier and the cap structure, the conductive grid structure having a plurality of meandering lines disposed in an x-direction, a y-direction, and a z-direction; wherein the conductive grid structure is configured so as to detect an attempt to penetrate the IC module. | 06-11-2009 |
20090184407 | METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCRETE COMPONENTS - Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate. | 07-23-2009 |
20120217986 | MODULE ASSEMBLY HOLDING WORKBOARD - A module assembly holding workboard is provided and includes a base having a central portion to support a computing module, a first wing at a first side of the central portion to support a first adapter and a second wing at a second side of the central portion to support a second adapter, the first and second adapters being coupled to the computing module via first and second conductive elements and a plurality of routing channel elements fixedly disposed at the first and second wings to retain the first and second conductive elements. | 08-30-2012 |
20130233598 | FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF - A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection. | 09-12-2013 |
20140203945 | VALIDATION OF MECHANICAL CONNECTIONS - A connection validation apparatus includes a connector engagement mechanism configured to physically engage a connector to connect the connector to a connector interface. The apparatus further includes a connection indication detector located on the connector engagement mechanism and configured to detect at least one of a sound and a vibration corresponding to a secure connection of the connector with the connector interface. The apparatus also includes a connection indicator output unit configured to provide an indication to a user that the connector is securely connected with the connector interface based on the detection of the at least one of the sound and the vibration by the connection indication detector. | 07-24-2014 |
20150033556 | FLEXIBLE FILM CARRIER TO INCREASE INTERCONNECT DENSITY OF MODULES AND METHODS THEREOF - A flexible film carrier and methods of manufacture, and more particularly, methods and structures to increase interconnect density of modules onto circuit boards is discloses. The structure includes a substrate comprising a plurality of holes and a plurality of contacts having a pitch corresponding to a pitch of I/O connections of a laminate. The structure further includes at least one type of connection provided on the substrate and which is positioned so as to avoid interference with a connection of the laminate to a circuit board. The structure further includes wiring electrically connecting the plurality of contacts to the at least one type of connection. | 02-05-2015 |
20160070061 | LASER DIE AND PHOTONICS DIE PACKAGE - A multi semiconductor device package includes a laser die and a photonics die. The laser die generates light and includes a laser facet that emits light from a light emitting surface. The photonics die modulates light emitted from the laser light emitting surface and includes a device side cavity that exposes an embedded waveguide optically connected with the laser facet. A laser die and photonics die attachment method includes positioning a device side of the laser die relative to a device side of the photonics die, engaging an alignment feature of the photonics die with an alignment feature of the laser die, installing the laser die within a device side recess of photonics die, electrically connecting the laser die with the photonics die, and optically connecting a laser facet of the laser die with an embedded waveguide of the phonics die. | 03-10-2016 |