Patent application number | Description | Published |
20080252172 | ACOUSTIC STACK FOR ULTRASONIC TRANSUCERS AND METHOD FOR MANUFACTURING SAME - An acoustic stack for ultrasonic transducers comprising a backing block, flexible printed circuit board, piezoelectric ceramic layer, and acoustic matching layer. The various components of the acoustic stack are bonded together using an adhesive material and high pressure in a lamination process. The piezoelectric ceramic layer is manufactured to provide electrical and acoustic isolation without the need for dicing through multiple layers of the acoustic stack. A flex circuit provides the necessary electrical connections to the electrically isolated electrodes of the piezoelectric ceramic layer. | 10-16-2008 |
20080315462 | SYSTEMS AND METHODS FOR MONITORING A COMPOSITE CURE CYCLE - A system for monitoring at least one of a resin infusion process and a composite cure cycle of a composite article is provided. The system includes an ultrasonic transmitter configured to deliver an acoustic wave to a resin-infused fiber preform and an ultrasonic receiver configured to receive the acoustic wave propagated through the resin-infused fiber preform. The system also includes a processor configured to estimate at least one parameter using the received acoustic wave and to use the at least one parameter to determine an extent to which at least one resin has infused into the resin-infused fiber preform. | 12-25-2008 |
20090107632 | ADHESIVE COMPOSITIONS FOR HIGH TEMPERATURE SENSORS AND METHODS OF MAKING THE SAME - An adhesive composition is provided which effectively bonds a sensor to a surface having a temperature up to approximately 250° C. The adhesive composition comprises an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin. The invention also provides a method of preparing an adhesive composition comprising blending an epoxy resin and a latent cationic cure catalyst effective to cure the epoxy resin, wherein the composition is capable of effectively bonding a sensor to a surface having a temperature up to approximately 250° C. The invention further provides a method of bonding a sensor to a surface comprising the steps of applying an adhesive composition to a first surface of the sensor or to a surface area of an object to be monitored, the adhesive composition comprising an epoxy compound and a latent cationic cure catalyst effective to cure the epoxy resin. The first surface of the sensor is contacted with the surface area of the object whereby the adhesive composition is located therebetween, and wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. | 04-30-2009 |
20090110845 | METHODS FOR BONDING HIGH TEMPERATURE SENSORS - The invention provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a first surface of the sensor. The first surface of the sensor is contacted with a surface of an object to be monitored, wherein the composition effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. The invention also provides a method of bonding a sensor to a surface comprising the steps of applying a thermoplastic film to a surface area of an object to be monitored. The first surface of a sensor is contacted with the object surface area, wherein the film effectively bonds the sensor to the object surface at a temperature up to approximately 250° C. | 04-30-2009 |
20090199392 | ULTRASOUND TRANSDUCER PROBES AND SYSTEM AND METHOD OF MANUFACTURE - A method for fabricating an ultrasound transducer structure is disclosed. The method includes performing the steps of forming a functional layer, including an ultrasound transducer material and a photopolymer, and exposing a plurality of selected regions of the functional layer to a programmable light pattern to cure the selected regions of the functional layer to form polymerized ultrasound transducer material regions, repeatedly. The method further includes selectively removing unexposed regions of the functional layer to obtain a green component, and sintering the green component to obtain the sensing structure. A system for making at least one piezoelectric element is also disclosed. | 08-13-2009 |
20100126277 | SYSTEMS AND METHODS FOR INSPECTING AN OBJECT USING ULTRASOUND - An ultrasound inspection system is provided for inspecting an object. The inspection system includes an ultrasound probe configured to scan the object and acquire a plurality of ultrasound scan data. The inspection system further includes a processor coupled to the ultrasound probe and configured to apply a transfer function to the ultrasound scan data to compensate for distortion of a plurality of ultrasound signals through the object and thereby generate a plurality of compensated ultrasound scan data, and to process the compensated ultrasonic scan data to characterize a feature in the object. | 05-27-2010 |
20100147080 | ULTRASONIC TRANSDUCER - An ultrasonic transducer comprises a transmitting element for transmitting an ultrasonic signal at a fundamental frequency and a receiving element adaptable for multiple receive water path operations and for receiving ultrasonic signals at the fundamental frequency and harmonics of the fundamental frequency. | 06-17-2010 |